• Korea Journal of Hospital Management
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• v.6 no.3
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• pp.90-108
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• 2001

This research examines the compensation package maximizing the utilities of internal customers by applying the market segmentation theory. Data were collected from four Korean hospitals in Seoul, Pusan and Kyunggi-do. The research is designed to seek the compensation package maximizing the utility of doctors and nurses by applying the market segmentation theory. The compensation package for doctors and nurses was classified into 5 attributes which are level of salary, payment method, education, promotion, reward method. The test results were as follows. First, the relative importance of each attribute in the compensation package is different. The level of salary is the most important, reward method is the next. Second, the utility of doctors increases by 8.7%, when they are segmented on the basis. of their preference for compensation attributes while that of nurses increases by 39.8%. The results of this study imply that the utility of doctors and nurses increases with differentiated compensation package for internal customer segmented by their preference.

• Proceedings of the KIEE Conference
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• 2004.07d
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• pp.2568-2570
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• 2004

CEMTool is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new FEM (Finite Element Method) package in CEMTool environment. In contrast to the existing MATLAB PDE Toolbox, our proposed FEM package can deal with the combination of the reserved words. Also, we can control the mesh in a very effective way With the introduction of new mesh generation algorithm and NDM (Hosted Dissection Method), our FEM package can guarantee the shorter computational time than MATLAB PDE Toolbox. In addition, using the advanced electromagnetics library of CEMTool FEM package, we can analyze the practical problems such as the motor field analysis. Consequently, with our new FEM package, we can overcome some disadvantages of the existing MATLAB PDE Toolbox.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.4
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• pp.61-70
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• 1998

The electrical performance of a package is extremely important for high speed digital system operations. CSP(chip scale package) is known to have better electrical performance than the convnetional packages. In this paper, the electrical performance of the BLP(bottom leaded plastic) package, a kind of CSP, has been alayzed by both simulation and real measurement. The electrical perfdormance of a BLP was compared with that of the conventioanl TSOP(thin small outline package). The leadinductanceand lead capacitance were used for the comparison purposes. The new BLP design provides much better electrical performance that TSOP package. It has about 40% favorable parameter values.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.43-50
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• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

• Journal of Mechanical Science and Technology
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• v.18 no.3
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• pp.357-369
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• 2004

The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1027-1032
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• 2003

Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $Moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for a single-sided package assembly and a double-sided package assembly are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one. The largest of effective strain occurred in the solder ball located at the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.2
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• pp.79-83
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• 2016

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.25-32
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• 2012

Package for artificial satellite is to produce mass production for high package with reliability certification as well as develop SDRAM (synchronous dynamic RAM) module which has such as miniaturization, mass storage, and high reliability in space environment. It requires sophisticated technology with chip stacking or package stacking in order to increase up to 4Gbits or more for mass storage with space technology. To make it better, we should secure suitable processes by doing design, manufacture, and debugging. Pin type PCB substrate was then applied to QFP-Pin type 3D memory package fabrication. These results show that the 3D memory package for artificial satellite scheme is a promising candidate for the realization of our own domestic technologies.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1141-1144
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• 1998

A new design methodology for the shortchannel CMOS IC-package is presented. It is developed by representing the package inductance with an effective lumpedinductance. The worst case maximum-simultaneous-switching noise (SSN) and gate propagation delay due to the package are modeled in terms of driver geometry, the maximum number of simultaneous switching drivers, and the effective inductance. The SSN variations according to load capacitances are investigated with this model. The package design techniques based on the proposed guidelines are verified by performing HSPICE simulations with the $0.35\mu\textrm{m}$ CMOS model parameters.

• Journal of Information Technology Services
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• v.8 no.2
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• pp.1-22
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• 2009

Recently, improving service quality for customer satisfaction is one of the most important issues and the task for the growth of company. Furthermore, plenty studies are going on progress to develop service quality in IT industry. There have been so many researches of product quality on package software but yet the service quality of package software has been rarely studied before. Thus, the purpose of this study is to formulate a scheme on how to enhance the competitivity of package software company by analyzing the impacts of these two factors on the customer satisfaction, Word-of-Mouth intention and the reuse intention. The study models have been designed and the hypotheses have been made through the examination of the precedent literature about package software product and service quality. A questionnaire survey was performed to collect information, and the unit of analysis was a person who used package software. This study used the statistical technique such as regression analysis. This study may be utilized as basic data for building marketing strategies when package software companies offer service to customers.