• 제목/요약/키워드: p-n Junction

검색결과 427건 처리시간 0.026초

Ti Self-Aligned Silicide를 이용한 Contact에서의 전기적 특성 (Electrical Characteristics of Ti Self-Aligned Silicide Contact)

  • 이철진;허윤종;성영권
    • 대한전기학회논문지
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    • 제41권2호
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    • pp.170-177
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    • 1992
  • Contact resistance and contact leakage current of the Al/TiSiS12T/Si system are investigated for NS0+T and PS0+T junctions. SALICIDE (Self Aligned Silicide) process was used to make the Al/TiSiS12T/Si system. Titanium disilicide is one of the most common silicides because of its thermal stability, ability to form selective formation and low resistivity. In this paper, RTA temperature effect and Junction implant dose effect were evaluated to characterize contact resistance and contact leakage current. The TiSiS12T contact resistance to NS0+T silicon is lower than that to PS0+T silicon, and TiSiS12T of contact leakage current to NS0+T silicon is lower than that to PS0+T silicon. Contact resistance and contact leakage current of the Al/TiSiS12T/Si system by this method were possible for VLSI application.

Enhanced optical output power of AlGaN/GaN ultraviolet light-emitting diodes fabricated with breakdown induced conductive channels

  • Seonghoon Jeong;Sung-Nam Lee;Chel-Jong Choi;Hyunsoo Kim
    • Journal of Ceramic Processing Research
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    • 제21권
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    • pp.23-27
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    • 2020
  • The enhanced optical output power of AlGaN/GaN deep ultraviolet light-emitting diodes (UV LEDs) were demonstrated by using the breakdown-induced conductive channels (BICCs). The BICCs could be made by electrical reverse biasing between two adjacent contact pads formed on top p-type layers with a certain distance, causing an electrical breakdown of pn junction and hence a generation of conductive channels. Accordingly, the reflective Ni/Ag/Pt electrodes could be formed simultaneously on the top p-type layer and the other p-type layer with the BICCs, acting as the p- and n-contacts, respectively. The deep UV LEDs fabricated with the BICCs produced the enhanced optical output power by 15 % as compared to the reference LEDs, which were fabricated with the conventional Ti/Al/Ti/Au layers formed on mesa-etched n-type layer. This could be due to the reduced light absorption at the n-contact pads, indicating that the use of BICCs will be very suitable for obtaining better output performance of deep UV emitters.

전자와 양성자를 조사한 PN 다이오드의 turn-on/turn-off transient 특성 비교 (Comparison of turn-on/turn-off transient in Electron Irradiated and Proton Irradiated Silicon pn diode)

  • 이호성;이준호;박준;조중열
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 D
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    • pp.1947-1949
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    • 1999
  • Carrier lifetime in silicon power devices caused switching delay and excessive power loss at high frequency switching. We studied transient turn-on/turn-off transient characteristics of electron irradiated and proton irradiated silicon pn junction diodes. Both the electron and proton irradiation of power devices have already become a widely used practice to reduce minority carrier lifetime locally[1]. The sample is n+p junction diode, made by ion implantation on a $20\Omega.cm$ p-type wafer. We investigated turn-on/turn-off transient & breakdown voltage characteristics by digital oscilloscope. Our data show that proton irradiated samples show better performance than electron irradiated samples.

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Doping된 Ⅲ-Ⅴ族 化合物 半導體 界面에서 空間電荷效果 (Space Charge Effects at Doped Ⅲ-Ⅴ Compound Semiconductor Interfaces)

  • 천장호
    • 대한전자공학회논문지
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    • 제27권2호
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    • pp.93-97
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    • 1990
  • 도핑된 半導體 界面의 界面電荷 近似式과 構造를 提案하였다. III-V族 化合物 半導體인 p-GaP,p-InP,n-GaAs와 $C_sNO_3$ 水性 電解質 界面에서 整流現象은 循環電流-電壓特性으로 定性的 解析을 하였다. 半導體 界面의 電流-電壓 特性曲線, 이온 吸着과 電位障壁 過程은 連續循環電壓方法으로 實證하였다. 도핑된 半導體-電解質 界面에서 pn 또는 np 接合構造와 그에 따른 整流形은 空間電荷에 의하여 決定된다.

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A $32{\times}33$ Photo-elements MOS Image Sensor

  • Park, Sang-Sik;Park, Jeong-Ok;Lee, Jong-Duk
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(I)
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    • pp.411-415
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    • 1987
  • A $32{\times}33$ MOS-type area image sensor has been fabricated. The blooming current is reduced to 1/14 by forming +p photocell in P-well instead of a simple p-type substrate. A shallow n+ junction is made to improve the sensitivity of photodiode on short wavelength. Bootstrapping circuit technique is applied to obtain high speed dynamic shift register. The shift register operates at up to 10MHz for 7V clock.

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The Research of Deep Junction Field Ring using Trench Etch Process for Power Device Edge Termination

  • 김요한;강이구;성만영
    • 전기전자학회논문지
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    • 제11권4호
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    • pp.235-238
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    • 2007
  • 2차원 소자 시뮬레이터인 TMA 메디치를 이용하여 필드링와 깊은 접합 필드링에 대해 연구하였다. 이온 주입될 위치를 미리 트랜치 식각을 시킴으로써 항복전압 특성을 향상시킬 수 있었다. 시뮬레이션 결과 기존 필드링의 항복전압대비 깊은 접합 필드링 항복전압은 약 30%의 증가를 보였다. 깊은 접합 필드링은 같은 면적을 차지하는 조건하에서 설계 및 제작이 비교적 용이하고, 표면 전하의 영향도 적은 것으로 나타났다. 본 논문에서는 여러 분석을 통해 깊은 접합 필드링의 향상된 특성을 논하였다.

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Electroreflectance Study of CIGS Thin Film Solar Cells

  • Jo, Hyun-Jun;Jeon, Dong-Hwan;Ko, Byoung Soo;Sung, Shi-Joon;Bae, In-Ho;Kim, Dae-Hwan
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.415-415
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    • 2013
  • We have investigated the optical and electrical properties of the CIGS thin film solar cells by the electroreflectance (ER), photoreflectance (PR), photoluminescence (PL), and photocurrent (PC) spectroscopies at room temperature. The ER spectrum had two narrow signal regions and one broad signal region. We measured PL and PC to confirm the signals at low energy region (1.02~1.35 eV), so these signals are related to the CIGS thin film, and the high energy region (2.10~2.52 eV) is related to the CdS bandgap energy. The broad signal region (1.35~2.09 eV) is due to the internal electric field by the p-n junction from the comparison between PR and ER spectra, and we calculated the internal electric field by the p-n junction. In the high efficiency solar cell, the CdS signal of ER spectrum is narrower than the lower efficiency solar cells.

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CT-IGBT의 최적 설계 및 전기적 특성에 관한 분석 (An Analysis on Optimal Design and Electrical Characteristics of CT-IGBT(Circular Trench IGBT))

  • 곽상현;서준호;서인곤;성만영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.22-23
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    • 2008
  • The conventional IGBT has two problems to make the device taking high performance. The one is high on state voltage drop associated with JFET region, the other is low breakdown voltage associated with concentrating the electric field on the junction of between p base and n drift. This paper is about the structure to effectively improve both the lower on state voltage drop and the higher breakdown voltage than the conventional IGBT. For the fabrication of the circular trench IGBT with the circular trench layer, it is necessary to perform the only one wet oxidation step for the circular trench layer. Analysis on both the on state voltage drop and the Breakdown voltage show the improved values compared to the conventional IGBT structure. Because the circular trench layer disperses electric field from p base and n drift junction to circular trench, the breakdown voltage increase. The on state voltage drop decrease due to reduction of JFET region and direction change of current path which pass through reversed layer channel.

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