• Title/Summary/Keyword: p-n Junction

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The Gettering Effect of Boron Doped n-type Monocrystalline Silicon Wafer by In-situ Wet and Dry Oxidation

  • Jo, Yeong-Jun;Yun, Ji-Su;Jang, Hyo-Sik
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.429-429
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    • 2012
  • To investigate the gettering effect of B-doped n-type monocrystalline silicon wafer, we made the p-n junction by diffusing boron into n-type monocrystalline Si substrate and then oxidized the boron doped n-type monocrystalline silicon wafer by in-situ wet and dry oxidation. After oxidation, the minority carrier lifetime was measured by using microwave photoconductance and the sheet resistance by 4-point probe, respectively. The junction depth was analyzed by Secondary Ion Mass Spectrometry (SIMS). Boron diffusion reduced the metal impurities in the bulk of silicon wafer and increased the minority carrier lifetime. In the case of wet oxidation, the sheet resistance value of ${\sim}46{\Omega}/{\Box}$ was obtained at $900^{\circ}C$, depostion time 50 min, and drive-in time 10 min. Uniformity was ~7% at $925^{\circ}C$, deposition time 30 min, and drive-in time 10 min. Finally, the minority carrier lifetime was shown to be increased from $3.3{\mu}s$ for bare wafer to $21.6{\mu}s$ for $900^{\circ}C$, deposition 40 min, and drive-in 10 min condition. In the case of dry oxidation, for the condition of 50 min deposition, 10 min drive-in, and O2 flow of 2000 SCCM, the minority carrier lifetime of 16.3us, the sheet resistance of ${\sim}48{\Omega}/{\Box}$, and uniformity of 2% were measured.

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Review of Failure Mechanisms on the Semiconductor Devices under Electromagnetic Pulses (고출력전자기파에 의한 반도체부품의 고장메커니즘 고찰)

  • Kim, Dongshin;Koo, Yong-Sung;Kim, Ju-Hee;Kang, Soyeon;Oh, Wonwook;Chan, Sung-Il
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.6
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    • pp.37-43
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    • 2017
  • This review investigates the basic principle of physical interactions and failure mechanisms introduced in the materials and inner parts of semiconducting components under electromagnetic pulses (EMPs). The transfer process of EMPs at the semiconducting component level can be explained based on three layer structures (air, dielectric, and conductor layers). The theoretically absorbed energy can be predicted by the complex reflection coefficient. The main failure mechanisms of semiconductor components are also described based on the Joule heating energy generated by the coupling between materials and the applied EMPs. Breakdown of the P-N junction, burnout of the circuit pattern in the semiconductor chip, and damage to connecting wires between the lead frame and semiconducting chips can result from dielectric heating and eddy current loss due to electric and magnetic fields. To summarize, the EMPs transferred to the semiconductor components interact with the chip material in a semiconductor, and dipolar polarization and ionic conduction happen at the same time. Destruction of the P-N junction can result from excessive reverse voltage. Further EMP research at the semiconducting component level is needed to improve the reliability and susceptibility of electric and electronic systems.

Improving Device Efficiency for n-i-p Type Solar Cells with Various Optimized Active Layers

  • Iftiquar, Sk Md;Yi, Junsin
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.2
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    • pp.70-73
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    • 2017
  • We investigated n-i-p type single junction hydrogenated amorphous silicon oxide solar cells. These cells were without front surface texture or back reflector. Maximum power point efficiency of these cells showed that an optimized device structure is needed to get the best device output. This depends on the thickness and defect density ($N_d$) of the active layer. A typical 10% photovoltaic device conversion efficiency was obtained with a $N_d=8.86{\times}10^{15}cm^{-3}$ defect density and 630 nm active layer thickness. Our investigation suggests a correlation between defect density and active layer thickness to device efficiency. We found that amorphous silicon solar cell efficiency can be improved to well above 10%.

Fabrication and characterization of n-IZO / p-Si and p-ZnO:(In, N) / n-Si thin film hetero-junctions by dc magnetron sputtering

  • Dao, Anh Tuan;Phan, Thi Kieu Loan;Nguyen, Van Hieu;Le, Vu Tuan Hung
    • Journal of IKEEE
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    • v.17 no.2
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    • pp.182-188
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    • 2013
  • Using a ceramic target ZnO:In with In doping concentration of 2%, hetero-junctions of n-ZnO:In/p-Si and p-ZnO:(In, N)/n-Si were fabricated by depositing Indium doped n - type ZnO (ZnO:In or IZO) and Indium-nitrogen co-doped p - type ZnO (ZnO:(In, N)) films on wafers of p-Si (100) and n-Si (100) by DC magnetron sputtering, respectively. These films with the best electrical and optical properties were then obtained. The micro-structural, optical and electrical properties of the n-type and p-type semiconductor thinfilms were characterized by X-ray diffraction (XRD), RBS, UV-vis; four-point probe resistance and room-temperature Hall effect measurements, respectively. Typical rectifying behaviors of p-n junction were observed by the current-voltage (I-V) measurement. It shows fairly good rectifying behavior with the fact that the ideality factor and the saturation current of diode are n=11.5, Is=1.5108.10-7 (A) for n-ZnO:In/p-Si hetero-jucntion; n=10.14, Is=3.2689.10-5 (A) for p-ZnO:(In, N)/n-Si, respectively. These results demonstrated the formation of a diode between n-type thin film and p-Si, as well as between p-type thin film and n-Si..

The efficiency charateristics of intrinsic layer thickness dependence for amorphous silicon single junction solar cells (Intrinsic layer 두께 가변에 따른 단일접합 비정질 박막 태양전지의 효율 특성 변화)

  • Yoon, Ki-Chan;Kim, Young-Kook;Heo, Jong-Kyu;Choi, Hyung-Wook;Yi, Young-Suk;Yi, Jun-Sin
    • 한국신재생에너지학회:학술대회논문집
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    • 2009.06a
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    • pp.80-82
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    • 2009
  • The dependence of the efficiency characteristics of hydrogenated amorphous silicon single junction solar cells on the various intrinsic layer thickness has been investigate in the glass/$SnO_2$:F/p,i,n a-Si:H/Al type of amorphous silicon solar cells by cluster PECVD system. The open circuit voltage, short circuit current, fill factor and conversion efficiency have been measured under AM 1.5 condition. The result of the cell performance was improved about 8.2% due to an increase in the short circuit current.

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Down-Conversion Effect Applied to GaAs p-i-n Single Junction Solar Cell

  • Park, Jun-Seo;Kim, Ji-Hun;Go, Hyeong-Deok;Lee, Gi-Yong;Kim, Jeong-Hyeok;Han, Il-Gi
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.694-694
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    • 2013
  • With the growing need of more effective energy harvesting, solar energy has been sought as one of the prominent candidates among the eco-friendly methods. Although many types of solar cells have been developed, the electronic conversion efficiency is limited by the material's physical properties: solar cells can only harvest solar energy from limited range in solar energy spectrum. To overcome this physical limit, we approached by using the down conversion effect, transforming the high energy photons to low energy photons, to the range the designated solar cell can convert to electronic energy. In our study, we have fabricated GaAs single junction solar cells and applied CdSe quantum dots for down-conversion. We examine the effects of such application on the solar cell efficiancy, fill-factor, JSC, VOC, etc.

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Thermal Dissipation Characteristics of Multi-Chip LED Packages (멀티 칩 LED 패키지의 방열 특성)

  • Kim, Byung-Ho;Moon, Cheol-Hee
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.25 no.12
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    • pp.34-41
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    • 2011
  • In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package.

A Negative Curvature effect for breakdown voltage of lateral junction on SOI (SOI 수평형 접합의 항복 전압 향상을 인한 Negative Curvature(NC) 효과)

  • Byun, Dae-Seok;Choi, Yearn-Ik;Han, Min-Koo
    • Proceedings of the KIEE Conference
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    • 1993.11a
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    • pp.243-245
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    • 1993
  • The negative curvature effect on the breakdown voltage of p-n junction, which may realize 1-D breakdown voltage due to the lower peak electric field at the junction, is proposed and verified by the fabrication of lateral diode on Silicon-on-Insulator (SOI) together with MEDICI simulation. The experimental and simulation results show good agreements with the theoretical expectation. The proposed method is effectively applicable to the lateral, especially on SOI, power devices.

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Realization of p-type ZnO Thin Films Using Codoping N and Al by RF Magnetron Sputtering

  • Jin, Hu-Jie;So, Byung-Moon;Park, Bok-Kee;Park, Choon-Bae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.107-108
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    • 2006
  • ZnO is a promising material for UV or blue LEDs p-Type ZnO thin films which are imperative for the p-n junction of LEDs are difficult to achieve because of strong compensation of intrinsic defects such as zinc interstitial and oxygen vacancy. The method of codoping group three elements and group five elements is effective for the realization of p-type ZnO films. In this study, We codoped N and Al m ZnO thin films by RF magnetron sputtering and annealed the films in sputtering chamber. Some films showed p-type conductivity m Seeback effect measurement.

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