• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2005년도 춘계학술대회
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• pp.196-200
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• 2005

In this work, we investigated simple Aㅣ/TCO/a-Si:H(n)/c-Si(p)/Al hetero-junction solar cells prepared by low temperature processes, unlike conventional thermal diffused c-Si solar cells. a-Si:H/c-Si hetero-junction solar cells are processed by low temperature deposition of n-type hydrogenated amorphous silicon (a-Si:H) films by plasma-enhanced chemical vapor deposition on textured and flat p-type silicon substrate. A detailed investigation was carried out to acquire optimization and compatibility of amorphous layer, TCO (ZnO:Al) layer depositions by changing the plasma process parameters. As front TCO and back contact, ZnO:Al and AI were deposited by rf magnetron sputtering and e-beam evaporation, respectively. The photovoltaic conversion efficiency under AMI.5 and the quantum efficiency on $1cm^2$ sample have been reported. An efficiency of $12.5\%$ is achieved on hetero-structure solar cells based on p-type crystalline silicon.

• 대한전자공학회논문지
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• 제17권6호
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• pp.65-71
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• 1980

SRO2-Si 이종접합 태양전지소자틀 진공증착에 의하여 제작하여 SRO2를 Si기판위에 증착후 실기중에서의 열처리(소둔)가 태양전지소자의 특성 특히 단락전류와 개방단자전압에 미치는 영향을 실험적으로 검토하여 이 열처리온도에 최적치가 있음을 알았다. 이 최적온도는 Si기액의 고유저항에 따라 차이가 있으며 고유저항이 비슷한 경우는 N형과 P형 Si 기판에 따르는 큰 차이는 없으나 같은 P형 Si기판인 경우에는 고유저항이 낮은 쪽의 최적온도가 높은 것으로 나타났다.

• 한국자동차공학회논문집
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• 제13권4호
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• pp.174-181
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• 2005

In order to investigate the behavior of fatigue crack growth of SiC-particulate- reinforced Al-Si alloy composites, fatigue tests using single edge notched tension(SENT) specimens were performed. Composite materials were manufactured by using both permanent die casting and extrusion processes with different volume fractions of $10\%\;and\;20\%$. $SiC_p-reinfurced$ Al-Si composites showed the increased levels of threshold stress intensity factor range, ${\Delta}K_{th}$, for the increased volume fractions of SiC particles, which implies the increased fatigue crack growth resistance at the threshold or low ${\Delta}K$ levels, compared to the unreinforced Al-Si alloy. In the Paris region, however, the composites showed the increased rate of crack growth resulting in the unfavorable effects on the fatigue crack growth resistance. Critical stress intensity factor range at unstable crack growth leading to final fracture decreased as the volume fraction of SiC particle increased, because of the reduced fracture toughness of the composites. Extruded materials showed higher threshold and critical values than the cast materials.

• 한국표면공학회지
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• 제40권2호
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• pp.70-76
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• 2007

Ni-P-SiC composite coating layers were prepared by electroless plating method and their deposition rate, codeposition of SiC, morphology, surface roughness, hardness, wear and friction properties were investigated. The deposition rate was kept almost constant independent of the concentration of SiC in the plating solution and the codeposition of SiC in the composite coating layer increased with increased concentration of SiC in the plating solution except the early stage. Vickers microhardness increased with respect to the increased codeposition of SiC and the heat treatment at $300^{\circ}C$ in air for 1 hour. It was found that the wear volume decreased with increased up to 50 wt.% of SiC codeposition, and that friction coefficient increased gradually with increased codeposition of SiC. Considering the wear and the friction behaviors, the composite coating layer obtained by using 50 wt.% of SiC codeposition is desirable for the practical application for anti-wear and anti-friction coatings.

• Current Applied Physics
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• 제18권12호
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• pp.1546-1552
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• 2018

The polymer nanocomposite as a gate dielectric film was prepared via sol-gel method. The formation of crosslinked structure among nanofillers and polymer matrix was proved by Fourier transform infrared spectroscopy (FT-IR). Differential thermal analysis (DTA) results showed significant increase in the thermal stability of the nanocomposite with respect to that of pure polymer. The nanocomposite films deposited on the p- and n-type Si substrates formed very smooth surface with rms roughness of 0.045 and 0.058 nm respectively. Deconvoluted $Si_{2s}$ spectra revealed the domination of the Si-OH hydrogen bonds and Si-O-Si covalence bonds in the structure of the nanocomposite film deposited on the p- and n-type Si semiconductor layers respectively. The fabricated n-channel field-effect-transistor (FET) showed the low threshold voltage and leakage currents because of the stronger connection between the nanocomposite and n-type Si substrate. Whereas, dominated hydroxyl groups in the nanocomposite dielectric film deposited on the p-type Si substrate increased trap states in the interface, led to the drop of FET operation.

• EDISON SW 활용 경진대회 논문집
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• 제6회(2017년)
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• pp.392-397
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• 2017

알칼리 금속을 도핑한 $BaSi_2$의 p-type 특성에 대하여 이해하기 위하여 density functional theory(DFT) 방법을 바탕으로 하는 결함 계산을 진행하였다. 우선 $BaSi_2$의 Si, Ba vacancies에 대해 계산을 진행하여서 도핑을 하지 않았을 때의 특성에 대해 이해해 보았다. 다음으로 알칼리 금속을 도핑한 구조의 p-type 특성과 비교 분석을 진행하기 위해서 잘 알려진 p-type dopants인 Al, In, Ag을 치환형으로 도핑한 구조의 특성에 대해 분석해 보았다. 마지막으로 알칼리 금속을 도핑하였을 때의 p-type 특성에 대해 계산해 보았고, K을 도핑하였을 때 잘 알려진 p-type dopants보다 더 나은 p-type 특성을 가질 수 있음을 보였다.

• 한국세라믹학회지
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• 제35권4호
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• pp.364-370
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• 1998

광집적회로용 평면도파로를 구현하기 위한 $B_2O_3-P_2O_5-SiO_2$ 실리카 광도파막을 실리콘 기판위에 FDH(Flame Hydrolysis Depositon)법으로 제조하여 미립자의 미세구조, 실리카막의 굴절률과 조성을 고찰하였다. FHD법에서 도펀트(dopant)물질로, $B_1\;P_1\;Ge$ 등의 산화물이 사용되며, $B_1$ Ge 산화물의 경우 $SiO_2$와의 결합특성이 우수하여 비교적 도핑(doping)이 용이하지만 P의 경우 $P_2O_5$의 낮은 융점에 의한 증발 등으로 효과적인 도핑이 어렵다. 수직형 FHD 토치를 사용하고 화염온도, 기판온도, 토치와 기판간의 거리를 최적화하여 P 농도가 3.3 Wt%이상이고 고밀화 온도가 $1180^{\circ}C$ 이하인 양질의 실리카막을 얻었다. 실리카막의 굴절률은 $1.55\;\mu\textrm{m}$ 파장에서 $1.4480{\pm}1{\times}10^{-1}$로 측정되었으며, $22{\pm}1\;\mu\textrm{m}$의 두께를 보였다.

• 한국전기전자재료학회논문지
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• 제11권3호
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• pp.181-187
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• 1998

The ionization energy and degree of ionization for p-type $Si_{1-x}Ge_x$ with boron doping are calculated taking into account the screening and broadening effects. The drift and Hall mobilities are then calculated using the relaxation time approximation and compared with the previously reported measurement data for relaxed and strained $Si_{1-x}Ge_x$ alloys to estimate the alloy scattering potential. From a fit, the alloy scattering potential is found to be 0.5 eV. The in-plane drift mobility for p-type strained $Si_{1-x}Ge_x$ grown on (001) Si substrate is approximately 1+$10x^2$ times higher than that for bulk Si in the high doping range.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1997년도 추계학술대회논문집
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• pp.216-219
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• 1997

Hot workability of SiCp/AA2024 composites reinforced with different vol. % of SiCp reinforcements (0, 5, 10, 15, 20, and 30 vol. %) was investigated by hot torsion tests. Hot restoration of the composites was studied from the flow curves and deformed microstructures. Dynamic recrystallization (DRX) was occurred in all the composites during the hot deformation at 370-43$0^{\circ}C$ under a strain rate of 1.0/sec. Also, the flow stress of the composites increased with increasing the SiCp reinforcement vol. % and the difference of flow stress between the composites decreased with increasing the deformation temperature.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.278-278
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• 2009

A photovoltaic device consisting of arrays of radial p-n junction wires enables a decoupling of the requirements for light absorption and carrier extraction into orthogonal spatial directions. Each individual p-n junction wire in the cell is long in the direction of incident light, allowing for effective light absorption, but thin in orthogonal direction, allowing for effective carrier collection. To fabricate radial p-n junction solar cells, p or n-type vertical Si wire cores need to be produced. The majority of Si wires are produced by the vapor-liquid-solid (VLS) method. But contamination of the Si wires by metallic impurities such as Au, which is used for metal catalyst in the VLS technique, results in reduction of conversion efficiency of solar cells. To overcome impurity issue, top-down methods like noble metal catalytic etching is an excellent candidate. We used noble metal catalytic etching methods to make Si wire arrays. The used noble metal is two; Au and Pt. The method is noble metal deposition on photolithographycally defined Si surface by sputtering and then etching in various BOE and $H_2O_2$ solutions. The Si substrates were p-type ($10{\sim}20ohm{\cdot}cm$). The areas that noble metal was not deposited due to photo resist covering were not etched in noble metal catalytic etching. The Si wires of several tens of ${\mu}m$ in height were formed in uncovered areas by photo resist. The side surface of Si wires was very rough. When the distance of Si wires is longer than diameter of that Si nanowires are formed between Si wires. Theses Si nanowires can be removed by immersing the specimen in KOH solution. The optimum noble metal thickness exists for Si wires fabrication. The thicker or the thinner noble metal than the optimum thickness could not show well defined Si wire arrays. The solution composition observed in the highest etching rate was BOE(16.3ml)/$H_2O_2$(0.44M) in Au assisted chemical etching method. The morphology difference was compared between Au and Pt metal assisted chemical etching. The efficiencies of radial p-n junction solar Cells made of the Si wire arrays were also measured.