• 제목/요약/키워드: oxygen annealing

검색결과 506건 처리시간 0.022초

산소 농도 제어를 통한 NiCrAl 합금 폼 표면의 침상 NiO 보호층 효과 (Effect of Needle-Like NiO Protecting Layer on NiCrAl Alloy Foam by Controlled Oxygen Concentration)

  • 이영근;신동요;안효진
    • 한국재료학회지
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    • 제28권6호
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    • pp.324-329
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    • 2018
  • Needle-like NiO protecting layers on NiCrAl alloy foam, used as support for hydrogen production, are introduced through electroplated Ni and subsequent microwave annealing. To improve the stability of the NiCrAl alloy foam, oxygen concentration of microwave annealing to form a needle-like NiO layer with good chemical stability and corrosion resistance is controlled in a range of 20 and 50 %. As the oxygen concentration increases to 50 %, needle-like NiO forms a dense coating layer on the NiCrAl alloy foam; this layer formation can be attributed to accelerated growth of the (200) plane. In addition, the increased oxygen concentration causes increased NiO/Ni ratio of the resultant coating layer on NiCrAl alloy foam due to improved rate of the oxidation reaction. As a result, the introduction of dense needle-like NiO layers formed at 50 % oxygen concentration improves the chemical stability of the NiCrAl alloy foam by protecting the direct electrochemical reaction between the electrolyte and the foam. Thus, needle-like NiO can be proposed as a superb protecting layer to improve the chemical stability of NiCrAl alloy form.

산소가 혼입된 Cr 박막의 질화처리에 따른 구조적 특성 (Structural Properties of Ammoniated Thin Cr Films with Oxygen Incorporated During Deposition)

  • 김준;변창섭;김선태
    • 한국재료학회지
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    • 제24권4호
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    • pp.194-200
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    • 2014
  • Metallic Cr film coatings of $1.2{\mu}m$ thickness were prepared by DC magnetron sputter deposition method on c-plane sapphire substrates. The thin Cr films were ammoniated during horizontal furnace thermal annealing for 10-240 min in $NH_3$ gas flow conditions between 400 and $900^{\circ}C$. After annealing, changes in the crystal phase and chemical constituents of the films were characterized using X-ray diffraction (XRD) and energy dispersive X-ray photoelectron spectroscopy (XPS) surface analysis. Nitridation of the metallic Cr films begins at $500^{\circ}C$ and with further increases in annealing temperature not only chromium nitrides ($Cr_2N$ and CrN) but also chromium oxide ($Cr_2O_3$) was detected. The oxygen in the films originated from contamination during the film formation. With further increase of temperature above $800^{\circ}C$, the nitrogen species were sufficiently supplied to the film's surface and transformed to the single-phase of CrN. However, the CrN phase was only available in a very small process window owing to the oxygen contamination during the sputter deposition. From the XPS analysis, the atomic concentration of oxygen in the as-deposited film was about 40 at% and decreased to the value of 15 at% with increase in annealing temperature up to $900^{\circ}C$, while the nitrogen concentration was increased to 42 at%.

Electrical and Mechanical Properties of Indium-tin-oxide Films Deposited on Polymer Substrate Using Organic Buffer Layer

  • Han, Jeong-In;Lee, Chan-Jae;Rark, Sung-Kyu;Kim, Won-Keun;Kwak, Min-GI
    • Journal of Information Display
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    • 제2권2호
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    • pp.52-60
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    • 2001
  • The electrical and mechanical properties in indium-tin-oxide films deposited on polymer substrate were examined. The materials of substrates were polyethersulfone (PES) which have gas barrier layer and anti-glare coating for plastic-based devices. The experiments were performed by rf-magnetron sputtering using a special instrument and buffer layers. Therefore, we obtained a very flat polymer substrate deposited ITO film and investigated the effects of buffer layers, and the instrument. Moreover, the influences of an oxygen partial pressure and post-deposition annealing in ITO films deposited on polymer substrates were clarified. X-ray diffraction observation, measurement of electrical property, and optical microscope observation were performed for the investigation of micro-structure and electro-mechanical properties, and they indicated that as-deposited ITO thin films are amorphous and become quasi-crystalline after adjusting oxygen partial pressure and thermal annealing above $180^{\circ}C$. As a result, we obtained 20-25 ${\Omega}/sq$ of ITO films with good transmittance (above 80 %) of oxygen contents with under 0.2 % and vacuum annealing. Furthermore, using organic buffer layer, we obtained ITO films which have a rather high electrical resistance (40-45 ${\Omega}/sq$) but have improved optical (more than 85 %) and mechanical characteristics compared to the counterparts. Consequently, a prototype reflective color plastic film LCD was fabricated using the PES polymer substrates to confirm whether the ITO films could be realized in accordance with our experimental results.

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Effects of Oxygen Pressure on the Crystallization Behavior and Electrical Properties of YMnO3 Thin Films

  • Cheon, Chae-Il;Yun, Kwi-Young;Kim, Jeong-Seog;Kim, Jin-Hyeok
    • 한국세라믹학회지
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    • 제40권4호
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    • pp.398-400
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    • 2003
  • The YMnO$_3$ thin films were prepared on platinized-silicon substrates by chemical solution deposition and annealed at 750 to 85$0^{\circ}C$ for 1 h under various oxygen pressures, from 2 mTorr to 760 Torr. Effects of annealing oxygen pressures on the crystallization behavior and electrical properties of YMnO$_3$ thin films were investigated. Crystallinity and c-axis preferred orientation of YMnO$_3$ thin film were improved by decreasing the oxygen pressure but were deteriorated at extremely low oxygen pressure, 2 mTorr. Leakage current density of the YMn03 thin film decreased as the oxygen pressure decreased. The film annealed at 80$0^{\circ}C$ under 2 Torr, which had the best crystallinity and the highest c-axis preferred orientation. showed the best-developed ferroelectric C-V hysteresis.

Silicide Formation of Atomic Layer Deposition Co Using Ti and Ru Capping Layer

  • Yoon, Jae-Hong;Lee, Han-Bo-Ram;Gu, Gil-Ho;Park, Chan-Gyung;Kim, Hyung-Jun
    • 한국재료학회지
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    • 제22권4호
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    • pp.202-206
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    • 2012
  • $CoSi_2$ was formed through annealing of atomic layer deposition Co thin films. Co ALD was carried out using bis(N,N'-diisopropylacetamidinato) cobalt ($Co(iPr-AMD)_2$) as a precursor and $NH_3$ as a reactant; this reaction produced a highly conformal Co film with low resistivity ($50\;{\mu}{\Omega}cm$). To prevent oxygen contamination, $ex-situ$ sputtered Ti and $in-situ$ ALD Ru were used as capping layers, and the silicide formation prepared by rapid thermal annealing (RTA) was used for comparison. Ru ALD was carried out with (Dimethylcyclopendienyl)(Ethylcyclopentadienyl) Ruthenium ((DMPD)(EtCp)Ru) and $O_2$ as a precursor and reactant, respectively; the resulting material has good conformality of as much as 90% in structure of high aspect ratio. X-ray diffraction showed that $CoSi_2$ was in a poly-crystalline state and formed at over $800^{\circ}C$ of annealing temperature for both cases. To investigate the as-deposited and annealed sample with each capping layer, high resolution scanning transmission electron microscopy (STEM) was employed with electron energy loss spectroscopy (EELS). After annealing, in the case of the Ti capping layer, $CoSi_2$ about 40 nm thick was formed while the $SiO_x$ interlayer, which is the native oxide, became thinner due to oxygen scavenging property of Ti. Although Si diffusion toward the outside occurred in the Ru capping layer case, and the Ru layer was not as good as the sputtered Ti layer, in terms of the lack of scavenging oxygen, the Ru layer prepared by the ALD process, with high conformality, acted as a capping layer, resulting in the prevention of oxidation and the formation of $CoSi_2$.

차세대 반도체 소자의 배선을 위한 구리박막의 reflow (Reflow of copper film for the interconnection of the next generation semiconductor devices)

  • 김동원;김갑중;권인호;이승윤;라사균;박종욱
    • 한국진공학회지
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    • 제6권3호
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    • pp.206-212
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    • 1997
  • 차세대 반도체 소자의 배선재료로 사용될 것으로 예상되는 구리의 reflow 특성을 조 사하였다. 구리박막을 hole 및 trench 패턴 위에 금속유기화학증착법으로 증착하고 $350^{\circ}C$에 서 $550^{\circ}C$까지의 열처리 온도 범위 및 질소, 산소 분위기에서 열처리하였다. 질소 분위기에서 열처리 한 경우에는 구리가 패턴을 채우지 못하였고 열처리 온도 $450^{\circ}C$ 이상의 산소 분위기 에서 열처리 한 경우에는 reflow에 의하여 구리가 패턴을 채웠다. 이러한 현상은 구리의 산 화시 발생되는 열에 의하여 부분적으로 액상화된 구리가 표면에너지 및 위치에너지를 감소 시키기 위하여 패턴을 채우면서 발생하는 것으로 생각된다. 산소 분위기에서 열처리한 경우 에는 응집물 표면에 300$\AA$이하의 구리 산화물이 형성되었으며 열처리 온도 $550^{\circ}C$에서 구리 의 응집에 의하여 비저항이 급격하게 증가하였다.

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Effects of Growth Ambient, Process Pressure, and Heat Treatments on the Properties of RF Magnetron Sputtered GaMgZnO UV-Range Transparent Conductive Films

  • Patil, Vijay;Lee, Chesin;Lee, Byung-Teak
    • 한국재료학회지
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    • 제31권6호
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    • pp.320-324
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    • 2021
  • Effects of growth variables and post-growth annealing on the optical, structural and electrical properties of magnetron-sputtered Ga0.04Mg0.10Zn0.86O films are characterized in detail. It is observed that films grown from pure oxygen plasma showed high resistivity, ~102 Ω·cm, whereas films grown in Ar plasma showed much lower resistivity, 2.0 × 10-2 ~ 1.0 × 10-1 Ω·cm. Post-growth annealing significantly improved the electrical resistivity, to 4.3 ~ 9.0 × 10-3 Ω·cm for the vacuum annealed samples and to 1.3 ~ 3.0 × 10-3 Ω·cm for the films annealed in Zn vapor. It is proposed that these phenomena may be attributed to the improved crystalline quality and to changes in the defect chemistry. It is suggested that growth within oxygen environments leads to suppression of oxygen vacancy (Vo) donors and formation of Zn vacancy (VZn) acceptors, resulting in highly resistive films. After annealing treatment, the activation of Ga donors is enhanced, Vo donors are annihilated, and crystalline quality is improved, increasing the electron mobility and the concentration. After annealing in Zn vapor, Zn interstitial donors are introduced, further increasing the electron concentration.

열처리된 친수성 카본 페이퍼 전극의 전기 물 분해 특성 (Electrode Properties for Water Electrolysis of Hydrophilic Carbon Paper with Thermal Anneal)

  • 유일한;서형탁
    • 한국재료학회지
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    • 제26권5호
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    • pp.241-245
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    • 2016
  • Hydrogen is considered a potential future energy source. Among other applications of hydrogen, hydrogen-rich water is emerging as a new health care product in industrial areas. Water electrolysis is typically used to generate a hydrogen rich water system. We annealed 10AA carbon paper in air to use it as an electrode of a hydrogen rich water generator. Driven by annealing, structural changes of the carbon paper were identified by secondary electron microscope analysis. Depending on the various annealing temperatures, changes of the hydrophilic characteristics were demonstrated. The crystal structures of pristine and heat-treated carbon paper were characterized by X-ray diffraction. Improvement of the efficiency of the electrochemical oxygen evolution reaction was measured via linear voltammetry. The optimized annealing temperature of 10AA carbon paper showed the possibility of using this material as an effective hydrogen rich water generator.

열처리 온도 및 분위기 변화에 따른 Bi-2223 초전도 선재에서의 특성변화 (superconducting properties of Bi-2223 tapes with various heat treatment condition)

  • 하동우;이동훈;하홍수;오상수;김홍대;양주생;윤진국;최정규;권영길
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집
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    • pp.527-530
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    • 2002
  • A lot of efforts have been focused on the optimization of PIT parameters for Bi-2223/Ag wire. In this paper, initial annealing of Bi-2223/Ag wire to transform Bi-2212 orthorhombic from Bi-2212 tetragonal Precursor was investigated. This initial annealing step at low oxygen partial pressure were to transform Bi-2212 orthorhombic structure and to reduce the formation of second phases at superconducting wire. However Bi-2223 Phases were appeared at higher annealing temperature. Critical currents(Je) of Bi-2223/Ag tapes were sintered at low oxygen Partial pressure were higher than that of the wires sintered at atmosphere condition. In order to investigate the effect of rolling reduction ratio, Bi-2223/Ag HTS tapes were rolled with different reduction ratio. There were no clear difference of Je and filaments shape with various rolling reduction ratio.

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열처리에 따른 SOI 기판에서의 전기전도특성의 이상 거동 (Abnormal behaviors in electrical conductions of SOI substrate by thermal annealing temperature)

  • 조원주
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.126-127
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    • 2008
  • The effects annealing conditions on the electrical conductions of SOI substrate were studied. The reversible change of resistance and carrier concentration in accordance with the annealing temperature were observed for the first time in SOI substrate. The thermal donors due to interstitial oxygen atoms contribute the change of resistance and carrier concentration. Final1y, we show that the furnace annelaing at $500^{\circ}C$ at final heat treatment stage is effective for eliminate the thermal donor effects in SOI substrate.

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