• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03a
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• pp.18-20
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• 2010

The mechanism for suppression of Ag agglomeration in Ag-Mg alloy ohmic contact to p-GaN is investigated. The Ag-Mg alloy ohmic contact shows low contact resistivity of $6.3\;{\times}\;10^{-5}\;{\Omega}cm^2$, high reflectance of 85.5% at 460 nm wavelength after annealing at $400^{\circ}C$ and better thermal stability than Ag contact The formation of Ga vacancies increase the net hole concentration, lowering the contact resistivity. Moreover, the oxidation of Mg atoms in Ag film increase the work function of Ag-Mg alloy contact and prevents Ag oxidation. The inhibition of oxygen diffusion by Mg oxide suppresses the Ag agglomeration, leading to enhance light reflectance and thermal stability.

• Journal of the Korean Ceramic Society
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• v.40 no.11
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• pp.1106-1112
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• 2003

For the purpose of making clear the role of oxygen in the thermoelectric properties of FeSi$_2$, thermoelectric measurements and spectroscopic characterization were conducted for the oxidized specimens fabricated from ($\alpha$+$\varepsilon$)-phases and/or $\beta$-phase. Addition of oxygen to FeSi$_2$ prevented both densification during sintering and transformation from metallic phases to semiconducting phase during annealing treatment. In an specimens, electrical conductivity and thermal conductivity decreased with oxidation time. The Seebeck coefficient was positive and small for pure FeSi$_2$. And/or the oxidized specimens fabricated from ($\alpha$+$\varepsilon$)-phases. However, it was negative and showed a maximum peak at about 500 K for the oxidized FeSi$_2$ fabricated from $\beta$-phase. The value of maximum peak increased with oxidation time.

• Journal of Electrochemical Science and Technology
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• v.15 no.1
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• pp.96-110
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• 2024

Polymer electrolyte membrane fuel cells (PEMFCs) are green energy conversion devices, for which commercial markets have been established, owing to their application in fuel cell vehicles (FCVs). Development of cathode electrocatalysts, replacing commercial Pt/C, plays a crucial role in factors such as cost reduction, high performance, and durability in FCVs. PtNi octahedral catalysts are promising for oxygen reduction reactions owing to their significantly higher mass activity (10-15 times) than that of Pt/C; however, their application in membrane electrode assemblies (MEAs) is challenged by their low stability. To overcome this durability issue, various approaches, such as third-metal doping, composition control, halide treatment, formation of a Pt layer, annealing treatment, and size control, have been explored and have shown promising improvements in stability in rotating disk electrode (RDE) testing. In this review, we aimed to compare the features of each strategy in terms of enhancing stability by introducing a stability improvement factor for a direct and reasonable comparison. The limitations of each strategy for enhancing stability of PtNi octahedral are also described. This review can serve as a valuable guide for the development of strategies to enhance the durability of octahedral PtNi.

• Journal of the Korean Vacuum Society
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• v.9 no.2
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• pp.136-143
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• 2000

$SrBi_2Ta_2O_9;(SBT)$ films were deposited on p-type Si(100) at room temperature by rf magnetron sputtering method to confirm the possibility of application of $Pt/SBT/Pt/Ti/SiO_2/Si$ structure (MFM) for destructive read out ferroelectric RAM (random access memory). Their structural characteristics with the various annealing times and Ar/$O_2$ gas flow ratios in sputtering were observed by XRD (X-ray diffractometer) and the surface morphologies were observed by FE-SEM (field emission scanning electron microscopy), and their electrical properties were observed by P-V (polarization-voltage measurement) and I-V (current-voltage measurement). The Ar/$O_2$ gas flow ratios of sputtering gas were changed from 1 : 4 to 4 : 1 and SBT thin films were deposited at room temperature. The films show (105), (110) peaks of SBT by XRD measurement. SBT thin films deposited at room temperature were crystallized by furnace annealing at 80$0^{\circ}C$ in oxygen atmosphere during either one hour or two hours. Among their electrical properties, P-V curves showed shaped hysteresis curves, but the SBT thin films showed the asymmetric ferroelectric properties in P-V curves. When Ar/$O_2$ gas flow ratios are 1 : 1, 2: 1, the leakage current density values of SBT thin films are good, those values of 3 V, 5 V, and 7 V are respectively $3.11\times10^{-8} \textrm{A/cm}^2$, $5\times10^{-8}\textrm{A/cm}^2$, $7\times10^{-8}\textrm{A/cm}^2$.After two hours of annealing time, their electrical properties and crystallization are improved.

• Polymer(Korea)
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• v.36 no.4
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• pp.542-548
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• 2012

Morphological characteristics and formation of symmetric polystyrene-block-poly(1,4-butadiene) copolymer (PS-b-PBD) in thin films upon solvent-annealing were investigated by using atomic force microscopy (AFM). The thin films solvent-annealed in cyclohexane revealed the perforated lamellae of poly(1,4-butadiene) in the matrix of polystyrene while those solvent-annealed in n-hexane exhibited highly disordered patterns. Interestingly, when the thin films of PS-b-PBD were solvent-annealed with binary mixtures of cyclohexane and n-hexane, the morphological transition from the perforated lameallae to the perpendicularly-oriented lamellae of poly(1,4-butadiene) could be induced by changing the mixing ratio of both solvents. We also demonstrated that after microdomians of poly(1,4-butadiene) were successfully degraded by UV-$O_3$, linear poly(dimethyl siloxane) chains were back-filled into the etched regions of the thin film and then converted to silica nano-objects by oxygen plasma treatments.

• Macromolecular Research
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• v.8 no.1
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• pp.12-18
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• 2000

Six aromatic polyesters with ether-linkages were prepared from 4,4'-oxybis(benzoic acid) and naphthalenediol (ND) isomers which were 1,4-, 1,5-, 1,6-, 2,3-, 2,6- and 2,7-derivatives. The solution viscosity numbers ranged from 0.23 to 0.65 dL/g. The glass transition temperatures ranged from 142 to 179$\^{C}$. The initial decomposition temperatures were all above 400$\^{C}$, and the residue weights at 600$\^{C}$ were in the range of 50-64%. Only the polyesters derived from 1,5- and 2,6-NDs, which have a linear linking mode, were found to be semicrystalline and could form thermotropically nematic phase. Multiple melting phenomena and annealing of the polyester derived from 1,5-ND and related polymers are described. The experimental results show that the polyester derived from 1,4-ND of linear shape was amorphous and non-liquid crystalline. Particularly, the polyester derived from 2,3-ND could form a smectic mesophase as banana-shaped molecules, and this is ascribed to the C/sub_2v/ symmetry where highly kinked molecules are packed in the same direction.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.7
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• pp.521-524
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• 1999

Nb silicide was formed on the Si micro-tip arrays in order to improve field emission properties of Si-tip field emitter array. After silicidization of the tips, the etch-back process, by which gate insulator, gate electrode and photoresist were deposited sequentially and gate holes were defined by removing gradually the photoresist by $O_2$ plasma from the surface, was applied. Si nitride film was used as a protective layer in order to prevent oxygen from diffusion into Nb silicide layer and it was identified that the NbSi2 was formed through annealing in $N_2$ ambient at $1100^{\circ}C$ for 1 hour. By the Nb silicide coating on Si tips, the turn-on voltage was decreased from 52.1 V to 32.3 V and average current fluctuation for 1 hour was also reduced from 5% to 2%. Also, the fabricated Nb silicide-coated Si tip FEA emitted electrons toward the phosphor and light emission was obtained at the gate voltage of 40~50 V.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.242-242
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• 2012

Transparent oxide semiconductors are increasingly becoming one of good candidates for high efficient channel materials of thin film transistors (TFTs) in large-area display industries. Compare to the conventional hydrogenated amorphous silicon channel layers, solution processed ZnO-TFTs can be simply fabricated at low temperature by just using a spin coating method without vacuum deposition, thus providing low manufacturing cost. Furthermore, solution based oxide TFT exhibits excellent transparency and enables to apply flexible devices. For this reason, this process has been attracting much attention as one fabrication method for oxide channel layer in thin-film transistors (TFTs). But, poor electrical characteristic of these solution based oxide materials still remains one of issuable problems due to oxygen vacancy formed by breaking weak chemical bonds during fabrication. These electrical properties are expected due to the generation of a large number of conducting carriers, resulting in huge electron scattering effect. Therefore, we study a novel technique to effectively improve the electron mobility by applying environmental annealing treatments with various gases to the solution based Li-doped ZnO TFTs. This technique was systematically designed to vary a different lithium ratio in order to confirm the electrical tendency of Li-doped ZnO TFTs. The observations of Scanning Electron Microscopy, Atomic Force Microscopy, and X-ray Photoelectron Spectroscopy were performed to investigate structural properties and elemental composition of our samples. In addition, I-V characteristics were carried out by using Keithley 4,200-Semiconductor Characterization System (4,200-SCS) with 4-probe system.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.94.2-94.2
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• 2010

Indium tin oxide (ITO) Thin films were grown on Non-alkarai glass Substrates by PVD method and Subsequently Subjected to ($100^{\circ}C-350^{\circ}C$) Thermal Annealing (TA) In Nitr Oxygen ambinent. Most of all, The effect of TA treatment on the structural properties were studied by using X-Ray diffraction and atomic force microscopy, while optical properties were studied by UV-Transmittance measurements. After TA treatment, the XRD spectra have shown an effective relaxation of the residual compressive stress, As a result, XRD peaks increase of the intensity and narrowing of full width at half-maximun (FWHM). In addtion The microstructure, The surface morphology, the optical transmittance changed and improved, and we investigated The effects of temperature, Time and atmosphere during the TA on the structural and electrical properties of the ITO/glass on TA at $300^{\circ}C$. As a results, the films are highly transparent (80%～89%) in visible region. AFM analysis shows that the films are very smooth with root mean square surface roughness 0.58nm -2.75nm thickness film. It is observed that resistivity of the films drcreases T0 $1.05{\times}10^{-4}{\Omega}cmt$ $6.06{\times}10^{-4}{\Omega}cm$, while mobility increases from $152cm^2/vs$ to $275cm^2/vs$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.11
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• pp.35-43
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• 1995

To obtain high quality of $Ta_{2}O_{5}$ film, two dielectric layers of $Si_{3}N_{4}$ and $Ta_{2}O_{5}$ were subsequently formed on Si wafer. Silicon nitride films were thermally grown in 10 Torr ammonia ambient by R.F induced heating system. The thickness of thermally grown $Si_{3}N_{4}$ film was able to be controlled in the range of tens $\AA$ due to the self-limited growth property. $Ta_{2}O_{5}$ film of 200$\AA$ thickness was then deposited on the as-grown $Si_{3}N_{4}$ film about 25$\AA$ thickness by sputtering method and annealed at $900^{\circ}C$in $O_{2}$ ambient for 1hr. Stoichiometry film was prepared by the annealing in oxygen ambient. Despite the high temperature anneal process, silicon oxide layer was not grown at the interface of the layered films because of the oxidation barrier effect of Si$_{3}$N$_{4}$ film. The fabricated $Ta_{2}O_{5}$/$Si_{3}N_{4}$ film showed low leakage current less than several nA and high dielectric breakdown strength.