• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2023년도 가을학술발표대회논문집
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• pp.211-212
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• 2023

Polishing tiles among porcelain tiles are more durable and aesthetic than ceramic tiles, so their demand has recently increased. In particular, since polishing tiles have a very low absorption rate, organic adhesives with chemical bonds are mainly used. However, organic adhesives have low economic efficiency and some volatile organic compounds (TVOCs). Therefore purpose of this study was to evaluate the performance of polishing tile adhesion by developing organic-inorganic adhesives, which have chemical bonds and mechanical bonds. As a result, since the amorphous chain and chemical bonds of the polymer in the tile adhesives, both tensile and shear adhesion strength were satisfied with the KS L 1592, KS L 1593, and the rate of length change itself in the thermal cycling was lower than organic adhesives. So it is thought that it is possible to replace some organic adhesives.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2018년도 추계 학술논문 발표대회
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• pp.79-80
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• 2018

Recently, the interest in remodeling of new and old buildings is increasing worldwide. As a result, the frequency of use of architectural adhesives has increased. Currently, adhesives used in buildings are made of organic materials in most cases, and epoxy resin adhesives are most widely used. However, epoxy resin adhesives contain formaldehyde and VOCs in the room during construction, which can cause sick house syndrome. In case of building fire, it may cause damage due to carbon monoxide generated from organic materials. It is urgent to study the problem of epoxy fill adhesive made of such organic materials. Therefore, the purpose of this study is to investigate the effect of the adhesion of epoxy resin adhesive, which is a problem of epoxy resin adhesive, which is an existing organic adhesive by using inorganic materials such as magnesia and phosphate, And the inorganic adhesive which does not emit the release amount as an inorganic material.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2018년도 추계 학술논문 발표대회
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• pp.48-49
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• 2018

Recently the old buildings have been increasing and increasing reconstruction. As a result, the frequency of use of architectural adhesives has increased. Adhesives are not only used for bonding but also for building materials used in various fields. However, since the adhesive is made of an organic material, it causes various skin diseases and sick house syndrome, and when a fire occurs, harmful substances are generated, and incomplete combustion may cause personal injury. Therefore, in this study, to solve the disadvantages of conventional adhesives, we tried to develop inorganic adhesives using inorganic materials.

• 한국건축시공학회지
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• 제19권4호
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• pp.289-297
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• 2019

현재 건축물에 사용되는 접착제는 주로 유기질 재료인 에폭시 수지 접착제가 사용되고 있다. 유기질 재료인 에폭시 수지 접착제는 유기성 물질로 접착제 생산 시 유해물질이 발생하며, 시공 후에도 유해물질이 실내거주공간에서 높게 나타난다. 또한 건축물 화재 시 유기 재료에서 발생되는 다량의 일산화탄소가 인명피해로 이어진다. 본 연구는 순수무기계 재료인 산화마그네시아, 인산염, 붕사를 사용한 무기 접착재에 대해 기존 유기 접착제를 대체 할 무기 접착재로의 활용가능성을 평가한 연구이다. 적정 인산염 선정에 관한 실험과 지연제로서 활용한 붕사의 첨가율에 대한 특성을 실험한 결과 적정 인산염으로 제1인산칼륨이 도출되었으며, 붕사 첨가율에 따른 특성을 측정한 결과 KS F 4923의 품질기준과 비교하여 경화수축률과 가열변화율은 품질기준을 만족하였으며, 인장강도는 붕사 첨가율 4% 이상에서 만족하는 결과가 나왔지만 접착강도의 경우 품질 기준을 충족하지 못하였다. 향후 접착강도 증진을 위한 추가적인 연구가 필요할 것으로 판단된다.

• 한국문화재보존과학회:학술대회논문집
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• 한국문화재보존과학회 2005년도 제21회 발표논문집
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• pp.1-11
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• 2005

No one can tell when, exactly, the conservation of potteries & ceramics began, however, according to the documents, it has a long history. Among the materials discovered up to the present, organic adhesives extracted from animals and plants such as bitumen were mainly used and resin, in 19th century, as well. As for inorganic adhesives, clay, lime and plaster were used as well as rivet, as one of mechanical methods. According to the conservation case studies in Korea, lacquer and gilding powdered gold were applied as treatment methods in some ceramics, but, in general, plaster and resins were used widely.

• 보존과학회지
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• 제26권1호
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• pp.85-94
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• 2010

석조 문화재 보존을 위해 황변현상이 크게 일어나지 않는 에폭시계 접착제를 개발하였다. 에폭시 주제로 bis phenol-A 계열의 에폭시 수지가 갖는 불포화 결합을 수소화시킨 hydrogenated-bisphenol-A (HBA)계 에폭시 수지로, 경화제로는 상온에서 경화가 가능한 isophorone-diamine (IPDA)를 선정하였다. HBA-IPDA 접착제는 불포화 결합이 없어 시간에 따른 황변현상이 심각하게 일어나지 않으나, 상대적으로 낮은 기계적 특성을 갖는 단점이 있어 나노소재인 polyhedral oligomeric silsesquioxane (POSS)을 첨가하여 향상시켰다. 첨가제로 선정한 POSS로는 HBA와 상용성이 있는 EP0408과 EP0409를 선택하였다. 다양한 혼합 비율(1:2 1:1 2:1)의 EP0408와 EP0409 혼합물을 HBA에 첨가하여 잘 섞어준 후, 경화제를 이용하여 접착제를 제조하였다. FT-IR 측정으로 경화 시간을 확인하였으며, 인장강도, 압축강도, 굽힘강도, 화강암에 적용한 압축전단강도를 측정하여 성능을 비교하였다. 색안정성이 있는 POSS를 함유한 HBA-IPDA 에폭시 접착제는 석재 내부로 침투가 용이한 낮은 점도와 향상된 기계적 특성을 나타내었다.

• 펄프종이기술
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• 제29권3호
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• pp.7-16
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• 1997

The constituents of deposits on paper machine and holes/spots in paper have been studied by consequently a combination of analytical techniques, such as FTIR, Py-GC-MS, and. EDS. FTIR spectroscopy was used prior to Py-GC-MS and EDS analysis, as preliminary analysis technique. The analysis of organic components were carried out with the use of a pyrolysis unit connected to a GC-MS, and inorganic components in ash were analysed by SEM equipped with an EDS analyzer after pyrolysis at 59$0^{\circ}C$. The deposits on the dryer section were complex pitch, which was the mixture of the organic contents of fatty acid ester and starch, and the inorganic contents of talc, clay, and calcium carbonate. The complex pitch was estimated to come from the coated broke. We knew the deposits on the metering rod of sym-sizer were associated with the interaction of unstable AKD and CaCO$_3$. The compositions of holes or spots varied considerably and were associated with chemical interaction within the system. The holes, spots, and blotches in the finished paper were PE and PP that were streamed out from pulp sources, complex pitch that were caused by the interaction of the different additives in the system, polymer such as flexible PVC that used for the prop of palette, and hot melt as adhesives that came from the inadequate handling of broke. In addition, we identified that poly(caprolactam) which is used for forming fabrics or press felts, could be mixed with the raw materials by accident and results in streak on coating.

• 마이크로전자및패키징학회지
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• 제6권2호
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• 공업화학
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• 제9권1호
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• pp.135-140
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• 1998

제지공정 트러블을 일으키는 침착물과 제품의 품질을 저하시키는 종이내 불순물들의 성분을 기기분석하였다. 우선적으로 퓨리에변환 적외선분광기(FT-IR spectrometer)를 이용하여 이물질의 원형 그대로를 측정하여 예비정보를 얻은 뒤 열분해-가스크로마토그래피-질량분석기(Py-Gc/MS)를 이용해서 불순물들의 유기성분을 분석하였으며, $590^{\circ}C$에서 열분해시키고 난 ash는 에너지분산분광법(EDS)을 이용하여 무기성분을 분석하였다. 초지기 건조부에 침착된 성분은 지방산 에스테르 및 전분 등의 유기 이물질과 탈크, 크레이, 탄산칼슘 등의 무기 이물질로 이루어진 복합적인 피치형태로써 재사용 도공파지 성분에 의한 것이며, 심사이저 메터링로드에 끼인 침착물은 불안정한 alkyl keten dimer(AKD) 성분이 탄산칼슘과 상호작용하여 침착을 일으킨 것으로 분석되었다. 종이내 구멍 성분은 주원료로 사용되는 펄프에서 혼입된 것으로 판단되는 PE및 PP 성분과 초지공정에 사용된 주 부원료들간의 불안정한 상호작용에 의해 응집된 복합적인 피치성분으로 확인되었다. 작업상의 부주의로 완정공정에서 사용되는 hot melt 및 파렛트 받침대로 사용되는 가소제를 첨가하여 유연하게 만든 PVC 성분이 재사용 파지와 함께 혼입되어 종이내 얼룩 및 반점 등을 발생시키기도 하며, 초지기 용구로 사용되는 고분자 물질(와이어 또는 펠트)의 일부가 사고 등에 의해 공정중에 혼입되어 도공시 스트리크를 발생시킬 수도 있음을 알 수 있었다.

• 보존과학회지
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• 제35권4호
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• pp.295-307
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• 2019

In the process of the conservation treatment of the glass eyes of the stone standing Maitreya of Daejosa temple, Buyeo (Treasure No. 217), a blackish material, expected to be the adhesive for fixing the glass eyes, was collected and analyzed. Infrared spectroscopy and pyrolysis/gas chromatography/mass spectrometry (pyrolysis/GC/MS) were employed to identify the organic material in the sample. The IR analysis revealed the presence of materials such as apatite or bone black. The pyrogram of the sample was similar to that of Asian lacquer, among traditional adhesives. In particular, the pyrolysis/GC/MS analysis with online methylation detected 1,2-dimethoxy-3-pentadecylbenzene, methyl 7-(2,3- dimethoxyphenyl) heptanoate, and methyl 8-(2,3-dimethoxyphenyl)octanoate. These are known to be the pyrolysis products of catechol and its oxidation product, which indicated the presence of Asian lacquer in the sample. X-ray diffraction, X-ray fluorescence, and thermal gravimetry analysis showed that the sample contained ca. 60% inorganic substances, including apatite. Radiocarbon dating of the sample suggested that the blackish material was applied between the late 13^th and early 15^th century, revealing some discrepancy with the art-historical manufacturing time of the Maitreya. From the above analysis, it was concluded that Asian lacquer and bone ash were used to attach the glass eyes by forming a thick blackish lacquer layer.