• 한국유기농업학회지
• /
• 제28권3호
• /
• pp.315-334
• /
• 2020

This study was conducted to analyze factors affecting acceptance of smart farm technology. Smart farm technology is rapidly being introduced to agriculture in accordance with the progress of the 4th Industrial Revolution, but research on this is still little. Therefore, in this study, based on the unified theory of acceptance and use of technology (UTAUT), a research model reflecting the characteristics of smart farm technology was constructed. To test this, empirical analysis was performed. A survey was conducted for students in smart farm technology education and adult male and female farmers who are currently planning to operate smart farms. Valid 204 sample were used for analysis. The hypothesis test was based on multiple regression analysis using SPSS 24 statistical package. For the mediating effect and moderating effect, Process Macro 3.4 based on the regression equation was used. The results of testing the hypothesis are as follows. First, in the causal hypothesis test, it was shown that performance expectancy, social influence and price value have a significant positive effect on the intention to use smart farm technology. On the other hand, effort expectancy, facilitating conditions were not tested for a significant influence on the use of smart farm technology. As a result of analyzing the mediating effect of trust, it was found that trust plays a mediating role between performance expectancy, effort expectancy, social influence, facilitating conditions, price value and intention to use smart farm technology. In particular, the effort expectancy has not been tested for a direct significant effect on intention to use smart farm technology, but it has been shown to have an impact through trust. Trust was found to be a full mediating between the effort expectancy and the intention to use the smart farm technology. The current IT level of prospective users has been shown to play a moderating role between performance expectancy, facilitating conditions and intention to use smart farm technology. In particular, the IT level was found to strengthen the relationship between performance expectancy and intention to use smart farm technology. Based on the results of these studies, academic and practical implications were suggested.

• 유기물자원화
• /
• 제10권1호
• /
• pp.128-138
• /
• 2002

폐기물 재활용은 폐기물 관리에 있어서 감량화 다음으로 중요한 개념이다. 폐기물 중 특히 포장폐기물은 재활용시 환경성과 경제성을 지니고 있어 재활용이 용이하다. 그러나 그 중에서도 포장폐기물 중 점점 더 증가 추세에 있는 화장품용기는 재활용품목이 아닌 일반폐기물로 분류되어 버려지고 있다. 화장품 산업의 규모와 비례하여 나타나는 산업쓰레기의 처리문제는 심각한 환경문제를 유발하는 요인이 되고 있다. 또한 화장품은 대부분 플라스틱과 유리 등 복합재료로 만들어져 있어 재활용하기가 어렵다. 화장품용기는 분리수거 하기도 힘이 들고 분리 수거한 용기들도 재질이 복합적이기 때문에 재생이 어려운 경우가 많다. 이에 본 연구에서는 현재의 화장품 용기 재활용과 관련하여 갖고 있는 소비자들의 의식을 조사하였다. 조사결과에 대한 용기 재활용을 위한 증진방안은 다음과 같다. 첫째, 화장품 용기 관련 법 및 제도개선 분야로 화장품법 및 예치금, 부담금 제도 개선과 화장품 용기류 재활용을 위한 기술개발, 리필제품의 확대, 화장품용기만의 회수체계 확립, 생산자의 화장품 재활용 적극 참여 유도가 이루어져야 한다. 둘째, 화장품 용기 디자인 개선 분야로 용기 재질 단순화 및 규격화,화장품 라이프 사이클 확대, 재활용 가능한 재료 선택, 화장품 용기의 비용감소, 기업의 재활용 용기 개발 적극 참여가 이루어져야한다. 결론적으로 포장폐기물 중 화장품 용기의 재활용을 증진하기 위해서는 관련 제도 개선 뿐만 아니라 정부와 기업의 적극적 참여,그리고 소비자들의 적극적 재활용의식이 종합적으로 발전을 이루어야 한다. 그리고 무엇보다도 기업에서 화장품 품질 개선을 위한 투자와 개발 뿐만 아니라 화장품 용기의 환경친화적인 용기 개발을 위하여 많은 노력이 우선시 되어야 할 것이다.

• 마이크로전자및패키징학회지
• /
• 제16권1호
• /
• pp.33-38
• /
• 2009

전자 기기 제품들이 소형화 및 휴대화 되면서 낙하충격 신뢰성에 대한 관심이 높아지고 있다. 본 연구에서는 대표적인 무연솔더인 Sn-3.0Ag-0.5Cu 솔더를 이용하여 ENIG (Electroless Nickel Iimmersion Gold), OSP (Organic Solderability Preservative) 표면 처리와 등온 시효 시험 (High Temperature Storage test)에 따른 보드 레벨 패키지 (board level package)의 낙하충격 신뢰성 (drop reliability) 시험을 수행하였다. 또한 충격 조건을 변화시켜 시편에 가해지는 가속도 (G:acceleration)와 충격 지속 시간 (pulse duration)에 따른 신뢰성을 평가하였다. 기판의 strain측정 결과 중앙 부위가 가장 응력이 컸으며, 충격가속도에 비례하여 응력이 증가하였다. 시효 처리 전에는 OSP처리된 기판이 다소 우수한 신뢰성을 보였지만, 시효 처리후에는 ENIG기판에서 신뢰성이 우수하였고, 반대로 OSP는 감소하는 경향을 보였다. OSP의 경우 과도한 금속간화합물 (intermetallic compound)의 성장으로 인해 접합 계면에서 취성파괴 (brittle fracture)가 일어난 것을 관찰할 수 있었다.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
• /
• pp.233-241
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
• /
• pp.211-219
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국세라믹학회지
• /
• 제52권4호
• /
• pp.229-233
• /
• 2015

Currently, the majority of commercial white LEDs are phosphor converted LEDs made of a blue-emitting chip and YAG yellow phosphor dispersed in organic silicone. However, silicone in high-power devices results in long-term performance problems such as reacting with water, color transition, and shrinkage by heat. Additionally, yellow phosphor is not applicable to warm white LEDs that require a low CCT and high CRI. To solve these problems, mixing of green phosphor, red phosphor and glass, which are stable in high temperatures, is common a production method for high-power warm white LEDs. In this study, we fabricated conversion lenses with LUAG green phosphor, SCASN red phosphor and low-softening point glass for high-power warm white LEDs. Conversion lenses can be well controlled through the phosphor content and heat treatment temperature. Therefore, when the green phosphor content was increased, the CRI and luminance efficiency gradually intensified. Moreover, using high heat treatment temperatures, the fabricated conversion lenses had a high CRI and low luminance efficiency. Thus, the fabricated conversion lenses with green and red phosphor below 90 wt% and 10 wt% with a sintering temperature of $500^{\circ}C$ had the best optical properties. The measured values for the CCT, CRI and luminance efficiency were 3200 K, 80, and 85 lm/w.

• 한국환경보건학회지
• /
• 제27권1호
• /
• pp.27-35
• /
• 2001

This aim of the work presented in this paper is to investigate the factors that affcet chlorine decay and to develop functional relationships that can be used to enhance the durability of network models. predictive relationships were established that correlated the rate of chlorine decay to the various water conditions such as DOC, N $H_3$-N, initial chlorine, contact time, temperature and pH values. Free chlorine residual decreased with increasing temperature, DOC, N $H_3$-N, reaction time and chlorine dose. At 2$0^{\circ}C$, pH 7, The initial chlorine demand per mg as DOC/L and mg as N $H_3$-N/L was about 0.43, 2.69 mg/$\ell$ respectively at 180 minutes contact time. The Reaction between chlorine and humic acids was lasted intil 48hr, but the reaction between chlorine and N $H_3$-N was almost completed in 180 min. When the temperature is raised by 1$0^{\circ}C$, chlorine is more consumed about 0.25 mg/$\ell$ in the absence of organic substances and it is more consumed about 3.4 mg/$\ell$ in the presence of humic acid (5 mg/$\ell$) in water at pH 7 for 180 min. Regression Analysis created the resulting prediction equation for the chlorine decay in a SPSS package of the computer system. The model is as follows; $C_{t}$=1.239+0.707(Co)-0.000529(Time)-0.0112(Temp)+0.02227(pH)-0.42(DOC)-2.132(N $H_3$-N).).

• 한국신재생에너지학회:학술대회논문집
• /
• 한국신재생에너지학회 2011년도 춘계학술대회 초록집
• /
• pp.173.1-173.1
• /
• 2011

The high fuel flexibility of gas turbine power system has boosted their use in a wide variety of applications. Recently, the demand for biogas generated from the digestion of organic wastes and sewage waste water as a fuel for gas turbines has increased. We investigated the performance of high pressure biogas compression system and operating conditions for supplying biogas. The total flow per minute of biogas from food waste water digestion tank is $54Nm^3$. The main type of biogas compression system is the reciprocating system and screw type system. The target of biogas mechanical data is the as belows; inlet pressure 0.045bar, supplying biogas temperature is $30{\sim}60^{\circ}C$, and final pressure is above the 25 bar. Also, inlet conditions of biogas consist of CH4 48.5%~83%, $H_2S$ Max. 500ppm, $NH_3$ Max. 1,500ppm and Siloxane 2.7~4.6ppm. The boosting Blower system raises a pressure from 0.045bar to 1bar before main compressor. The main system lay out of reciprocating consisits of compressor driver, filter, cooling system, blowdown vessel, control system and ESD(Emergency Shut Down) system. And an enclosure package needs to be installed for reducing noise up to 75dB. The system driver is the electronic motor of explosion proof type. Forthe compressor system reliable operation, the cleaning system something like particulate filter needs to be set up in the inlet of compressor and Coalescing Filter in the outlet of compressor. Particulate Filter has to be removed above $10{\mu}m$ size of the particles in biogas. The coalescing filter(Micofine Borosilicate Glass Fibers Filter treated phenol acid) also removes moisture and oil of above $0.3{\mu}m$ to be involved in high pressure biogas up to 90%~98%.

• Journal of the korean society of oceanography
• /
• 제39권1호
• /
• pp.96-106
• /
• 2004

A total of 116 surface sediment samples were obtained on the Yellow Sea and analyzed for grain size and geochemical elements in order to interpret the present sediment transportation. Thirty-nine cores and 3,070 line-km shallow seismic profiles are analyzed for sedimentary records of Yellow Sea in the past. Results show that the boundary of sediment transport between Korean side and Chinese side is about between $123^{\circ}E$ and $124^{\circ}E$. The similar result is produced from Shi et al. (in this publication). Two cyclonic patterns of surface sediments are recognized in the northeastern and southwestern Yellow Sea, while the strong front zone of the mud patch and sandy sediments are found in the southeastern Yellow Sea (the southwestern part of Korean coasts). The formation of fine-particle sediment packages, called for Northwest Mudbelt Deposit (NWMD), Hucksan Mudbelt Deposit (HSMD) and Jeju Mudbelt Deposit (JJMD), are resulted from eddies (gyres) of water circulations in the Yellow Sea. NWMD has been formed by cyclonic (anticlockwise) eddy. NWMD is composed of thick, homogeneous, relatively semi-consolidated gray clay-dominated deposit. On the other hand, HSMD and JJMD are formed by anticyclonic (clockwise) eddies. They are thick, homogeneous, organic-rich gray, silt-dominated deposit. Both core and surface sediments show that the middle zone across Chinese and Korean side contains bimodal frequency of grain-size distribution, indicating that two different transport mechanisms exist. These mud packages are surrounded by sand deposits from both Korea and China seas, indicating that Yellow Sea, which is the shallow sea and epicontinental shelf, is formed mostly by sand deposits including relict sands. The seismic profiles show such as small erosional/non-depositional channels, sand-ridges and sand-waves, Pleistocene-channelfilled deposits, a series of channels in the N-S major channel system, and thick Holocene sediment package, indicating that more complex sedimentary history exists in the Yellow Sea.

• 대한환경공학회지
• /
• 제33권7호
• /
• pp.501-510
• /
• 2011

한강의 주요 14개 지류하천 유역의 수질오염원을 평가하고, 2007. 1~2009. 12의 하천 수질자료(14 data set)로 SPSS-17.0을 이용하여 하천별 수질 특성을 평가하였다. 시 공간변화에 대한 군집 분석을 실시한 결과 공간변화에 따라 4그룹으로 평가되었으며, 유역의 오염원 종류 및 밀도가 군집분류에 가장 큰 영향을 미치는 것으로 나타났다. 시간변화에 따라 여름에서 가을까지(7~10월)와 겨울에서 초여름까지(11~6월)의 2그룹으로 분류되어 강우와 기온 그리고 부영양화 현상이 군집화에 기여하는 것으로 평가되었다. 조사대상 하천의 수질오염 요인은 유기물질 영양염류 세균오염요인과 하천 내 물질대사요인으로(71~90%) 설명되었고, 계절에 따라 주요인(수질오염물질)은 변화하는 것으로 나타났다. 각 하천의 수질특성은 요인과 유역 오염원을 같이 평가하였을 때 유용한 결과를 얻을 수 있었다.