• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.158-161
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• 2003

The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5% acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

• Journal of the Korean institute of surface engineering
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• v.56 no.3
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• pp.180-184
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• 2023

Scholars have proposed wafer-level bonding and three-dimensional (3D) stacked integrated circuit (IC) and have investigated Cu-Cu bonding to overcome the limitation of Moore's law. However, information about quantitative Cu-Cu direct-bonding conditions, such as temperature, pressure, and interfacial adhesion energy, is scant. This study determines the optimal temperature and pressure for Cu-Cu bonding by varying the bonding temperature to 100, 150, 200, 250, and 350 ℃ and pressure to 2,303 and 3,087 N/cm². Various conditions and methods for surface treatment were performed to prevent oxidation of the surface of the sample and remove organic compounds in Cu direct bonding as variables of temperature and pressure. EDX experiments were conducted to confirm chemical information on the bonding characteristics between the substrate and Cu to confirm the bonding mechanism between the substrate and Cu. In addition, after the combination with the change of temperature and pressure variables, UTM measurement was performed to investigate the bond force between the substrate and Cu, and it was confirmed that the bond force increased proportionally as the temperature and pressure increased.

• Korean Journal of Food Science and Technology
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• v.29 no.1
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• pp.57-64
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• 1997

The research was investigated to determine the effect of organic acids or packaging methods (PA) either alone or in combination on the quality of Aster scaber during storages. The Aster scaber was treated with organic acids and PA, and stored at different temperature $(1\;and\;5^{\circ}C)$. Total plate counts, weight loss, color change, and sensory evaluation were evaluated. Both organic acid treatments, PA, and combined treatment had little effect on the inhibition of total plate counts compared to the control (non-treatment). Organic acid treatments showed less weight reduction compared to the control and nitrogen treated package had the least weight reduction, but the combined treatments showed less weight reduction than organic acid treatments or packaging method alone. Organic acid treatments were little different from the control on color change, but nitrogen packages had the least color change, whereas combined treatments were a little reduced, but little different compared to the control or nitrogen packages. The nitrogen packages showed better effects on the sensory evaluation compared to other treatments and the results of sensory evaluation were consistent with that of weight reduction and color change, but not in total counts. All these results showed better effects in $5^{\circ}C$ rather than $1^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.1-10
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• 2018

Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.

• Polymer(Korea)
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• v.30 no.6
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• pp.519-524
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• 2006

Poly(4-vinyl pyridine) (PVP) and its copolymers, poly(4-vinyl pvridine- co-acrylamide) and poly(4-vinyl pyridine-co-allylamine), were synthesized and evaluated for application to organic solder-ability preservatives (OSP). The copolymers were synthesized by radical polymerization of vinyl pyridine in the presence of acrylamide or allylamine as a comonomer. Various kinds of polymers with different chemical composition were synthesized by varying the feed ratio of monomers and their low $M_w$ polymers can be obtained by adding 2-mercaptoethanol as a chain transfer agent during poly-merization. All the polymers showed good adhesion properties on Cu pad when they were spin-coated. Especially, allylamine -containing copolymers showed both good adhesion and solubility properties. Also, they exhibited better thermal stability than PVP homopolymer and such thermal properties were changed depending on the chemical composition and their $M_w$, which were evidenced by the measurement of oxygen induced temperature (OIT). From the OIT measurement, poly(4-vinyl pyridine- co-allylamine) was thermally stable up to $230^{\circ}C$ for 70 min in the 100% oxygen environment. As a result, allylamine-containing copolymers can be considered as a promising OSP coating material that has excellent thermal and adhesive properties applicable to the present microelectronic package processes.

• Korean Journal of Ecology and Environment
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• v.49 no.4
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• pp.279-288
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• 2016

Stable Isotope Analysis(SIA) of carbon and nitrogen is useful tool for the understanding functional roles of target organisms in biological interactions in the food web. Recently, mixing model based on SIA is frequently used to determine which of the potential food sources predominantly assimilated by consumers, however, application of model is often limited and difficult for non-expert users of software. In the present study, we suggest easy manual of R software and package SIAR with example data regarding selective feeding of crustaceans dominated freshwater zooplankton community. We collected SIA data from the experimental mesocosms set up at the littoral area of eutrophic Chodae Reservoir, and analyzed the dominant crustacean species main food sources among small sized particulate organic matters (POM, <$50{\mu}m$), large sized POM (>$50{\mu}m$), and attached POM using mixing model. From the results obtained by SIAR model, Daphnia galeata and Ostracoda mainly consumed small sized POM while Simocephalus vetulus consumed both small and large sized POM simultaneously. Copepods collected from the reservoir showed no preferences on various food items, but in the mesocosm tanks, main food sources for the copepods was attached POM rather than planktonic preys including rotifers. The results have suggested that their roles as grazers in food web of eutrophicated reservoirs are different, and S. vetulus is more efficient grazer on wide range of food items such as large colony of phytoplankton and cyanobacteria during water bloom period.

• Journal of Food Hygiene and Safety
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• v.28 no.2
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• pp.174-180
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• 2013

This study investigated the microbiological contamination of tomato in cultivation and distribution stage. Growth of Escherichia coli O157:H7 and Listeria monocytogens examined in tomato extracts (0.1, 1.0, and 10.0%) and incubation temperatures (5, 15, 25, and $35^{\circ}C$). In cultivation stage of tomato, total aerobic bacteria were 7.77 log CFU/g in gloves of APC (Agricultural Products Processing Center) worker and Bacillus cereus were 0.33 log CFU/g at nutrient tank, respectively. And Staphylococcus aureus, Salmonella spp., were not detected. After APC stage, total aerobic bacteria were significantly higher compared with before-APC stage. Among of general, pesticide-free and organic produce in tomato were no significant difference in microbial contamination. Coliforms of tomato in small vinyl package were significantly higher when compared to tomato in whole boxes package. There was no significant difference in bacteria count between unwashed tomato and washed tomato using tap water for one minute. The growth of E. coli O157:H7 and L. monocytogens in tomato extracts were decreased significantly as the concentration increased, and the microbial population was reached the lowest point during storage in 10% tomato extracts concentration for 72h at $5^{\circ}C$. However, the population of E. coli O157:H7 and L. monocytogens were gradually increased at 7.33~8.51 and 7.73~8.60 log CFU/ml during storage at $15{\sim}35^{\circ}C$ for 72h, respectively.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.11 no.6
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• pp.123-132
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• 2012

Gas sensors has been used very differently that depending on following purposes; Automotive (exhaust gas, fuel mixture gas, oxygen, particulates), agriculture / food industry (fresh, stored, CO2, humidity, NH3, nitrogen oxide gas, organic gas, toxic gas emitted from pesticides and insecticides), industrial / medical (chemical gas, hydrogen, oxygen and toxic gases), military (chemical weapon), environmental measurements (CO and other air pollution consisting of sulfur and nitrogen gas), residential (LNG, LPG, butane, indoor air, humidity). The types of industrial toxic substances are known about 700 species and many of these exist in gaseous form under normal conditions. he multi-gas detection sensors will be developed for casualties that detect the most important and find easy three kinds of gases in marine plant; carbon dioxide(CO2), carbon(CO), ammonia(NH3). Package block consists of gas sensing device minor ingredient, rf front end, zigbee chip. Develope interworking technology between the sensor and zigbee chip inside a package. Conduct a performance test through test jig about prototype zigbee sensor module with rf output power and unwanted emission test. This research task available early address when poisonous gas leaked from large industrial site and contribution for workers' safety at the enclosed space.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.503-509
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• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.

• Journal of the Korea Organic Resources Recycling Association
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• v.5 no.1
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• pp.43-52
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• 1997

This study was conducted to analysis citizen's attitude and style to the foodwaste from loth Sept. to 30th Sept. in 1996. The research was used questionare method and the analysis was used prequency analysis and cross table method by SPSS (scientific statistics). they answered that the most serious environment problem was waste problem and the best way to settle waste problem was to reduce waste production itself. And they answered that to settle environment problems, it was most important for us to change our life style. But It was not agreed between consciousness and action(execution). Because most of the food-related waste was among household waste, it's settlement was the most importment thing than any other. Nevertheless the seperation of waste was essential to effective incineration, the seperation process was not actually conducted and only a few housewife knew the difference of incinerable and non-incinerable waste. The recycling for the disused dry-cells and garbage is not completly. But we think that if the effective government's recycling counterplan for wastes, foodwaste or wasted dry cell, etc., is estabilished, rates of seperation and collection was increasing. Much usuage of onetime vinyl bag for shopping was become the one of the main cause in increasing the package waste, and so it was needed to use the longlife shopping basket.