• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.201-204
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• 2007

In this paper, fully embedded and miniaturized diplexer device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23 dB at 824-894 MHz and -0.7 and -22 dB at 1850-1990 MHz, respectively. Its size is $3.9mm{\times}3.9mm{\times}0.77mm$. The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.39-44
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• 2008

In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.262-263
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• 2007

In this paper, fully embedded and miniaturized diplexer has been designed, fabricated, and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23dB at 824-894MHz and -0.7 and -22dB at 1850-1990MHz, respectively. Its size is 3.9mm$\times$3.9mm$\times$ 0.77mm (height). The fabricated diplexer is the smallest one which is fully embedded into low cost organic package substrate.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.25.1-25.1
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• 2011

Over the past few decades, metallic nanoparticles (NPs) have been of great interest due to their unique mesoscopic properties which distinguish them from those of bulk metals; such as lowered melting points, greater versatility that allows for more ease of processability, and tunable optical and mechanical properties. Due to these unique properties, potential opportunities are seen for applications that incorporate nanomaterials into optical and electronic devices. Specifically, the development of metallic NPs has gained significant interest within the electronics field and technological community as a whole. In this study, gold (Au) pads for surface finish in electronic package were developed by inkjet printing of Au NPs. The microstructures of inkjet-printed Au film were investigated by various thermal treatment conditions. The film showed the grain growth as well as bonding between NPs. The film became denser with pore elimination when NPs were sintered under gas flows of $N_2$-bubbled through formic acid ($FA/N_2$) and $N_2$, which resulted in improvement of electrical conductance. The resistivity of film was 4.79 ${\mu}{\Omega}$-cm, about twice of bulk value. From organic anlayses of FTIR, Raman spectroscopy, and TGA, the amount of organic residue in the film was 0.43% which meant considerable removal of the solvent or organic capping molecules. The solder ball shear test was adopted for solderability and shear strength value was 820 gf (1 gf=9.81 mN) on average. This shear strength is good enough to substitute the inkjet-printed Au nanoparticulate film for electroplating in electronic package.

• Proceedings of the KIPE Conference
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• 2004.07a
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• pp.321-324
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• 2004

This paper presents a package IC containing some components of DC/DC converter block for mobile phone's sub OLED(Organic Light Emitting Display). Package IC contains a load switch, a control IC, a diode, a switch for on/off operation, and a switch for changing output voltage. It operates with switching frequency of 100kHz, within the range of input voltage, $3.2V\~5.5V$. Duty ratio can be changed up to $93\%$, and maximum power efficiency is $85\%$. This package IC is loaded onto three model of 1.2W mobile phone's sub-OLED.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1504-1505
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• 2007

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

• Science of Emotion and Sensibility
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• v.25 no.4
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• pp.53-62
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• 2022

This study was conducted to investigate the effects of the gloss of a product's packaging on purchase intention and the mediating role of perceived corporate eco-friendliness and perceived quality in food area. The participants were randomly assigned to product package condition (glossy vs. matte) and after observing ketchup and potato chips, they responded to questions on about perceived corporate eco-friendliness, perceived quality, and purchase intention. The participants reported their opinion that companies that manufactured matte package products would likely use more organic ingredients and would be more eco-friendly than companies that manufactured glossy package products. The more the participants perceived a company to be eco-friendly, the better they evaluated the company's product quality and the higher their purchase intention. This study has theoretical and practical implications, in that it extends the study of the product package in relation to its effect on corporate image, and it proposes a practical use of matte product package for improving the eco-friendly image of the company. Limitations and further research were also discussed.

• Korean Journal of Organic Agriculture
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• v.5 no.1
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• pp.101-110
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• 1996

Inorder to minimize the daily intake amount of nitrate by chinese cabbage, the favorate vegetable for Korean, the influences of storage conditions at different temperature and light or dark treatments after post-harvest and effects of cooking temperature and infrared rays on changes of nitrate contents in edible parts of chinese cabbage were determined. The nitrate contents on midrib and leaf blade in chinese cabbage during post-harvest were decreased steeply in 2 days and decreased slowly again in 5 days. The temperature treatment to decrease the nitrate contents in midrib and leaf blade of chinese cabbage were effective as the following of $25^{\circ}C$> $15^{\circ}C$ > $-4^{\circ}C$ > $-10^{\circ}C$. The nitrate contents of midrib and leaf blade were decreased in the timecourse of post-harvest. It is more effective to store in $4^{\circ}C$ than in $15^{\circ}C$, and is more effective in transparent vinyl package than in black vinyl package, but the treatment of light is more effective than the treatment of temperature. The nitrate contents of midrib decreased rapidly by 17.9% in the treatment of 5 days at$ 15^{\circ}C$. By treatment of $80^{\circ}C$, $90^{\circ}C$, $100^{\circ}C$ water, the nitrate contents of midrib were increased slightly, but decreased in leaf blade. It reached 68.5%, 50.6%, 45.9% in the leaf blade respectively by treatment of 80%, 90%, 100% water at 1 min. By infrared rays treatment, the nitrate contents of midrib did not change in 3 min but increased rapidly after 6 min, and in the leaf blade it increased continually after 1 min.

• Journal of Power System Engineering
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• v.18 no.6
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• pp.140-145
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• 2014

Exploitation of renewable energies is on the increase to mitigate the reliance on fossil fuels and other natural gases with rocketing prices currently due to the depletion of their reserves not to mention their diverse consequences on the environment. Divergently, there are lots of industries "throwing" heat at higher temperatures as by products into the environment. This waste heat can be recovered through organic Rankine systems and converted to electrical energy with a waste heat recovery organic Rankine cycle system (WHR-ORC). This study uses the annual average condenser effluent from Namhae power plant as heat source and surface seawater as cooling source to analyze a waste heat recovery organic Rankine cycle using the Aspen HYSYS simulation software package. Hydrocarbon mixtures are employed as working fluid and varied in a ratio of 9:1. Results indicate that Pentane/Isobutane (90/10) mixture is the favorable working fluid for optimizing the waste heat recovery organic Rankine cycle at the set simulation conditions.