Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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Design and Fabrication of Miniaturized LC Diplexer Embedded into Organic Substrate

적층 유기기판 내에 내장된 소형 LC 다이플렉서의 설계 및 제작

  • Lee, Hwan-H. (Micro/Nano Devices & Packaging Lab. Department of Electronic Engineering, Kwangwoon University) ;
  • Park, Jae-Y. (Micro/Nano Devices & Packaging Lab. Department of Electronic Engineering, Kwangwoon University) ;
  • Lee, Han-S. (Daeduck Electronics)
  • 이환희 (마이크로/나노 소자 및 패키징 연구실, 전자공학과, 광운대학교) ;
  • 박재영 (마이크로/나노 소자 및 패키징 연구실, 전자공학과, 광운대학교) ;
  • 이한성 (대덕전자)
  • Published : 2007.07.18
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Abstract

In this paper, fully embedded and miniaturized diplexer has been designed, fabricated, and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23dB at 824-894MHz and -0.7 and -22dB at 1850-1990MHz, respectively. Its size is 3.9mm$\times$3.9mm$\times$ 0.77mm (height). The fabricated diplexer is the smallest one which is fully embedded into low cost organic package substrate.

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