• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.315-318
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• 1999

As low-cost optical waveguides of optical interconnects, we fabricate multimode optical waveguides using a molding process The core size of a optical waveguide is 47 ${\mu}{\textrm}{m}$ $\times$ 41 ${\mu}{\textrm}{m}$. We use the photoresist AZ9260 as a master, polydimethyl-siloxane (PDMS) as a mold. In transferring process to polymeric material, we employ a modified micro-transfer molding process. All processes are simple and low-cost.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.9
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• pp.25-32
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• 2009

Recently, research for Network-on-chip(NoC) is progressing. However, due to the increase of system complexity and demand on high performance, conventional copper-based electrical interconnect would be faced with the design limitation of performance, power, and bandwidth. As an alternative to these problems, combined use of Electrical Interconnects(EIs) and Optical Interconnects(OIs) has been introduced. In this paper we propose efficient routing optimization strategy and hybrid switch architecture, which use OIs for critical path and EIs for non-critical path. The proposed method shows up to 25% performance improvement and 38% power reduction.

• ETRI Journal
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• v.39 no.5
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• pp.632-642
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• 2017

Digital all-optical parallel computing is an important research direction and spans conventional devices and convergent nano-optics deployments. Optical bus-based interconnects provide interesting aspects such as relative information communication speed-up or slow-down between optical signals. This aspect is harnessed in the newly proposed All-Optical Linear Array with a Reconfigurable Pipelined Bus System (OLARPBS) model. However, the physical realization of such communication interconnects needs to be considered. This paper considers spatial layouts of processing elements along with the optical bus light paths that are necessary to realize the corresponding interconnection requirements. A metric in terms of the degree of required physical constraint is developed to characterize the variety of possible solutions. Simple algorithms that determine spatial layouts are given. It is shown that certain communication interconnection structures have associated intrinsic topologies.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.7 s.337
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• pp.1-4
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• 2005

A four-channel photoreceiver ways have been realized in a 0.8$\mu$m Si/SiGe HBT technology for the applications of parallel optical interconnects. The receiver array includes four-channel transimpedance amplifiers (TIAs) and p-i-n photodiodes, where the TIAs exploit a common-emitter (CE) input configuration. Measured results demonstrate that the four-channel CE TIA array provides 3.9GHz bandwidth, 62dB$\Omega$ transimpedance gain, 7.5pA/sqrt(Hz) average noise current spectral density, and less than -25dB crosstalk between adjacent channels with 40mW power dissipation.

• Proceedings of the Optical Society of Korea Conference
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• 2009.02a
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• pp.491-492
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• 2009

We have fabricated a microlens integrated silicon (Si) structure for optical interconnects. To form microlenses, the Si wafer was wet-etched with $SiN_x$ mask in a HF:$HNO_3:C_2H_4O_2$ solution and then the holes were filled with a AZ9260 photoresist. The focal length of microlens increased in proportional to its radius of curvature (ROC). For the ROC of $100-161{\mu}m$, the focal lengths were obtained approximately between $160{\mu}m$ and $310{\mu}m$, in an agreement with the simulated values using a ray tracing method.

• Journal of the Optical Society of Korea
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• v.17 no.1
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• pp.44-49
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• 2013

A transimpedance amplifier (TIA)-optical receiver (Rx) using two intersecting active feedback system with regulated-cascode (RGC) input stage has been designed and implemented for optical interconnects. The optical TIA-Rx chip is designed in a 0.13 ${\mu}m$ CMOS technology and works up to 10 Gbps data rate. The TIA-Rx chip core occupies an area of 0.051 $mm^2$ with power consumption of 16.9 mW at 1.3 V. The measured input-referred noise of optical TIA-Rx is 20 pA/${\surd}$Hz with a 3-dB bandwidth of 6.9 GHz. The proposed TIA-Rx achieved a high gain-bandwidth product per DC power figure of merit of 408 $GHz{\Omega}/mW$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.8
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• pp.25-32
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• 2011

Networks-on-chip (NoC) is emerging as a key technology to overcome severe bus traffics in ever-increasing complexity of the Multiprocessor systems-on-chip (MPSoC); however traditional electrical interconnection based NoC architecture would be faced with technical limits of bandwidth and power consumptions in the near future. In order to cope with these problems, a hybrid optical NoC architecture which use both electrical interconnects and optical interconnects together, has been widely investigated. In the hybrid optical NoCs, wormhole switching and simple deterministic X-Y routing are used for the electrical interconnections which is responsible for the setup of routing path and optical router to transmit optical data through optical interconnects. Optical NoC uses circuit switching method to send payload data by preset paths and routers. However, conventional hybrid optical NoC has a drawback that concurrent transmissions are not allowed. Therefore, performance improvement is limited. In this paper, we propose a new routing algorithm that uses circuit switching and adaptive algorithm for the electrical interconnections to transmit data using multiple paths simultaneously. We also propose an efficient method to prevent livelock problems. Experimental results show up to 60% throughput improvement compared to a hybrid optical NoC and 65% power reduction compared to an electrical NoC.

• Macromolecular Research
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• v.12 no.3
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• pp.290-292
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• 2004

Multimode channel waveguides were fabricated using a direct UV patterning technology from thick films deposited by the one-step dip-coating of an organic/inorganic hybrid material (ORMOCER(equation omitted). The core size of the covered ridge waveguide was 43${\times}$51 $\mu\textrm{m}$$^2$; the waveguides can be readily prepared for multimode applications by direct UV patterning. The waveguides exhibited smooth surface profiles and a low optical loss of 0.07 ㏈/cm at the most important wavelength (850nm) used for optical interconnects.

• IEIE Transactions on Smart Processing and Computing
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• v.4 no.5
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• pp.318-323
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• 2015

We present a new way to create a thermally stable, highly strained germanium (Ge) optical resonator using a novel Ge-on-dual-insulators substrate. Instead of using a conventional way to undercut the oxide layer of a Ge-on-single-insulator substrate for inducing tensile strain in germanium, we use thin aluminum oxide as a sacrificial layer. By eliminating the air gap underneath the active germanium layer, we achieve an optically insulating, thermally conductive, and highly strained Ge resonator structure that is critical for a practical germanium laser. Using Raman spectroscopy and photoluminescence experiments, we prove that the novel geometry of our Ge resonator structure provides a significant improvement in thermal stability while maintaining good optical confinement.

• Macromolecular Research
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• v.12 no.5
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• pp.474-477
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• 2004

We present simple, low-cost methods for the fabrication of polymeric waveguides that have large core sizes for use as optical interconnects. We have used both hot embossing and micro-contact printing techniques for the fabrication of multimode waveguides using the same materials. Rectangular and large-core (60${\times}$60 $\mu\textrm{m}$$^2$) channels were readily prepared when using these methods. The dimensions of the embossed and printed channels were the same as those of the pattern on the original master. The polymeric waveguides that we fabricated with large core sizes exhibited a low propagation loss of 0.1 dB/cm at 850 nm, which indicates that hot embossing and micro-contact printing are suitable techniques for the fabrication of optical waveguides having large-core.