• Title/Summary/Keyword: optical fabrication

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Low-Cost Fabrication of Multimode Optical Waveguides for Optical Interconnects (광 연결을 위한 저가형 멀티모드 광 도파로의 제작)

  • 이병탁;권민석;윤준보;신상영
    • Proceedings of the IEEK Conference
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    • 1999.06a
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    • pp.315-318
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    • 1999
  • As low-cost optical waveguides of optical interconnects, we fabricate multimode optical waveguides using a molding process The core size of a optical waveguide is 47 ${\mu}{\textrm}{m}$ $\times$ 41 ${\mu}{\textrm}{m}$. We use the photoresist AZ9260 as a master, polydimethyl-siloxane (PDMS) as a mold. In transferring process to polymeric material, we employ a modified micro-transfer molding process. All processes are simple and low-cost.

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Fabrication of Multimode Waveguide Devices for Optical Interconnection (광 연결용 다중모드 광도파로 소자의 제작)

  • 김상균;권민석;신상영
    • Proceedings of the Optical Society of Korea Conference
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    • 2001.02a
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    • pp.32-33
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    • 2001
  • 근거리 통신망에서 데이터 전송량이 매우 증가함에 따라 근거리 통신에도 광통신을 적용하려는 연구가 활발히 진행 중이다. 광통신을 근거리 통신에 적용하려는 분야로는 랜, 댁내 망 (home network), 광 연결 (optical interconnect), 광 클럭 분배 (optical clock distribution) 등이 있다 그 중에 댁내 망의 경우 플라스틱 광섬유 (plastic optical fiber)를 이용하여 가정 내에 광통신을 적용하려는 연구가 진행 중이다. (중략)

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Design and Fabrication of a Polarization-Independent 1 ${\times}$ 8 InGaAsP/InP MMI Optical Splitter (편광에 무관한 1 ${\times}$ 8 InGaAsP/InP 다중모드간섭 광분배기의 설계 및 제작)

  • Yu, Jae-Su;Moon, Jeong-Yi;Bae, Seong-Ju;Lee, Yong-Tak
    • Proceedings of the Optical Society of Korea Conference
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    • 2000.08a
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    • pp.28-29
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    • 2000
  • Optical power splitters and/or couplers are important components for optical signal distribution between channels both in wavelength division multiplexing(WDM) systems and photonic integrated circuits(PICs). Since polarization is usually not known after propagation in an optical fiber, passive WDM components have to be polarization insensitivity, Compared to alternatives such as directional couplers or Y-junction splitters, splitters based on multimode interference(MMI) have found a growing interest in recent yens because of their desirable characteristics, such as compact size, low excess loss, wide bandwidth, polarization independence, and relaxed fabrication tolerances$^{(1)}$ . These devices have been fabricated in polymers, silica, or III-V semiconductor materials. A1 $\times$ 4 MMI power splitter on InP materials that were suitable for application in the 1.55-${\mu}{\textrm}{m}$ region$^{(2)}$ . However, the fabrication process of the structure is too complicated and the photolithography tolerance is very tight. Also, a 1 $\times$ 16 InGaAsP/InP MMI power splitter with an excess loss of 2.2dB and a splitting ratio of 1.5dB was demonstrated by using deep etching$^{(3)}$ . The deep etching of the sidewalls through the entire guide layer of the slab waveguide resulted in a number of drawbacks$^{(4)}$ . (omitted)

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Dual Band Optical Window (DBW) for Use on an EO/IR Airborne Camera

  • Park, Kwang-Woo;Park, Sang-Yeong;Kim, Young-Soo;Kim, Ki-Ho;Choi, Young-Soo
    • Journal of the Optical Society of Korea
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    • v.16 no.1
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    • pp.63-69
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    • 2012
  • This paper presents a method to derive the theoretical requirements for the development of a 400 mm optical window that transmits dual-band wavelengths and had a stable structure. We also present design and fabrication results. Among the required specifications, the surface figure error was defined by the transmitted wavefront deformation (TWD), ${\lambda}$/15 rms at 632.8 nm. This value was derived by estimating the predicted performances with respect to five independent items that could cause system performance degradation and then calculating the required wavefront error (WFE) to satisfy the performance goals. We measured the image resolution at each performance level to trace and verify the requirements. The article also describes a design optimization process that could minimize the weight and volume of the optical window attached to the payload securing the FOV of the camera. In addition, we accurately measured the deformation that occurred in the series of fabrication steps including processing, coating, assembly, bonding and bolting, and investigated the effects by comparing them to the results of a simulation performed in advance to derive the predicted performance.