• Title/Summary/Keyword: optical chip

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Investigation of Chemotactic Activities in Differentiated HL-60 Cells by a Time-lapse Videomicroscopic Assay

  • Jung, Yun-Jae;Woo, So-Youn;Ryu, Kyung-Ha;Jang, Myoung-Ho;Miyasaka, Masayuki;Seoh, Ju-Young
    • IMMUNE NETWORK
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    • v.6 no.2
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    • pp.76-85
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    • 2006
  • Background: Chemotaxis is one of the cardinal functions of leukocytes, which enables them to be recruited efficiently to the right place at the right time. Analyzing chemotactic activities is important not only for the study on leukocyte migration but also for many other applications including development of new drugs interfering with the chemotactic process. However, there are many technical limitations in the conventional in vitro chemotaxis assays. Here we applied a new optical assay to investigate chemotactic activities induced in differentiated HL-60 cells. Methods: HL-60 cells were stimulated with 0.8% dimethylformamide (DMF) for 4 days. The cells were analyzed for morphology, flow cytometry as well as chemotactic activities by a time-lapse videomicroscopic assay using a chemotactic microchamber bearing a fibronectin-coated cover slip and an etched silicon chip. Results: Videomicroscopic observation of the real cellular motions in a stable concentration gradient of chemokines demonstrated that HL-60 cells showed chemotaxis to inflammatory chemokines (CCL3, CCL5 and CXCL8) and also a homeostatic chemokine (CXCL12) after DFM-induced differentiation to granulocytic cells. The cells moved randomly at a speed of $6.99{\pm}1.24{\mu}m/min$ (n=100) in the absence of chemokine. Chemokine stimulation induced directional migration of differentiated HL-60 cells, while they still wandered very much and significantly increased the moving speeds. Conclusion: The locomotive patterns of DMF-stimulated HL-60 cells can be analyzed in detail throughout the course of chemotaxis by the use of a time-lapse videomicroscopic assay. DMF-stimulated HL-60 cells may provide a convenient in vitro model for chemotactic studies of neutrophils.

Analysis of Process Parameters to Improve On-Chip Linewidth Variation

  • Jang, Yun-Kyeong;Lee, Doo-Youl;Lee, Sung-Woo;Lee, Eun-Mi;Choi, Soo-Han;Kang, Yool;Yeo, Gi-Sung;Woo, Sang-Gyun;Cho, Han-Ku;Park, Jong-Rak
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.2
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    • pp.100-105
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    • 2004
  • The influencing factors on the OPC (optical proximity correction) results are quantitatively analyzed using OPCed L/S patterns. ${\sigma}$ values of proximity variations are measured to be 9.3 nm and 15.2 nm for PR-A and PR-B, respectively. The effect of post exposure bake condition is assessed. 16.2 nm and 13.8 nm of variations are observed. Proximity variations of 11.6 nm and 15.2 nm are measured by changing the illumination condition. In order not to seriously deteriorate the OPC, these factors should be fixed after the OPC rules are extracted. Proximity variations of 11.4, 13.9, and 15.2 nm are observed for the mask mean-to-targets of 0, 2 and 4 nm, respectively. The decrease the OPC grid size from 1 nm to 0.5 nm enhances the correction resolution and the OCV is reduced from 14.6 nm to 11.4 nm. The enhancement amount of proximity variations are 9.2 nm corresponding to 39% improvement. The critical dimension (CD) uniformity improvement for adopting the small grid size is confirmed by measuring the CD uniformity on real SRAM pattern. CD uniformities are measured 9.9 nm and 8.7 nm for grid size of 1 nm and 0.5 nm, respectively. 22% improvement of the CD uniformity is achieved. The decrease of OPC grid size is shown to improve not only the proximity correction, but also the uniformity.

Optical Properties as Process Condition of Color Conversion Lens Using Low-softening Point Glass for White LED (백색 LED용 저 연화점 유리를 이용한 색 변환 렌즈의 제조 조건에 따른 광 특성)

  • Chae, Yoo-Jin;Lee, Mi-Jai;Hwang, Jong-Hee;Lim, Tae-Young;Kim, Jin-Ho;Jeong, Hee-Suk;Lee, Young-Sik;Kim, Deug-Joong
    • Journal of the Korean Ceramic Society
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    • v.50 no.6
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    • pp.454-459
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    • 2013
  • Recently, remote phosphors have been reported for application to white LEDs to provide enhanced phosphor efficiency compared with conventional phosphor-based white LEDs. In this study, a remote phosphor was produced by coating via screen printing on a glass substrate with different numbers of phosphor coating. The paste consists of phosphor, lowest softening glass frits, and organic binders. The remote phosphor could be well controlled by varying the phosphor content rated paste. After mounting the remote phosphor on top of a blue LED chip, CCT, CRI, and luminance efficiency were measured and values of 5300 K, 62, and 117 lm/W were respectively obtained in the 80 wt% phosphor with 3 coating layers sintered at $800^{\circ}C$.

Optical Properties of Color Conversion Lens for White LED Using B2O3-Bi2O3-ZnO Glass (B2O3-Bi2O3-ZnO계 유리를 이용한 백색 LED용 색변환 렌즈의 광 특성)

  • Chae, Yoo-Jin;Lee, Mi-Jai;Kim, Jin-Ho;Hwang, Jong-Hee;Lim, Tae-Young;Jeong, Hee-Suk;Lee, Young-Sik;Kim, Deuk-Jung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.8
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    • pp.614-619
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    • 2013
  • Recently, remote phosphor is reported for white LED enhancing of phosphor efficiency compared with conventional phosphor-based W-LED. In this study, Remote phosphor was produced by screen printing coating on glass substrate with phosphor contents rated paste and heat treatment. The paste consists of phosphor, lowest softening glass frit and organic binders. Remote phosphor can be well controlled by varying the phosphor content rated paste. After mounting remote phosphor on top of blue LED chip, CCT, CRI, and luminance efficiency were measured. The measurement results showed that CCT, CRI, and luminance efficiency were 6,645, 68, and 1,16l m/W in phosphor 80 wt.% remote phosphor sintered at $600^{\circ}C$.

Thermal Characteristics of the design on Residential 13.5W COB LED Down Light Heat Sink (주거용 13.5W COB LED 다운라이트 방열판 설계에 따른 열적 특성 분석)

  • Kwon, Jae-hyun;Lee, Jun-myung;Kim, Hyo-jun;Kang, Eun-young;Park, Keon-jun
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.7 no.1
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    • pp.20-25
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    • 2014
  • There are several severe problems for LED device, the next generation's economy green lighting: as the temperature increases, the lamp efficiency decreases; if the temperature is over $80^{\circ}C$, the lifetime of lighting decreases; Red Shift phenomenon that wavelength of spectrum line moves toward long wavelength occurs; and optical power decreases as $T_j$ increases. Thus, Heat sink design that can minimize the heat of LED device is currently in progress. While the thermal resistance of COB Type LED was reduced by direct coupling of LED chip to the board, residential 13.5W requires Heat sink in order resolve heat issue. This study designed Heat Sink suitable for residential 13.5W COB LED down-light and selected the optimum Fin thickness through flow simulation that packaged the designed Heat Sink and 13.5W COB. And finally it analyzed and evaluated the thermal modes using contacting thermometer.

Improved Thermal Resistance of an LED Package Interfaced with an Epoxy Composite of Diamond Powder Suspended in H2O2 (과산화수소 적용 TIM의 LED 패키지 열특성 개선효과)

  • Choi, Bong-Man;Hong, Seong-Hun;Jeong, Yong-Beom;Kim, Ki-Bo;Lee, Seung-Gol;Park, Se-Geun;O, Beom-Hoan
    • Korean Journal of Optics and Photonics
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    • v.25 no.4
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    • pp.221-224
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    • 2014
  • We present a method for manufacturing a TIM used for packaging a high-power LED. In this method a mixture of diamond powder and hydrogen peroxide is used as a filler epoxy. The thermal resistance of the TIM with hydrogen peroxide was improved by about 30% over the thermal resistance of the TIM without hydrogen peroxide. We demonstrate that as a result the heat generated from the chip is easily dissipated through the TIM.

Enhancement of Light Extraction in White LED by Double Molding (이중 몰딩에 의한 백색 LED의 광추출 효율 향상)

  • Jang, Min-Suk;Kim, Wan-Ho;Kang, Young-Rea;Kim, Ki-Hyun;Song, Sang-Bin;Kim, Jin-Hyuk;Kim, Jae-Pil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.10
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    • pp.849-856
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    • 2012
  • Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

A fiber optic surface plasmon resonance (SPR) sensorusing cyclic olefin copolymer (COC) polymer prism (Cyclic olefin copolymer (COC) 폴리머 프리즘을 사용한 광섬유 기반 표면 플라즈몬 공명 (SPR) 바이오 센서)

  • Yun, Sung-Sik;Lee, Soo-Hyun;Ahn, Chong-H.;Lee, Jong-Hyun
    • Journal of Sensor Science and Technology
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    • v.17 no.5
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    • pp.369-374
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    • 2008
  • A novel fiber optic surface plasmon resonance (SPR) sensor using cyclic olefin copolymer (COC) prism with the spectral modulation is presented. The SPR sensor chip is fabricated using the SU-8 photolithography, Ni-electroplating and COC injection molding process. The sidewall of the COC prism is partially deposited with Au/Cr (45/2.nm thickness) by e-beam evaporator, and the thermal bonding process is conducted for micro fluidic channels and optical fibers alignment. The SPR spectrum for a phosphate buffered saline (0.1.M PBS, pH.7.2) solution shows a distinctive dip at 1300.nm wavelength, which shifts toward longer wavelength with respect to the bovine serum albumin (BSA)concentrations. The sensitivity of the wavelength shift is $1.16\;nm{\cdot}{\mu}g^{-1}{\cdot}{\mu}l^{-1}$. From the wavelength of SPR dips, the refractive indices (RI) of the BSA solutions can be theoretically calculated using Kretchmann configuration, and the change rate of the RI was found to be $2.3{\times}10^{-5}RI{\cdot}{\mu}g^{-1}{\cdot}l^{-1}$. The realized fiber optic SPR sensor with a COC prism has clearly shown the feasibility of a new disposable, low cost and miniaturized SPR biosensor for biochemical molecular analyses.

Light Extraction Improvement of 400 nm Wavelength GaN-Based Light-Emitting Diode by Textured Structures (거친 표면구조를 이용한 400 nm 파장 GaN계 발광다이오드의 광 추출효율 개선)

  • Kim, Duck-Won;Yu, Soon-Jae;Seo, Ju-Ok;Kim, Hee-Tae;Seo, Jong-Wook
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.10 no.7
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    • pp.1514-1519
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    • 2009
  • We fabricated the GaNLED emitting 400 nm wavelength and improved the optical extraction efficiency by making surface patterns on n-GaN layer and ITO layer above p-GaN. In addition, the light reflection metal under the n and p pad is made and the light reflection metal is installed on the backside of the chip. The light extraction efficiency is increased by 20 % with texturing n-GaN layer and 18% with texturing ITO layer at 20 mA. Compared to planar-surface LED, the light extraction efficiency for surface texturing both n-GaN and ITO is increased by 32% at 20mA.

Multiple-Point-Diffraction Interferometer : Error Analysis and Calibration (거친 표면 형상측정을 위한 점광원 절대간섭계의 오차해석과 시스템 변수의 보)

  • Kim, Byoung-Chang;Kim, Seung-Woo
    • Korean Journal of Optics and Photonics
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    • v.16 no.4
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    • pp.361-365
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    • 2005
  • An absolute interferometer system with multiple point-sources is devised for tile 3-D measurement of rough surface profiles. The positions of the point sources are determined to be the system parameters that influence the measurement accuracy, so they are calibrated precisely prior to performing actual measurements. For the calibration, a CCD camera composed of a two-dimensional array of photo-detectors was used. Performing optimization of the cost function constructed with phase values measured at each pixel on the CCD camera, the position coordinates of each point source is precisely determined. Measurement results after calibration performed for the warpage inspection of chip scale packages (CSPs) demonstrate that the maximum discrepancy is 9.8 mm with a standard deviation o( 1.5 mm in comparison with the test results obtained by using a Form Taly Surf instrument.