• Title/Summary/Keyword: optical chip

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Demonstration of Nonpolar a-plane Light Emitting Diodes on r-plane Sapphire Substrate by MOCVD

  • Son, Ji-Su;Baik, Kwang-Hyeon;Song, Hoo-Young;Kim, Ji-Hoon;Kim, Tae-Geun;Hwang, Sung-Min
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.147-147
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    • 2011
  • High crystalline nonpolar a-plane (11-20) nitride light emitting diodes (LEDs) have been fabricated on r-plane (1-102) sapphire substrates by metalorganic chemical-vapor deposition (MOCVD). The multi-quantum wells (MQWs) active region is consists of 4 periods the nonpolar a-plane InGaN/GaN(a-InGaN/GaN) on a high quality a-plane GaN (a-GaN) template grown by using the multibuffer layer technique. The full widths at half maximum (FWHMs) of x-ray rocking curve (XRC) obtained from phiscan of the specimen that was grown up to nonpolar a-plane GaN LED layers with double crystal x-ray diffraction. The FWHM values were decreased down to 477 arc sec for $0^{\circ}$ and 505 arc sec for $-90^{\circ}$, respectively. After fabricating a conventional lateral LED chip which size was $300{\times}600{\mu}m^2$, we measured the optical output power by on-wafer measurements. N-electrode was made with Cr/Au contact, and ITO on p-GaN was formed with Ohmic contact using Ni/Au followed by inductively coupled plasma etching for mesa isolation. The optical output power of 1.08 mW was obtained at drive current of 20 mA with the peak emission wavelength of 502 nm.

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Practical Packaging Technology for Microfluidic Systems (미소유체시스템을 위한 실용적인 패키징 기술)

  • Lee, Hwan-Yong;Han, Song-I;Han, Ki-Ho
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.34 no.3
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    • pp.251-258
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    • 2010
  • This paper presents the technology for the design, fabrication, and characterization of a microfluidic system interface (MSI); the purpose of this technology is to enable the integration of complex microfluidic systems. The MSI technology can be applied in a simple manner for realizing complex arrangements of microfluidic interconnects, integrated microvalves for fluid control, and optical windows for on-chip optical processes. A microfluidic system for the preparation of genetic samples was used as the test vehicle to prove the effectiveness of the MSI technology for packaging complex microfluidic systems with multiple functionalities. The miniaturized genetic sample preparation system comprised several functional compartments, including compartments for cell purification, cell separation, cell lysis, solid-phase DNA extraction, polymerase chain reaction, and capillary electrophoresis. Additionally, the functional operation of the solid-phase extraction and PCR thermocycling compartments was demonstrated by using the MSI.

Implementation of Stereoscopic 3D Video Player System Having Less Visual Fatigue and Its Computational Complexity Analysis for Real-Time Processing (시청피로 저감형 S3D 영상 재생 시스템 구현 및 실시간 처리를 위한 알고리즘 연산량 분석)

  • Lee, Jaesung
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.12
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    • pp.2865-2874
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    • 2013
  • Recently, most of movies top-ranked in the box office are screening in Stereoscopic 3D, and the world's leading electronics companies such as Samsung and LG are getting the hots for 3DTV sales. However, each person has different binocular disparity and different viewing distance, and thus he or she feels the severe visual fatigue and headaches if he or she is watching 3D content with the same binocular disparity, which is very different from things he or she feels in the real world. To solve this problem, this paper proposes and implement a 3D rendering system that correct the disparity of 3D content by reflecting binocular distance and viewing distance. Then, the computational complexity is analyzed. Optical-flow and Warping algorithms turn out to consume 732 seconds and 5.7 seconds per frame, respectively. Therefore, a dedicated chip-set for both blocks is strongly required for real-time HD 3D display.

Influence of Blue-Emission Peak Wavelength on the Reliability of LED Device (청색 피크 파장이 LED 소자에 미치는 영향)

  • Han, S.H.;Kim, Y.J.;Kim, J.H.;Jung, J.Y.;Kim, H.C.;Cho, G.S.
    • Journal of the Korean Vacuum Society
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    • v.21 no.3
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    • pp.164-170
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    • 2012
  • The dependance of degradation on the blue-peak wavelength is investigated with the blue light-emitting diode (LED) of InGaN/GaN with respect to the optical and the electrical characteristics of the devices. The LED devices emitting the blue-peak wavelength ranging from 437 nm to 452 nm is prepared to be stressed for a long aging time with three different currents of 60 mA, 75 mA and 90 mA, respectively. The degradation of optical intensity is observed with and without phosphor in the devices. The device without phosphor has been degraded significantly as the wavelength of blue-peak is decreased while the optical intensity of LED device with phosphor become less sensitive than that of device without phosphor. The electrical property does not depend on the emission peak wavelength. However, the series-resistance of LED device is slowly increased as the aging time is increased. The deformation of device is observed severely the short wavelength of blue-peak even with the same current since the short wavelength is absorbed substantially at the materials of device during the aging time. Consequently, in order to enhance the lifetime of LED devices, it is important to understand the optical degradation property of the materials against the specific wavelengths emitted from the blue chip.

Low Power Digital Servo Architecture for Optical Disc (광디스크 디지털 서보의 저전력 구현 아키텍쳐)

  • Huh, Jun-Ho;Kim, Soo-Won
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.38 no.2
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    • pp.31-37
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    • 2001
  • Digital servo implementation in optical servo chip has been spotlighted since it is easy to integrate with other blocks and it has less sensitive characteristics change in terms of temperature variation and better flexibility to the system variation like pick-up. Therefore, Optical disc players adopted digital servo are increasing in market. However, one drawback of digital signal processor embedded digital servo is power consumption that is one of the most important factors of portable optical disc player system. For that reason, this paper introduces new architecture to reduce power consumption of digital servo by means of reducing DSP load but increasing minimum hardware size. The main idea of reducing power consumption of digital servo greatly is utilizing CDP characteristics as most operations are done and used up most operating steps of DSP at the initial time, but most power consumption is occurred in play mode. Therefore, if operating steps for digital filtering in play mode could be reduced greatly, power consumption of overall system can be reduced greatly. This paper shows an example that low power digital servo architecture whose current is reduced almost 83%, compare to that of digital servo which is not applied by the low power architecture introduced in this paper.

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LED Source Optimization for the LED Chip Array of the LED Luminaires (LED 조명기구에서 LED 칩 배치에 따른 광원 최적화)

  • Yoon, Seok-Beom;Chang, Eun-Young
    • Journal of Digital Convergence
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    • v.14 no.4
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    • pp.419-424
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    • 2016
  • In this paper, we studied a light distribution for the LED chips arrangement using an optical design software. The structures of the edge type LED luminaires are reflector plane, LGP(lighting guide plane) and diffuse plane. The reflector plane is on the middle of the overall structure. We had simulation that placing LED chips on the reflector center of the reflector edge by changing the position of LED chips above the reflector center at 1mm, 2mm, and 3mm respectively. In the case, when LED chips are on the center of the reflector, it shows the light distribution of the general diffuse illumination, the semi-direct distribution with 0.56 efficiency and the direct distribution with 0.31 efficiency. And the wedge type LGP shows more efficiency than the flat type. Gradually increasing shape of semi-spherical type by 0.015mm has power of 1.02W, efficiency of 0.25, and maximum luminous intensity of 0.104W/sr, it also and shows the better optical characteristics than the reflector plane that have no patterns. This semi-spherical type shows the better optical characteristics than the reflector plane that have no patterns.

Application of an Interferometric Biosensor Chip to Biomonitoring an Endocrine Disruptor

  • Kim, Byung-Woo;Lim, Sung-Hyuk
    • Biotechnology and Bioprocess Engineering:BBE
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    • v.9 no.2
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    • pp.118-126
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    • 2004
  • Recombinant E.coli ACV 1003 (recA::lacZ) releasing ${\beta}$-galactosidase by a SOS regulon system, when exposed to DNA-damaging compounds, have been used to effectively monitor endocrine disruptors. Low enzyme activity of less than 10 units/mL, corresponding to a $\mu\textrm{g}$/L(ppb) range of an endocrine disruptor (tributyl tin, bisphenol A. etc.), can be rapidly determined, not by a conventional time-consuming and tedious enzyme assay, but by an alternative interferometric biosensor. Heavily boron-doped porous silicon for application as an interferometer, was fabricated by etching to form a Fabry-Perot fringe pattern, which caused a change in the refractive index of the medium including ${\beta}$-galactosidase. In order to enhance the immobilization of the porous silicon surface, a calyx crown derivative (ProLinker A) was applied, instead of a conventional biomolecular affinity method using biotin. This resulted in a denser linked formation. The change in the effective optical thickness versus ${\beta}$-galactosidase activity, showed a linear increase up to a concentration of 150 unit ${\beta}$-galactosidase/mL, unlike the sigmoidal increase pattern observed with the biotin.

Wafer state prediction in 64M DRAM s-Poly etching process using real-time data (실시간 데이터를 위한 64M DRAM s-Poly 식각공정에서의 웨이퍼 상태 예측)

  • 이석주;차상엽;우광방
    • 제어로봇시스템학회:학술대회논문집
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    • 1997.10a
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    • pp.664-667
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    • 1997
  • For higher component density per chip, it is necessary to identify and control the semiconductor manufacturing process more stringently. Recently, neural networks have been identified as one of the most promising techniques for modeling and control of complicated processes such as plasma etching process. Since wafer states after each run using identical recipe may differ from each other, conventional neural network models utilizing input factors only cannot represent the actual state of process and equipment. In this paper, in addition to the input factors of the recipe, real-time tool data are utilized for modeling of 64M DRAM s-poly plasma etching process to reflect the actual state of process and equipment. For real-time tool data, we collect optical emission spectroscopy (OES) data. Through principal component analysis (PCA), we extract principal components from entire OES data. And then these principal components are included to input parameters of neural network model. Finally neural network model is trained using feed forward error back propagation (FFEBP) algorithm. As a results, simulation results exhibit good wafer state prediction capability after plasma etching process.

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Design Optimization for High Efficiency Distributed Bragg Reflectors through Simulation Methodology (시뮬레이션을 이용한 고효율 분산 브래그 반사경 최적화 설계 및 특성)

  • Kim, Kwan-Do
    • Journal of IKEEE
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    • v.22 no.1
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    • pp.189-192
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    • 2018
  • This study focused on the development of simulation methodology and design optimization for the DBR(Distributed Bragg Reflectors) structures, which are commonly used in manufacturing optical films and the key components of LED chip and LCD inspection equipments. From the multi-layer simulation, the following results are obtained. First, the wavelength(nm) vs. reflectance(%) can be calculated in the DBR structures that $TiO_2$ and $SiO_2$ thin films are stacked alternately. As a results, it is suggested that highly efficient DBR structures can be designed and manufactured using simulation methodology.

Thermal Characteristics of a Heat Sink with Helical Fin Structure for an LED Lighting Fixture (헬리컬 핀 구조를 가진 LED 조명용 히트싱크의 열 특성)

  • Kim, Young-Hoon;Yim, Hae-Dong;O, Beom-Hoan
    • Korean Journal of Optics and Photonics
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    • v.25 no.6
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    • pp.311-314
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    • 2014
  • In this paper, we design a helical fin structure for the heat sink for a high-power LED lighting module, and analyze its thermal properties. By means of the helical fin structure, we can obtain about 14% larger surface area for the limited volume and it can decrease the LED chip temperature by about 12%. Because this helical fin heat sink has 15% less total volume than a conventional one, we can also expect to reduce the production cost due to these structural properties.