• 조명전기설비학회논문지
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• 제25권2호
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• pp.10-18
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• 2011

In order to develop highly-integrated RGBY(Red, Green, Blue, Yellow) LED light, a high thermal radiation ceramic package was manufactured, and the encapsulation process was applied with a vacuum printing encapsulation system(VPES). After the completion of vacuum printing, the shape of the encapsulation layer could be controlled by heat treatment during the curing process, and the optical power became highly increased as the encapsulation layer approached a dome shape. The optical characteristics involved in a Correlated Color Temperature(CCT), a Color Rendering Index (CRI), and the efficiency of RGBY LED light were able to be identified by the experimental designing method. Regarding the characteristics of the white light of RGBY LED light, which were measured on the basis of the aforementioned optical characteristics, CRI posted 88, CCT recorded 5,720[$^{\circ}K$], and efficiency exhibited 52[lm/W]. The chip temperature of RGBY LEDs was below 55[$^{\circ}C$] when the consumption power of LED chips was 0.1[W] for the red, 0.3[W] for the green, 0.08[W] for the blue, and 0.24[W] for the yellow. Also, the thermal resistance of the highly-integrated RGBY LED light measured by T3Ster was 2.3[K/W].

• 반도체디스플레이기술학회지
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• 제18권1호
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• pp.10-14
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• 2019

In this study, we synthesized two $Y_3Al_5O_{12}:Ce^{3+}$ phosphors ($7{\mu}m$-sized and $2{\mu}m$-sized YAG) with different sizes by controlling particles sizes of starting materials of the phosphors for white LED. In the smaller one ($2{\mu}m$-sized YAG), its photoluminescence intensity in the reflective mode was 63 % that of the bigger one ($7{\mu}m$-sized YAG); the quantum efficiencies were 93 % and 70 % for the smaller and the bigger ones. Two kinds of white LED packages with the same color coordinates were fabricated with a blue package (chip size $53{\times}30$) and two phosphors. The luminous flux of the white LED package with the smaller YAG phosphor was 92 % of that with the bigger one, indicating that the quantum efficiency of phosphor dispersed inside LED package was higher than that of the pure powder. It was consistently confirmed by the optical simulation (LightTools 6.3). It is notable according to the optical simulation that the white LED with the smaller phosphor showed 24 % higher luminous efficiency. If the smaller one had the same quantum efficiency as the bigger one (~93 %). Therefore, it can be suggested that the higher luminous efficiency of white LED can be possible by reducing the particle size of the phosphor along with maintaining its similar quantum efficiency.

• 한국광학회지
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• 제14권5호
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• pp.545-554
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• 2003

Ti:LiNbO$_3$세 도파로 방향성 결합기와 CPW진행파 전극으로 구성된 완전 스위칭이 가능한 외부 광변조기를 설계, 제작하였다. 결합 모드 이론을 이용하여 세 도파로 광결합기의 스위칭 현상을 해석하였으며, 유한차분법을 이용하여 단일 모드를 갖는 광도파로의 설계 및 공정 파라미터를 도출하였으며, 이를 이용하여 광 결합길이를 계산하였다. 등각사상법과 반복이완법을 이용하여, CPW구조 진행파 전극의 특성임피던스와 M/W(Micro wave)유효굴절률 정합조건을 동시에 만족하는 설계 파라미터를 도출하였다. 제작된 세 도파로 광변조기의 삽입손실과 스위칭 전압은 약 4㏈와 19V였으며, S 파라미터를 측정하여 특성임피던스 Z$_{c}$=45 Ω M/W 유효굴절률 N$_{eff}$=2.20, 그리고 감쇠상수 $\alpha$$_{0}$=0.055/cm√GHZ 등의 진행파 전극 파라미터를 추출하였다. 추출된 진행파 전극 파라미터를 이용하여 이론적인 주파수 응답 R($\omega$)을 계산하였으며, Photo Detector로 측정된 주파수 응답과 비교하였다. 주파수 응답 측정 결과, 3㏈ 변조대역폭은 13 GHz로 측정되었다.

• 전자공학회논문지
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• 제54권5호
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• pp.17-23
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• 2017

광전류센서는 전자기파 간섭에 영향을 받지 않으며 뛰어난 절연특성을 가지고 있어 발전소와 같은 고전압 대전류 환경에서 운용하기에 적합하다. 하지만, 온도변화와 진동과 같은 외부의 환경변화가 큰 상황에서 운용해야 하므로 센서의 높은 신뢰성이 요구된다. 그 때문에 안정성과 관련된 연구가 활발히 이루어지고 있다. 본 논문에서는 폴리머 광집적회로를 이용한 편광회전반사간섭계를 이용하여 신뢰성을 향상시킨 광전류센서를 제안한다. 여러 가지 독립적인 광소자들을 하나의 칩 상에 집적하여 안정성을 향상시키고 대량생산을 통한 저가격의 광전류센서 제작 가능성을 높였으며, 이를 이용하여 실제 현장에 적용하기 위한 특성평가를 수행하였다. 대전력 공급원을 이용하여 0.3 kA~36 kA 범위의 전류를 광센서에 인가하였을 때 선형적인 동작특성을 볼 수 있었고 센서의 오차는 $0{\pm}.5%$ 이내로 나타났다. 장시간 동작시에도 센서의 오차범위는 $0{\pm}.5%$ 이내로 유지되었다. 또한, 60 Hz~10 kHz 범위에 걸친 주파수 응답 특성 측정 결과 제안된 OCT의 3-dB 주파수 대역은 10kHz를 훨씬 넘는 것으로 확인되었다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.383-386
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• 2007

In this study, the analysis was carried out for Electrical Discharge Machining (EDM) characteristics of the Cu electrodes by LIGA process. The shape of electrodes has 324 pins for the cavity of BGA(Ball Grid Array) type test socket mold. BGA test sockets are used in the inspection process of the semi-conductor I.C chip manufacturing. In the work, the machining performance for EDM of the electrodes was analyzed on dimensional accuracy and wear rate. The dimensional accuracy was measured for dimension of the pins, pitch size between the pins and the roundness of corner edge using optical measuring machine.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2579-2584
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• 2007

A digital micro holographic particle tracking velocimetry (HPTV) system consisting of a high-speed camera and a single laser with acoustic optical modulator (AOM) chopper was established. The digital micro HPTV system was applied to water flow in a micro curved-tube for measuring instantaneous 3-D velocity field data consecutively. The micro curved-tube is using to reproduce the dorsal aorta or utilize in various lap-on-a-chip. The temporal evolution of a three-dimensional water flow in the micro curved-tube (the curvature, ${\kappa}$=1/${\phi}$, 2/${\phi}$, 4/${\phi}$, 8/${\phi}$) of 100 ${\mu}m$ and 300 ${\mu}m$ inner diameters was obtained and mean velocity field distribution was obtained by statistical-averaging the instantaneous velocity fields.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 학술대회지
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• pp.883-884
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• 2004

High-speed IC for time-division multiplexing (TDM) optical transmission systems have been designed and fabricated by using InP heterojunction-bipolar-transistor (HBT) technology. The driver IC was developed for driving external modulators, featuring differential outputs and the operation speed up to 10 Gbps with an output voltage swing of 1.3 Vpp at each output which was the limit of the measurement. Because -3 dB frequency was 20GHz, this circuit will be operated up to 20Gbps. 1.3Vpp differential output was achieved by switching 50 mA into a 50 $\Omega$ load. The power dissipation of the driver IC was 1W using a single supply voltage of -3.5Y. Input md output return loss of the IC were better than 10 dB and 15 dB, respectively, from DC to 20GHz. The chip size of fabricated IC was $1.7{\Box}1.2 mm^{2}$.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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• pp.351-354
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• 2004

This thesis presents Bipolar transistor with SAVEN(Self-Aligned VErtical Nitride) structure as a high-speed device which is essential for high-speed system such as optical storage system or mobile communication system, and proposes 0.8${\mu}m$ BiCMOS Process which integrates LDD nMOS, LDD pMOS and SAVEN bipolar transistor into one-chip. The SPICE parameters of LDD nMOS, LDD pMOS and SAVEN Bipolar transistor are extracted, and comparator operating at 500MHz sampling frequency is designed with them. The small Parasitic capacitances of SAVEN bipolar transistor have a direct effect on decreasing recovery time and regeneration time, which is helpful to improve the speed of the comparator. Therefore the SAVEN bipolar transistor with high cutoff frequency is expected to be used in high-speed system.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2004년도 학술대회 논문집
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• pp.141-144
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• 2004

기존 광원은 그 배광이 광원을 중심으로 볼 때 사방으로 퍼져 나가며, 이를 이용해 적절한 형태로 바꾸는 것은 주로 반사판의 역할이다. 그러나 LED는 기본적으로 배광이 좁으며, 이를 적절하게 변경시키는 것은 반사판이 아니라 굴절과 확산이 된다. 또한 LED는 그 자체만으로 크기가 작아 점광원으로 볼 수 있지만, LED에서 발광하는 빛은 chip에서 epoxy dome으로 직접 굴절되어 나가는 refracted ray와 reflector cup에 의해 반사되어 다시 epoxy dome에서 굴절되어 나가는 reflected-refracted ray로 이루어지기 때문에 정확히 말하면, 빛은 한 점에서 발광한다고 간주 할 수는 없다. 따라서 본 논문에서는 LED에 대한 최적의 refractor 설계를 위해 점광원으로 간주 할 수 있는 최적의 근사 발광점을 선택하여 refractor를 설계하고자 한다.

• Transactions on Electrical and Electronic Materials
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• 제4권2호
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• pp.10-14
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• 2003

Flexible displays such as plastic-based liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDDs) have been researched and developed at KETI since 1997. The plastic film substrate is very weak to heat and pressure compared to glass substrate, that its fabrication process is limited to 110$^{\circ}C$ and low pressure. The ITO films were deposited on the bare plastic film substrate by rf-magnetron sputtering. Moreover, in order to maintain uniform cell gap and pressure on the plastic film substrate, we utilized newly-invented jig and fabrication process. Electro-optical characteristics were better than or equivalent to those of typical glass LCDs though it is thinner, lighter-weight, and more robust than glass LCDs.