• Title/Summary/Keyword: on-chip-bus

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An Efficient Architecture of The MF-VLD (MF-VLD에 대한 효율적인 하드웨어 구조)

  • Suh, Ki-Bum
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.11
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    • pp.57-62
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    • 2011
  • In this paper, an efficient architecture for MFVLD(Multi-Format Variable Length Decoder) which can process H.264, MPEG-2, MPEG-4, AVS, VC-1 bitstream is proposed. The proposed MF-VLD is designed to be adapted to the MPSOC (Multi-processor System on Chip) architecture, uses bit-plane algorithm for the processing of inverse quantized data to reduce the width of AHB bus. External SDRAM is used to minimize the internal memory size. In this architecture, the adding or removing each variable length decoder can be easily done by using multiplexor. The designed MF-VLD can be operated in 200MHz at 0.18um process. The gate size is 657K gate and internal memory size is 27Kbyte.

Bus Splitting Techniques for MPSoC to Reduce Bus Energy (MPSoC 플랫폼의 버스 에너지 절감을 위한 버스 분할 기법)

  • Chung Chun-Mok;Kim Jin-Hyo;Kim Ji-Hong
    • Journal of KIISE:Computer Systems and Theory
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    • v.33 no.9
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    • pp.699-708
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    • 2006
  • Bus splitting technique reduces bus energy by placing modules with frequent communications closely and using necessary bus segments in communications. But, previous bus splitting techniques can not be used in MPSoC platform, because it uses cache coherency protocol and all processors should be able to see the bus transactions. In this paper, we propose a bus splitting technique for MPSoC platform to reduce bus energy. The proposed technique divides a bus into several bus segments, some for private memory and others for shared memory. So, it minimizes the bus energy consumed in private memory accesses without producing cache coherency problem. We also propose a task allocation technique considering cache coherency protocol. It allocates tasks into processors according to the numbers of bus transactions and cache coherence protocol, and reduces the bus energy consumption during shared memory references. The experimental results from simulations say the bus splitting technique reduces maximal 83% of the bus energy consumption by private memory accesses. Also they show the task allocation technique reduces maximal 30% of bus energy consumed in shared memory references. We can expect the bus splitting technique and the task allocation technique can be used in multiprocessor platforms to reduce bus energy without interference with cache coherency protocol.

A New Pre-Emphasis Driver Circuit for a Packet-Based DRAM (패킷 방식의 DRAM에 적용하기 위한 새로운 강조 구동회로)

  • Kim, Jun-Bae;Kwon, Oh-Kyong
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.50 no.4
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    • pp.176-181
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    • 2001
  • As the data rate between chip-to-chip gets high, the skin effect and load of pins deteriorate noise margin. With these, noise disturbances on the bus channel make it difficult for receiver circuits to read the data signal. This paper has proposed a new pre-emphasis driver circuit which achieves wide noise margin by enlarging the signal voltage range during data transition. When data is transferred from a memory chip to a controller, the output boltage of the driver circuit reaches the final values through the intermediate voltage level. The proposed driver supplies more currents applicable to a packet-based memory system, because it needs no additional control signal and realizes very small area. The circuit has been designed in a 0.18 ${\mu}m$ CMOS process, and HSPICE simulation results have shown that the data rate of 1.32 Gbps be achieved. Due to its result, the proposed driver can achieved higher speed than conventional driver by 10%.

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Efficient AMBA Based System-on-a-chip Core Test With IEEE 1500 Wrapper (IEEE 1500 래퍼를 이용한 효과적인 AMBA 기반 시스템-온-칩 코아 테스트)

  • Yi, Hyun-Bean;Han, Ju-Hee;Kim, Byeong-Jin;Park, Sung-Ju
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.2
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    • pp.61-68
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    • 2008
  • This paper introduces an embedded core test wrapper for AMBA based System-on-Chip(SoC) test. The proposed test wrapper is compatible with IEEE 1500 and can be controlled by ARM Test Interface Controller(TIC). We use IEEE 1500 wrapper boundary registers as temporal registers to load test results as well as test patterns and apply a modified scan test procedure. Test time is reduced by simultaneously performing primary input insertion and primary output observation as well as scan-in and scan-out.

Design and Implementation of a PCI-based Parallel Fuzzy Inference System (PCI 기반 병렬 퍼지추론 시스템과 설계 및 구현)

  • 이병권;이상구
    • Journal of the Korean Institute of Intelligent Systems
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    • v.11 no.8
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    • pp.764-770
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    • 2001
  • In this paper, we propose a novel PCI bus based parallel fuzzy inference system for transferring and inferencing the large volumes of fuzzy data in high speed. For this, the PCI 9050 interface chip is used to connect a local bus design as a PCI target core using FPGA to the PCI bus. We design and implement the PCI target core by using VHDL to be processed in parallel by considering the points of parallelyzing each element of the membership functions and each block of the condition and/or consequent parts. The proposed system can be used in a system requiring a rapid inference time in a real-time system or pattern recognition on the large volume of satellite images that have many inference variables in the condition and consequent parts.

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Modeling and Analysis of Power Consumed by System Bus for Multimedia SoC (멀티미디어 SoC용 시스템 버스의 소비 전력 모델링 및 해석)

  • Ryu, Che-Cheon;Lee, Je-Hoon;Cho, Kyoung-Rok
    • The Journal of the Korea Contents Association
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    • v.7 no.11
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    • pp.84-93
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    • 2007
  • This paper presents a methodology that accelerates estimating the system-level power consumption for on-chip bus of SoC platforms. The proposed power modeling can estimate the power consumption according to the change of a target SoC system. The proposed model comprises two parts: the one is power estimation of bus logics reflecting the architecture of the bus such as the number of bus layers, the other is to estimate the power consumed by the bus lines during data transmission. We designed the target multimedia SoC system, MPEG encoder as an example and evaluated power consumption using this model. The simulation result shows that the accuracy of the proposed model is over 92%. Thus, the proposed power model can be used to design of a high-performance/low-power multimedia SoC.

FPGA Design and SoC Implementation of Constant-Amplitude Multicode Bi-Orthogonal Modulation (정진폭 다중 부호 이진 직교 변복조기의 FPGA 설계 및 SoC 구현)

  • Hong, Dae-Ki;Kim, Yong-Seong;Kim, Sun-Hee;Cho, Jin-Woong;Kang, Sung-Jin
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.32 no.11C
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    • pp.1102-1110
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    • 2007
  • In this paper, we design the FPGA (Field-Programmable Gate Array) of the CAMB (Constant-Amplitude Multi-code Biorthogonal) modulation, and implement the SoC (System on Chip). The ASIC (Application Specific Integrated Circuit) chip is be implemented through targeting and board test. This 12Mbps modem SoC includes the ARM (Advanced RISC Machine)7TDMI, 64Kbyte SRAM(Static Random Access Memory) and ADC (Analog to Digital Converter)/DAC (Digital to Analog Converter) for flexible applications. Additionally, the modem SoC can support the variable communication interfaces such as the 16-bits PCMCIA (Personal Computer Memory Card International Association), USB (Universal Serial Bus) 1.1, and 16C550 Compatible UART (Universal Asynchronous Receiver/Transmitter).

THE EFFECT OF NUMBER OF VIRTUAL CHANNELS ON NOC EDP

  • Senejani, Mahdieh Nadi;Ghadiry, Mahdiar Hossein;Dermany, Mohamad Khalily
    • Journal of applied mathematics & informatics
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    • v.28 no.1_2
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    • pp.539-551
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    • 2010
  • Low scalability and power efficiency of the shared bus in SoCs is a motivation to use on chip networks instead of traditional buses. In this paper we have modified the Orion power model to reach an analytical model to estimate the average message energy in K-Ary n-Cubes with focus on the number of virtual channels. Afterward by using the power model and also the performance model proposed in [11] the effect of number of virtual channels on Energy-Delay product have been analyzed. In addition a cycle accurate power and performance simulator have been implemented in VHDL to verify the results.

Experimental investigation of Scalability of DDR DRAM packages

  • Crisp, R.
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.73-76
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    • 2010
  • A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

Design Considerations on Partition of SOP, CMOS and PCB technologies for Mobile Display System Implementation

  • Lee, Seung-Yong;You, Jae-Hee
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.798-801
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    • 2007
  • For lower power and smaller size with higher image quality, it is desirable to have more units integrated on a display panel. It needs careful design considerations in selecting CMOS, SOP or PCB. An experimental display system is designed and power and delay considering chip area, data rates and bus width are analyzed for all technology combinations to obtain optimum design methodologies.

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