• 한국전기전자재료학회논문지
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• 제37권3호
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• pp.323-327
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• 2024

The low-temperature coefficient of resistance (TCR) is a crucial factor in the development of space-grade resistors for temperature stability. Consequently, extensive research is underway to achieve zero TCR. In this study, resistors were deposited by co-sputtering nickel-chromium-based composite compositions, metals showing positive TCR, with SiO₂, introducing negative TCR components. It was observed that achieving zero TCR is feasible by adjusting the proportion of negative TCR components in the deposited thin film resistors within certain compositions. Additionally, the correlation between TCR and deposition conditions, such as sputtering power, Ar pressure, and surface roughness, was investigated. We anticipate that these findings will contribute to the study of resistors with very low TCR, thereby enhancing the reliability of space-level resistors operating under high temperatures.

• 한국재료학회지
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• 제16권6호
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• pp.341-345
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• 2006

[ $Ni_2Si$ ] mixed powders were mechanically alloyed by a ball mill and then processed by hot isostatic pressing (HIP) and spark plasma sintering (SPS). In the powder that was mechanically alloyed for 15minutes(MA 15 min), only Ni and Si were observed but in the powder that was mechanically alloyed for 30minutes(MA 30 min), $Ni_2Si$, Ni and Si were mixed together. Some of the MA 15 min powder and MA 30 min powder were processed by HIP under pressure of 150MPa at the temperature of $1000^{\circ}C$ for two hours and some of them were processed by SPS under pressure of 60 MPa at the temperature of $1000^{\circ}C$ for 60 seconds. Both methods completely compounded the powders to $Ni_2Si$. The maximum density of sintered lumps by HIP method was 99.5% and the maximum density of the sintered lump by SPS method was 99.3%. with the hardness of HRc 66 with the hardness of HRc 63. Therefore, the SPS method that can sinter in short time at low cost is considered to be more economical that the HIP method that requires complicated sintering conditions and high cost and the sintering can produce target materials in desired sizes and shapes to be used for thin film.

• Transactions on Electrical and Electronic Materials
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• 제14권3호
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• pp.133-138
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• 2013

Acrylonitrile-butadiene-styrene (ABS) plastic is a polymer material extensively used in electrical and electronic applications. Nickel (Ni) thin film was deposited on ABS by electroless plating, after its surface was treated and modified with atmospheric plasma generated by means of dielectric barrier discharges (DBDs) in air. The method in this study was developed as a pre-treatment for electroless plating using DBDs, and is a dry process featuring fewer processing steps and more environmentally friendliness than the chemical method. After ABS surfaces were modified, surface morphologies were observed using a scanning electron microscope (SEM) to check for any physical changes of the surfaces. Cross-sectional SEM images were taken to observe the binding characteristics between metallic films and ABS after metal plating. According to the SEM images, the depths of ABS by plasma are shallow compared to those modified by chemically treatment. The static contact angles were measured with deionized (DI) water droplets on the modified surfaces in order to observe for any changes in chemical activities and wettability. The surfaces modified by plasma showed smaller contact angles, and their modified states lasted longer than those modified by chemical etching. Adhesion strengths were measured using 3M tape (3M 810D standard) and by 90° peel-off tests. The peel-off test revealed the stronger adhesion of the Ni films on the plasma-modified surfaces than on the chemically modified surfaces. Thermal shock test was performed by changing the temperature drastically to see if any detachment of Ni film from ABS would occur due to the differences in thermal expansion coefficients between them. Only for the plasma-treated samples showed no separation of the Ni films from the ABS surfaces in tests. The adhesion strengths of metallic films on the ABS processed by the method developed in this study are better than those of the chemically processed films.

• 한국재료학회지
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• 제5권7호
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• pp.794-801
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• 1995

LCD 모듈을 위한 실장 기술인 Chip on Glass 공정 기술을 개발함에 있어 구동 IC와 기판d의 Al 전극을 연결하기 위하여 기존의 기술과의 연관성 및 공정의 연속성, 제조단가등을 고려하여 Pb-Sn 범프를 사용하고자 하였으며 이를 위해 Al 금속 박막위에 니켈 무전해 도금하는 방법을 연구 하였다. Al 전극에 무전해 니켈 도금하기 위해서는 광레지스트 차폐막을 손상하지 않는 전처리 방법이 필요하기 때문에 전처리 방법으로서 알칼리 아연산염 처리법과 불화물을 이용한 아연산염 처리법을 선택하여 실시하였다. 이 가운데 산성불화암모늄(NH$_4$HF)을 1.5 g/$\ell$ 함유하고 황산아연(ZnSO$_4$)을 100 g/$\ell$ 함유한 산성 아연산염 용액에서는 광레지스트 차폐막이 손상되지 않았으며 처리시간을 적절히 조절함으로써 알루미늄 박막상에 선택적으로 니켈 무전해 도금을 할 수 있었다. 아연산염 응액중의 첨가제와 무전해 도금액 중의 억제제인 Thiourea는 도금층의 평활도를 높이는 역할을 하였다. 또한 아연산염 처리를 하기 전에 산세 처리를 함으로써 도금층의 균일성을 향상시킬 수 있었다.

• Current Photovoltaic Research
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• 제12권1호
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• pp.1-5
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• 2024

Perovskite solar cells have exhibited a remarkable increase in efficiency from an initial 3.8% to 26.1%, marking a significant advancement. However, challenges persist in the commercialization of perovskite solar cells due to their low stability with respect to humidity, light exposure, and temperature. Moreover, the instability of the organic charge transport layer underscores the need for exploring inorganic alternatives. In the manufacturing process of the perovskite solar cells' oxide charge transport layer, ultraviolet-ozone (UVO) treatment is commonly applied to enhance the wettability of the perovskite solution. The UVO treatment on metal oxides has proven effective in suppressing surface oxygen vacancies and removing surface organic contaminants. This study focused on the characterization of nickel oxide as the hole transport material in perovskite solar cells, specifically investigating the impact of UVO treatment on film properties. Through this analysis, changes induced by the UVO treatment were observed, and consequent alterations in the device characteristics were identified.

• 한국재료학회지
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• 제10권9호
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• pp.601-606
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• 2000

Ni mono-silicide는 선폭이 0.15$\mu\textrm{m}$이하에서도 전기저항이 커지는 현상이 없고 Ni와 Si이 1:1로 반응하기 때문에 얇은 실리사이드의 제조가 가능하고 도펀트의 재분포 현상을 감소시킬수 있다. 따라서 0.15$\mu\textrm{m}$급 이하 디바이스에 사용이 기대되는 NiSi의 제조를 위한 Ni 박막의 증착조건 확보와 열처리 조건에 따른 NiSi의 기초 물성조사를 수행하였다. Ni mono-silicide는 sputter의 물리적 증착방법으로 Ni 박박을 증착후 관상로를 상용하여 $150~1000^{\circ}C$ 온도 범위에서 제조하였다. 그후 SPM을 이용하여 각 시편의 표면조도를 측정하였고, 미세구조와 성분분석은 EDS가 장착된 TEM을 사용하여 측정하였다. 각 열처리 온도별 생성상의 전기적 성질은 4 point probe로 측정하였다. 본 연구의 결과, SPM은 비파괴 방법으로 NiSi가 NiSi$_2$로 변태되었는지 확인할 수 있는 효과적인 공정모니터링 방법임을 확인하였고, $800^{\circ}C$이상 공온 열처리에 잔류 Ni의 산화방지를 의해 산소분압의 제어가 $Po_2$=1.5$\pm$10(sup)-11색 이하가 되어야 함을 알 수 있었으며, 전지적 특성실험으로부터 본 연구에서 제조된 박막의 NiSi$\longrightarrow$NiSi$_2$ 상태변온도는 $700^{\circ}C$라고 판단되었다.

• 대한치과보철학회지
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• 제17권1호
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• pp.23-34
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• 1979

In this study, the adhesive strength of three commercial polycarboxylate cements to ten types of dental casting alloys, such as gold, palladium, silver, indium, copper, nickel, chromium, and human enamel and dentine were measured and compared with that of a conventional zinc phosphate cement. The $8.0mm{\times}3.0mm$ cylindrical alloy specimens were made by casting. The enamel specimens were prepared from the labial surface of human upper incisor, and the dentine specimens were prepared from the occulusal surface of the human molar respectively. Sound extracted human teeth, which had been kept in a fresh condition since, extraction, were mounted in a wax box with a cold-curing acrylic resin to expose the flattened area. The mounted teeth were then placed in a Specimen Cutter (Technicut) and were cut down under a water spray, and then the flat area on the all specimens were ground by hand with 400 and 600 grit wet silicone carbide paper. Two such specimens were then cemented together face-to-face with freshly mixed cement, and moderate finger pressure was applied to squeeze the cement to a thin and uniform film. All cemented specimens were then kept in a thermostatic humidor cabinet regulated at $23{\pm}2^{\circ}C.$ and more than 95 per cent relative humidity and tested after 24 hours and 1 week. Link chain was attached to each alloy specimen to reduce the rigidity of the jig assembly, and then all the specimens were mounted in the grips of the Instron Universal Testing Machine, and a tensile load was delivered to the adhering surface at a cross head speed of 0.20 mm/min. The loads to which the specimens were subjected were recorded on a chart moving at 0.50 mm/min. The adhesive strength was determined by measuring the load when the specimen separated from the cement block and by dividing the load by the area. The test was performed in a room at $23{\pm}2^{\circ}C.$ and $50{\pm}10$ per cent relative humidity. A minimum of five specimens were tested each material and those which deviated more than 15 per cent from the mean were discarded and new specimens prepared. From the experiments, the following results were obtained. 1) It was found that the adhesive strength of the polycarboxylate cement to all alloys tested was considerably greater than that of the zinc phosphate cement. 2) The adhesive strength of the polycarboxylate cements was superior to the non precious alloys, such as the copper, indium, nickel and chromium alloys, but it was inferior to the precious gold, silver and palladium alloys. 3) Surface treatment of the alloy was found to be an important factor in achieving adhesion. It appears that a polycarboxylate cement will adhere better to a smooth surface than to a rough one. This contrasts with zinc phosphate cements, where a rough helps mechanical interlocking. 4) The adhesion of the polycarboxylate cement with enamel was found superior to its adhesion with dentine.

• 한국세라믹학회지
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• 제52권4호
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• pp.279-283
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• 2015

Ni (100 nm thick) was deposited onto synthesized diamonds to fabricate etched diamonds. Next, those diamonds were annealed at varying temperatures ($400{\sim}1200^{\circ}C$) for 30 minutes and then immersed in 30 wt% $HNO_3$ to remove the Ni layers. The etched properties of the diamonds were examined with FE-SEM, micro-Raman, and VSM. The FE-SEM results showed that the Ni agglomerated at a low annealing temperature (${\sim}400^{\circ}C$), and self-aligned hemisphere dots formed at an annealing temperature of $800^{\circ}C$. Those dots became smaller with a bimodal distribution as the annealing temperature increased. After stripping the Ni layers, etch pits and trigons formed with annealing temperatures above $400^{\circ}C$ on the surface of the diamonds. However, surface graphite layers existed above $1000^{\circ}C$. The B-H loop results showed that the coercivity of the samples increased to 320 Oe (from 37 Oe) when the annealing temperature increased to $600^{\circ}C$ and then, decreased to 150 Oe with elevated annealing temperatures. This result indicates that the coercivity was affected by magnetic domain pinning at temperatures below $600^{\circ}C$ and single domain behavior at elevated temperatures above $800^{\circ}C$ consistent with the microstructure results. Thus, the results of this study show that the surface of diamonds can be etched.

• Journal of Electrochemical Science and Technology
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• 제8권3호
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• pp.197-205
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• 2017

Lead dioxide thin films were electrodeposited on nickel substrate from acidic lead nitrate solution. Current efficiency and thickness measurements, cyclic voltammetry, AFM, SEM, and X-ray diffraction experiments were conducted on $PbO_2$ surface to elucidate the effect of lead nitrate concentration, current density, temperature on the morphology, chemical behavior, and crystal structure. Experimental results showed that deposition efficiency was affected by the current density and solution concentration. The film thickness was independent of current density when deposition from high $Pb(NO_3)_2$ concentration, while it decreased for low concentration and high current density deposition. On the other hand, deposition temperature had negative effect on current efficiency more for lower current density deposition. Cyclic voltammetric study revealed that comparatively more ${\beta}-PbO_2$ produced compact deposits when deposition was carried out from high $Pb(NO_3)_2$ concentration. Such compact films gave lower charge discharge current density during cycling. SEM and AFM studies showed that deposition of regular-size sharp-edge grains occurred for all deposition conditions. The grain size for high temperature and low concentration $Pb(NO_3)_2$ deposition was bigger than from low temperature and high concentration deposition conditions. While cycling converted all grains into loosely adhered flappy deposit with numerous pores. X-ray diffraction measurement indicates that high concentration, high temperature, and high current density favored ${\beta}-PbO_2$ deposition while ${\alpha}-PbO_2$ converted to ${\beta}-PbO_2$ together with some unconverted $PbSO_4$ during cycling in $H_2SO_4$.

• Design & Manufacturing
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• 제2권2호
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• pp.29-32
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• 2008

A back light unit (BLU) is a key module of a thin film transistor liquid crystal display (TFT-LCD), frequently utilized in various mobile displays. In this study, we experimentally characterize transcription and optical properties of concave and convex microlens arrays (MLAs) of light guide plate (LGP) fabricated by injection molding with polycarbonate as a LGP substrate material. Nickel mold inserts were manufactured by electroforming on the MLA which was fabricated by the thermal reflow of photoresist microstructures patterned by UV-photolithography. For the case of convex microlens, the height of replicated microlens was less than that of the mold insert while maintaining almost the same microlens diameter of the mold insert as the location of the microlens is far from the gate. In contrast, for the concave microlens, the diameter of replicated microlens was larger than that of mold insert, while showing almost the same microlens height as the mold insert. From the optical examination of replicated convex and concave MLAs, it was found that a higher luminance of the LGP was achieved by the concave MLAs compared to the convex MLAs (about 30% enhancement in this case)due to the utilization of a larger amount of light provided by the light sources.