• Korean Journal of Materials Research
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• v.19 no.5
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• pp.270-275
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• 2009

Lotus-type porous nickel with cylindrical pores was fabricated by unidirectional solidification under an Ar gas atmosphere using the thermal decomposition method of the compounds such as sodium hydroxide, calcium hydroxide, calcium carbonate, and titanium hydride. The decomposed gas does form the pores in liquid nickel, and then, the pores become the cylindrical pores during unidirectional solidification. The decomposed particles from the compounds do play a rule on nucleation sites of the pores. The behavior of pore growth was controlled by atmosphere pressure, which can be explained by Boyle's law. The porosity and pore size decreased with increasing Ar gas pressure when the pores contain hydrogen gas decomposed from calcium and sodium hydroxide and titanium hydride, ; however it they did not change when the pores contain containing carbon dioxide decomposed from calcium carbonate. These results indicate that nickel does not have the solubility of carbon dioxide. Lotus-type porous metals can be easily fabricated by the thermal decomposition method, which is superior to the conventional fabrication method used to pressurized gas atmospheres.

• Bulletin of the Korean Chemical Society
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• v.30 no.7
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• pp.1603-1606
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• 2009

A new 1D oxalato bridged compound Ni(en)(ox)-2$H_2$O, (ox = oxalate; en = ethylenediamine) has been hydrothermally synthesized and characterized by single crystal X-ray diffraction, IR spectrum, TG analysis, and magnetic measurements. In the structure the Ni atoms are coordinated with four oxygen atoms in two oxalate ions and two nitrogen atoms in one ethylenediamine molecule. The oxalate anion acts as a bis-bidentate ligand bridging Ni atoms in cis-configuration. This completes the infinite zigzag neutral chain, [Ni(en)(ox)]. The interchain space is filled by water molecules that link the chains through a network of hydrogen bonds. Thermal variance of the magnetic susceptibility shows a broad maximum around 50 K characteristic of one-dimensional antiferromagnetic coupling. The theoretical fit of the data for T > 20 K led to the nearest neighbor spin interaction J = -43 K and g = 2.25. The rapid decrease in susceptibility below 20 K indicate this compound to be a likely Haldane gap candidate material with S = 1.

• Corrosion Science and Technology
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• v.13 no.3
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• pp.102-106
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• 2014

Nickel electrodeposition from sulfamate bath has several benefits such as low internal stress, high current density and good ductility. In nickel deposited layers, sulfur induces high temperature embrittlement, as Ni-S compound has a low melting temperature. To overcome high temperature embrittlement problem, adding manganese is one of the good methods. Manganese makes Mn-S compound having a high melting temperature above $1500^{\circ}C$. In this work, the mechanical properties of Ni-Mn deposited layers were investigated by using various process variables such as concentration of Mn$(NH_2SO_3)_2$, current density, and bath temperature. As the Mn content of electrodeposited layers was increased, internal stress and hardness were increased. By increasing current density, internal stress increased, but hardness decreased. With increasing the bath temperature from 55 to $70^{\circ}C$, internal stress of Ni deposit layers decreased, but hardness didn't change by bath temperature. It was likely that eutectoid manganese led to lattice deformation, and the lattice deformation increased hardness and internal stress in Ni-Mn layers. Increasing current density and decreasing bath temperature would increase a mount of $H_2$ absorption, which was a cause for the rise of internal stress.

• Korean Journal of Crystallography
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• v.13 no.1
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• pp.12-16
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• 2002

The complex [Ni(L)](BDC)·4H₂O (1) (L = 3,14-dimethyl-2,6,13,17-tetraazatricyclo[16,4,O/sup 1.18/,O/sup 7.12/] docosane; BDC = 1,3-benzenedicarboxylate) has been synthesized and characterized by X-ray crystallography. Compound 1 crystallizes in the orthorhombic space group Pcnb, with a = 8.764(2) , b = 17.687(2) , c = 19.475(1) , V = 3018.7(8) ³, Z = 4, R₁, (wR₂) for 2148 observed reflections of [1>2σ(I) was 0.0822 (0.2236). Compound 1 is interconnected to give a three-dimensional network through weak hydrogen-bonding interactions.

• Resources Recycling
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• v.33 no.4
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• pp.36-46
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• 2024

We investigated a hydrometallurgical process of nickel recovery from Inconel 713C scrap. The process proceeded with a series of i) comminution of pyrometallurgical treated scrap, ii) sulfuric acid leaching, iii) solvent extraction of unreacted acid, molybdenum, aluminum, and precipitation of chromium, iv) crystallization of nickel sulfate by vacuum evaporation, and v) nickel electrowinning. The nickel-aluminum intermetallic compound, Ni₂Al₃, was formed by the pyrometallurgical pretreatment readily grounded under 75 ㎛. Sulfuric acid leaching was done for 2 hours in 2 mol/L, 20 g/L solid/liquid ratio, and 80 ℃. It revealed that over 98 % of nickel and aluminum was dissolved, whereas 28 % of molybdenum was. A nickel sulfate solution with 2.34 g/L for the crystallization of nickel sulfate hydrate was prepared via solvent extraction and precipitation. Over 99 % of molybdenum and aluminum and 93 % of chromium was removed. Nickel metal with 99.9 % purity was obtained by electrowinning with the nickel sulfate monohydrate in the cell equipped with anion exchange membranes for catholyte pH control. The membrane did not work well, resulting in a low current efficiency of 73.3 %.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.215-216
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• 2013

The silicide is a compound of Si with an electropositive component. Silicides are commonly used in silicon-based microelectronics to reduce resistivity of gate and local interconnect metallization. The popular silicide candidates, CoSi2 and TiSi2, have some limitations. TiSi2 showed line width dependent sheet resistance and has difficulty in transformation of the C49 phase to the low resistive C54. CoSi2 consumes more Si than TiSi2. Nickel silicide is a promising material to substitute for those silicide materials providing several advantages; low resistivity, lower Si consumption and lower formation temperature. Nickel silicide (NiSi) nanowire (NW) has features of a geometrically tiny size in terms of diameter and significantly long directional length, with an excellent electrical conductivity. According to these advantages, NiSi NWs have been applied to various nanoscale applications, such as interconnects [1,2], field emitters [3], and functional microscopy tips [4]. Beside its tiny geometric feature, NW can provide a large surface area at a fixed volume. This makes the material viable for photovoltaic architecture, allowing it to be used to enhance the light-active region [5]. Additionally, a recent report has suggested that an effective antireflection coating-layer can be made with by NiSi NW arrays [6]. A unique growth mechanism of nickel silicide (NiSi) nanowires (NWs) was thermodynamically investigated. The reaction between Ni and Si primarily determines NiSi phases according to the deposition condition. Optimum growth conditions were found at $375^{\circ}C$ leading long and high-density NiSi NWs. The ignition of NiSi NWs is determined by the grain size due to the nucleation limited silicide reaction. A successive Ni diffusion through a silicide layer was traced from a NW grown sample. Otherwise Ni-rich or Si-rich phase induces a film type growth. This work demonstrates specific existence of NiSi NW growth [7].

• Corrosion Science and Technology
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• v.6 no.6
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• pp.311-315
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• 2007

The anodic polarization behavior of equiatomic TiNi shape memory alloy with pure titanium as a reference material was investigated by means of open circuit potential measurement and potentiodynamic polarization technique. And the structure of passive films on TiNi intermetallic compounds was also conducted using AES and ESCA. While the dissolved Ni(II) ion did not affect the dissolution rate and passivation of TiNi alloy, the dissolved Ti(III) ion was oxidated to Ti(IV) ion on passivated TiNi surface at passivation potential. It has also been found that the Ti(IV) ion increases the steady state potential, and passivates TiNi alloy at a limited concentration of Ti(IV) ion. The analysis by AES showed that passive film of TiNi alloy was composed of titanium oxide and nickel oxide, and the content of titanium was three times higher than that of nickel in outer side of passive film. According to the ESCA analysis, the passive film was composed of $TiO_2$ and NiO. It seems reasonable to suppose that NiO could act as unstabilizer to the oxide film and could be dissolved preferentially. Therefore, nickel oxide contained in the passive film may promote the dissolution of the film, and it could be explained the reason of higher pitting susceptibility of TiNi alloy than pure Ti.

• Korean Journal of Crystallography
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• v.12 no.2
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• pp.88-91
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• 2001

The complex [NiL₃]Cl₂·3H₂O (1) (L=trans-1,2-diaminocyclohexane) has been synthesized and characterized by X-ray crystallography. The compound 1 crystallizes in the cubic space group P2₁3, with a=13.830(1) Å, V=2645.9(2) ų, Z=4, R₁(wR₂) for 1500 observed reflections of [I> 2σ(I)] was 0.0766 (0.2068).

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.63-71
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• 2022

In this study, the interfacial reaction and drop impact reliability of Sn-Ag-Cu (SAC) solder and electroless nickel autocatalytic gold (ENAG) were studied. In addition, the solder joint properties with the ENAG surface finish was compared with electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG). The IMC thickness of SAC/ENAG and SAC/ENEPIG were 1.15 and 1.12 ㎛, respectively, which were similar each other. The IMC thickness of the SAC/ENIG was 2.99 ㎛, which was about two times higher than that of SAC/ENAG. Moreover, it was found that the IMC thickness of the solder joint was affected by the metal turnover (MTO) condition of the electroless Ni(P) plating solution, and it was found that the IMC thickness increased when the MTO increased from 0 to 3. The shear strength of SAC/ENEPIG was the highest, followed by SAC/ENAG and SAC/ENIG. It was found that when the MTO increased, the shear strength was lowered. In terms of brittle fracture, SAC/ENEPIG was the lowest among the three joints, followed by SAC/ENAG and SAC/ENIG. Likewise, it was found that as MTO increased, brittle fracture increased. In the drop impact test, it was confirmed that the 0 MTO condition had a higher average number of failures than the 3 MTO condition, and the average number of failures was also higher in the order of SAC/ENEIG, SAC/ENAG, and SAC/ENIG. As a result of observing the fracture surface after the drop impact, it was found that the fracture was between the IMC and the Ni(P) layer.

• Korean Journal of Crystallography
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• v.11 no.2
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• pp.80-83
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• 2000

Compound [Ni(P(OEt)3)4] (1) reacted with bis(diphenylphosphino)ethane (Ph2PCH2CH2Ph2, dppe) to give bis(bis(diphenylphosphine)ethane)nickel(0), [Ni(dppe)2] (2). Compound 2 was characterized by spectroscopy (1H-and 31P{1H}-NMR) and X-ray crystallography. Crystallographic data for 2: monoclinic space group P21/n, a=9.826(1)Å, b=21.167(2)Å, c=21.425(2)Å, β=91.957(9)°, Z=4, R(wR2)=0.0377(0.0882).