• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.4
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• pp.1210-1215
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• 2010

The probe card are test modules which are to classify the good semiconductor chips and thin film before the packaging process. In the rapid growth a technology of semiconductor, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, the technology of probe card needs narrow width and lots of probe tip. In this paper, the probe tip based on the MEMS(Micro Electro Mechanical System)technology was developed a new MEMS probe tip for vertical probe card applications. For the structural designs of probe tip were performed to mechanical characteristics and structural analysis using FEM(Finite Element Method). Also, the contact force of MEMS probe tip compared with FEM results and experimental results. Finally, the MEMS probe card was developed a fine pitch smaller than $50{\mu}m$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2009.10a
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• pp.827-830
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• 2009

Feature of current IPTV services is that the IPTV Provider buys the rights of contents from contents author and provides consumers monopolistically with those. In this environment, IPTV is indistinguishable from the way of existing broadcasting services. To shift away from this structure, it is necessary to guarantee the common user's participation and provide the Open IPTV services for customers to be allowed to have be defined for more opportunities to select the contents. However, there are some problems to conduct Open IPTV service due to a variety of rights protection solutions designed by previous digital broadcast providers. Therefore, a new framework is needed to overall Open IPTV environment. This paper provides the design can packaging contents authoring and consuming tool for IPTV application service based on Open IPTV.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.33-38
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• 2009

The use of portable devices has created the need for new reliability criterion of drop impact tests because of the tendency to accidentally drop in the use of these devices. The effects of different PCB surface finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) and high temperature storage (HTS) test on the drop reliability were studied. Various drop test conditions were used to evaluate a drop reliability of assemblies to endure such impact and shock load. In the case of the as-reflowed samples (no HTS test), the SAC/OSP boards exhibited a better drop impact reliability than that of SAC/ENIG. However, the reverse was true if HTS test is performed. In addition, significant decrease of drop reliability was observed for both SAC/ENIG and SAC/OSP assemblies after HTS test. It was also observed that the thickness of intermetallic compound layer do play an important role in the brittle fracture of drop test.

• The Journal of the Acoustical Society of Korea
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• v.39 no.2
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• pp.87-97
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• 2020

In this paper, the design of piezoelectric Micro-machined Ultrasonic Transducer (pMUT) for wideband ultrasonic radiation in air was investigated. One of the methods to achieve wide frequency bandwidth in single device is modeling the transducer to multi-resonance system. The new pMUT was designed as a multi-resonance system with the addition of a suitable acoustic structure to the front and back of a thin film structure. A new pMUT consisting of thin film parts, radiation parts, and packaging parts is designed with a Lumped Parameter Model (L.P.M). Finally, it was validated as a Finite Element Method (FEM) simulation. The final designed pMUT achieved a frequency band of 102 kHz ~ 132 kHz (-3 dB).

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.4
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• pp.845-850
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• 2011

In this paper, we proposed the digital contents distribution business model for the operation of integration between heterogeneous systems in order to use IPTV. Also, we designed and implemented the protection management system through this distribution business model. This proposed model maintains interoperability between the heterogeneous systems, creates rights protection document based on REL, and provides the new version of packaged digital contents to itself by packaging the digital contents. Overall, it ultimately offers an interoperable environment. Moreover, since we pre-defines the relations among REL data based on MPEG-21 standard, which creates the newly packaged digital contents, it is easy to edit data. We can expect to save expenses of digital contents distribution and rights protection technology. Additionally, we can further improve security by encapsulating the security technology of CAS and DRM system.

• Korean Journal of Food Science and Technology
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• v.36 no.1
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• pp.69-74
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• 2004

'Mixing' and 'immersion' $CaCl_{2}$ treatment methods were tested for preparation of bio-degradable films using powders of sea mustard (Undaria pinnatifida) (leaf, stem, and sphorophyll), sweet tanlge (Laminaria japonica), and fusiforme (Hizikia fusiforme) by extracting alginate through acid-alkali extraction method. Except fusiforme powder, flexible, free-standing films were produced by both methods using all marine algae powders tested. Except water solubility (WS), surface color, tensile strength (TS), elongation at break (E), and water vapor permeability (WVP) did not show distinct difference between $CaCl_{2}$, treatment methods. Although TS, WVP, and WS of marine algae powder films were lower than those of alginate films, they indicate potential in application as a new source of bio-degradable packaging materials.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.116-121
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• 2009

Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. Mechanical properties of the horn and the shank, such as the natural frequency and the amplitude, have a great effect on the bonding capability of the transverse flip chip bonding system. In this research, two kinds of study are performed. The first is the new design of the clamp and the second is the effect of tolerance parameters to the performance of the system. The clamp with a bent shape is newly designed to hold the nodal point of the flip chip. The second is the effect of the design parameters on the vibration amplitude and planarity at the end of the shank. The variation of the tolerance parameters changes the amplitude and the frequency of the vibration of the shank. They, in turn, have an effect on the quantity of the plastic deformation of the gold ball bump, which determined the quality of the flip chip bonding. The tolerance parameters that give the great effect on the amplitude of the shank are determined using Taguchi's method. Error of set-up angle, the length and diameter of horn and error of the length of the shank are determined to be the parameters that have peat effect on the amplitude of the system.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.57-67
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• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.12
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• pp.57-64
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• 2017

Today, due to the environmental regulations regarding air pollution in the EU, the use of EPS (Styrofoam) as the cushioning material in the packaging industry is decreasing. In effect, air cushioning based cushioning materials are rapidly expanding into the market and replacing EPS, due to their excellent buffering ability and environmental friendliness. This is a new selective filling type air filling material manufacturing technology that affords improvements in the amount of raw materials required, its processing and its aesthetic appearance compared to the conventional air filling cushioning materials. In this study, a multi-stage air cell filling valve molding technology is developed based on selective filling technology, which allows packages to be selectively filled in various forms by applying valve forming structure technology. This multi-stage air cell filling valve molding technology is a technique in which a plurality of injection ports are formed by laminating three layers of films, viz. a first injection film, a valve film, and a second injection film having valve ends. In the conventional technology, a separate external air injection path for injecting air into a plurality of connected air bags is needed. However, in the proposed system, an external air injection path is formed inside the air bag, Due to the lack of need for an injection furnace, the raw material and process are reduced and air is injected and then discharged, while the air bag is reduced in length to 63 ~ 66% of its normal value. The outer surface of the outer air injection path is integrated inside by maintaining the original length of the cross section, while the unnecessary folded air is injected into the interior of the air bag, This smart air filling type cushioning material manufacturing technology constitutes a big improvement over the existing technologies.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.81-86
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• 2004

A new method to improve the wet etching characteristics is described. The anisotropic wet-etching of (100) Si with megasonic wave has been studied in KOH solution. Etching characteristics of p-type (100) 6 inch Si have been explored with and without megasonic irradiation. It has been observed that megasonic irradiation improves the characteristics of wet etching such as an etch uniformity and surface roughness. The etching uniformity on the whole wafer with and without megasonic irradiation were less than ${\pm}1\%$ and more than $20\%$, respectively. The initial root-mean-square roughness($R_{rms}$) of single crystal silicon is 0.23 nm. It has been reported that the roughnesses with magnetic stirring and ultrasonic agitation were 566 nm and 66 nm, respectively. Comparing with the results, etching with megasonic irradiation achieved the Rrms of 1.7 nm on the surface after the $37{\mu}m$ of etching depth. Wet etching of silicon with megasonic irradiation can maintain nearly the original surface roughness after etching process. The results have verified that the megasonic irradiation is an effective way to improve the etching characteristics such as etch uniformity and surface roughness.