• 제목/요약/키워드: new packaging technology

검색결과 225건 처리시간 0.027초

(초)소형위성의 New Space 대응 및 산업화 전략 (New Space Response and Industrialization Strategy for Micro & Small Satellites)

  • 서인호;정현재
    • 우주기술과 응용
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    • 제1권2호
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    • pp.256-267
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    • 2021
  • 본 논문에서는 (초)소형위성의 뉴스페이스 특징 및 대응방안을 소개하고, 국내기술을 활용한 우리나라의 우주산업화 전략을 제시한다. 최근 스타링크를 포함하여 전세계적으로 개발되는 (초)소형위성들은 저비용 및 경량의 군집위성 특징을 가지고 있으므로, COTS(Commercial Off-The-Shelf) 부품 사용 및 위성 중량, 형상, 대량생산 등을 고려하고 군집운용을 준비해야 한다. 특히 다중위성 운용시 주파수 간섭을 고려하여 MIMO(Multi Input Multi Output) 기술 개발 및 정부 차원의 주파수 확보를 위한 준비와 노력이 필요하다. 삼성전자와 SK하이닉스의 상용급 메모리 중에서 내방사선성이 좋은 메모리와 중소기업의 고신뢰성 패키징 및 우주환경시험 기술을 이용하는 우주급 메모리 분야는 우주산업화 전략으로 가능성이 있다.

강유전성 물질을 이용한 Multi-level FeRAM 구조 및 동작 분석 (Multi-Level FeRAM Utilizing Stacked Ferroelectric Structure)

  • 공석헌;김준형;홍슬기
    • 마이크로전자및패키징학회지
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    • 제30권3호
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    • pp.73-77
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    • 2023
  • 본 연구에서는 서로 다른 강유전성 물질을 활용하여 Multi-level FeRAM (Ferroelectrics random access memory) 소자에 대한 구조를 제시하였으며, 이를 검증하기 위해 Simulation을 통한 C-V 분석을 수행하였습니다. Multi-level 소자를 구현하기 위해 두 가지 서로 다른 물성을 가진 강유전체를 동일한 하부 전극 위에 나란히 증착하고, 이후 게이트 전극을 위에 올린 MFM (Multi-Ferroelectric Material) 구조를 제안하였습니다. 두 강유전체가 서로 다른 전압 조건에서 분극 현상 (Polarization)을 나타내는 것을 바탕으로, 두 개의 물질 중 한 개만 polarization 되었을 때와 두 개 모두 polarization 되었을 때의 상황을 C-V peak 분석을 통해 확인하여 Multi-level 동작을 구현할 수 있음을 확인하였습니다. 더불어, 제시한 구조를 반도체 제조 공정을 활용하여 구현하는 방법을 공정 simulation을 통해 검증하였습니다. 이러한 결과는 하나의 메모리 셀에서 여러 상태 값을 저장할 수 있음을 의미하며, 이는 메모리의 집적도를 크게 향상시킬 수 있는 새로운 구조체로서의 가능성을 의미합니다.

SMT 검사기를 위한 불량유형의 자동 분류 방법 (Defect Classification of Components for SMT Inspection Machines)

  • 이재설;박태형
    • 제어로봇시스템학회논문지
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    • 제21권10호
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    • pp.982-987
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    • 2015
  • The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

다이오드 레이저를 이용한 Chip On Glass 접합에 관한 연구 (Study of Chip On Glass Bonding Method using Diode Laser)

  • 서명희;류광현;남기중
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.423-426
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    • 2005
  • A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

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두부산업 발전사 (History of tofu industry)

  • 강창수
    • 식품과학과 산업
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    • 제54권3호
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    • pp.171-183
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    • 2021
  • Tofu has been consumed as source of protein in Asia for hundreds of years and it was first known in US and Europe by Asian immigrants during 1900s. Lately it is being spotlighted for excellent plant-based protein that has nutritional value. Tofu has long been the most widely used ingredients in Asia and it has been developed into various forms such as tofu, yuba, fried tofu, tofu sheet, fermented tofu and more according to food culture. With development of equipment, coagulant, packaging and pasteurization, now we can have advanced flavor, productivity and distribution of tofu. Tofu has been brought to customer's attention, people who prefer more health oriented, sustainable and eco-friendly food during COVID-19 pandemic season. Furthermore, this global trend is expected to be continued. In response to the trend we need more study on new texture of tofu, substitution of meat, dairy, and various commercialization of HMR in future.

OPC UA 기반 스마트팩토리 디지털 트윈 테스트베드 시스템 개발 (Development of OPC UA based Smart Factory Digital Twin Testbed System)

  • 김재성;정석찬;서동우;김대기
    • 한국멀티미디어학회논문지
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    • 제25권8호
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    • pp.1085-1096
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    • 2022
  • The manufacturing industry is continuously pursuing advanced technology and smartization as it converges with innovative technology. Improvement of manufacturing productivity is achieved by monitoring, analyzing, and controlling the facilities and processes of the manufacturing site in real time through a network. In this paper, we proposed a new OPC-UA based digital twin model for smart factory facilities. A testbed system for USB flash drive packaging facility was implemented based on the proposed digital twin model and OPC-UA data communication scheme. Through OPC-UA based digital twin model, equipment and process status information is transmitted and received from PLC to monitoring and control 3D digital models and physical models in real time. The usefulness of the developed digital twin testbed system was evaluated through usability test.

MA포장용기를 이용한 딸기 및 상추의 품질 안전성에 관한 연구 (A Study on the Quality and Safety of Strawberries and Lettuce Using MA Packaging Container)

  • 홍상태
    • 대한안전경영과학회지
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    • 제22권4호
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    • pp.9-15
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    • 2020
  • As of 2018, total yield of lettuce and strawberry amounted to 93,543 tons (representing 1.0 percent) and 183,639 tons (2.0 percent), respectively, among total yields worth 9,185,889 tons in South Korea. Lettuce is affected by a combination of numerous elements such as varieties, cultivation methods and pests during each growth phase (Lee et al., 1999). It is mainly cultivated in spring and fall. Especially due to respiration rate after harvest leading to reduced quality and poor storage, maintaining annual supply is unavailable (Jang et al., 2018). With the distribution of new varieties, forcing culture and indoor insulated facilities for plant cultivation during winter, strawberries are produced every year except for late summer and early fall. Due to active respiration, transpiration, soft flesh and high water content, the fruit is vulnerable to go bad and got rotten compared to other fruits. Furthermore, it is difficult to maintain freshness due to the possibility of softening, discoloration and fungi (Lee et al., 2012). In this regard, developing improved storage and package techniques is needed to ensure maintaining quality and safety even just two to three days after harvest. In order to ensure improved quality and safety of strawberries and lettuce after harvest, the present study applied a modified atmosphere packaging (MAP) technology (Mostofi et. al., 2008). Going forward, it compared the quality and safety of the two products while being stored in a way that put them in an MAP-applied container and a plastic container at room temperature and 4 degree Celsius.

식품산업에서 유청 단백질을 이용한 식용 필름과 코팅의 활용 (Whey Protein-Based Edible Films and Coatings in Food Industry)

  • 유자연;;김현욱;배형호;함준상
    • Journal of Dairy Science and Biotechnology
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    • 제41권4호
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    • pp.219-229
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    • 2023
  • Consumer demand for products with health benefits and natural ingredients is significant for the expansion of functional foods. Edible films and coatings are an excellent way to diversify the market for functional foods and as substitutes for the prevailing packaging and products. Incorporation of whey protein (WP) and its active ingredients into edible films and coatings is a promising technique that can be applied to various food products. Numerous combinations can be used on an industrial scale depending on the purpose, product, nature of the film, type of active ingredient, and type of inclusions. In this review, we describe several characteristics of edible WP films and coatings used as novel packaging materials. WP-based packaging can play a beneficial role in sustainability because of the option of recycling materials rather than incinerating, as in synthetic laminates, because of the use of natural byproducts from the food industry as raw materials. However, cost-effectiveness is a driving force against industrial setbacks in current and future WP processing developments. The industrial application of this new technology depends on further scientific research aimed at identifying the mechanism of film formation to improve the performance of both the process and product. Furthermore, research such as consumer studies and long-term toxicity assessments are required to obtain significant market shares.

PERC 태양전지 모듈의 출력저하 방지를 위한 모스아이(Moth-eye) 광학필름 연구 (A Study of Moth-eye Nano Structure Embedded Optical Film with Mitigated Output Power Loss in PERC Photovoltaic Modules)

  • 오경석;박지원;최진영;천성일
    • 마이크로전자및패키징학회지
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    • 제27권4호
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    • pp.55-60
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    • 2020
  • 태양광 발전소에 설치된PERC 태양광 모듈 스트링-어레이는 고전압의 전위차로 인해 여전히 potential-induced degradation(PID) 열화 현상이 여전히 보고되고 있다. 이는 태양전지 모듈 커버글라스의 Na+ 이온이 태양전지 봉지재(EVA)를 투과하여 셀 표면으로 전이되고 결함이 많이 분포되어 있는 ARC(SiOx/SiNx) 계면에 양전하가 축적됨으로써 shunt-Resistance(Rsh)가 감소되고 누설전류량이 증가되어 태양전지 출력이 저하되는 현상이다. 본 연구에서는 이를 방지하기 위해 나노임프린트 리소그래피(nano-imprint lithography, NIL) 방식을 이용하여 모스아이(Moth-eye) 나노 구조를 광학 필름 후면에 증착 하였고, 이를 커버글라스와 EVA 사이에 삽입하여 태양광 미니 모듈을 구성하였다. PID 열화 현상을 확인하기 위해 IEC 62804-1 규격에 기반한 셀 단위 PID 열화가속시험을 진행하였고, Light I-V, Dark I-V 분석을 통해 출력(Pmax), 효율(Efficiency), 병렬 저항(shunt resistance)을 확인하였다. 그 결과 기존의 태양전지는 초기 효율 19.76%에서 6.3% 감소하였으나 모스아이 나노 구조 광학 필름(Moth-eye film)이 적용된 태양전지는 0.6% 만 감소하여 PID 열화 현상이 방지되는 것을 확인하였고, 모스아이 나노구조를 통해 투과도가 4% 향상되어 미니 모듈 출력이 2.5% 향상되었다.

Fabrication and packaging techniques for the application of MEMS strain sensors to wireless crack monitoring in ageing civil infrastructures

  • Ferri, Matteo;Mancarella, Fulvio;Seshia, Ashwin;Ransley, James;Soga, Kenichi;Zalesky, Jan;Roncaglia, Alberto
    • Smart Structures and Systems
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    • 제6권3호
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    • pp.225-238
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    • 2010
  • We report on the development of a new technology for the fabrication of Micro-Electro-Mechanical-System (MEMS) strain sensors to realize a novel type of crackmeter for health monitoring of ageing civil infrastructures. The fabrication of micromachined silicon MEMS sensors based on a Silicon On Insulator (SOI) technology, designed according to a Double Ended Tuning Fork (DETF) geometry is presented, using a novel process which includes a gap narrowing procedure suitable to fabricate sensors with low motional resistance. In order to employ these sensors for crack monitoring, techniques suited for bonding the MEMS sensors on a steel surface ensuring good strain transfer from steel to silicon and a packaging technique for the bonded sensors are proposed, conceived for realizing a low-power crackmeter for ageing infrastructure monitoring. Moreover, the design of a possible crackmeter geometry suited for detection of crack contraction and expansion with a resolution of $10{\mu}m$ and very low power consumption requirements (potentially suitable for wireless operation) is presented. In these sensors, the small crackmeter range for the first field use is related to long-term observation on existing cracks in underground tunnel test sections.