• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.1-9
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• 2010

삼차원 집적화기술의 현황과 과제 및 향후에 요구되어질 새로운 삼차원 집적화기술의 필요성에 대해 논의를 하였다. Super-chip 기술이라 불리우는 자기조직화 웨이퍼집적화 기술 및 삼차원 헤테로집적화 기술에 대해 소개를 하였다. 액체의 표면장력을 이용하여지지 기반위에 다수의 KGD를 일괄 실장하는 새로운 집적화 기술을 적용하여, KGD만으로 구성된 자기조직화 웨이퍼를 다층으로 적층함으로써 크기가 다른 칩들을 적층하는 것에 성공을 하였다. 또한 삼차원 헤테로집적화 기술을 이용하여 CMOS LSI, MEMS 센서들의 전기소자들과 PD, VC-SEL등의 광학소자 및 micro-fluidic 등의 이종소자들을 삼차원으로 집적하여 시스템화하는데 성공하였다. 이러한 기술은 향후 TSV의 실용화 및 궁극의 3-D IC인 super-chip을 구현하는데 필요한 핵심기술이다.

• 센서학회지
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• 제27권5호
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• 대한기계학회논문집B
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• 제25권6호
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.

• 한국표면공학회지
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• 제36권2호
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• pp.214-225
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• 2003

Trends in microelectronics packages such as low cost, miniaturization, high performance, and high reliability made area array interconnecting technologies including flip chip, CSP (Chip Scale Package) and BGA (Ball Grid Array) mainstream technologies. Underfill technology is used for the reliability of the area array technologies, thus electronics packaging industry regards it as very important technology In this paper, the underfill technology is reviewed and the recent advances in the underfill technology including new processes and materials are introduced. These includes reworkable underfills, no-flow underfills, molded underfills and wafer - level - applied underfills.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.17-20
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• 2003

The EMC's rheological effects on molding process are evaluated in this study. When considering mold processing for IC packages, the major concerning items in current studies are incomplete fill, severe wire sweeping and paddle shifts etc. To simulate EMC's fast curing rheokinetics with 3D mold flow behavior, one should select appropriate rheometry which characterize each EMC's rheological motion and finding empirical parameters for numerical analysis current studies present the new rheometry with parallel plate rheometry for reactive rheokinetic experiments, the experiment and numerical analysis is done with the commercial higher filler loaded EMC for the case of Thin Quad Plant Packages (TQFP) with package thickness below 1.0 mm. The experimental results and simulation results based on new rheometry matches well in point of the prediction of wire sweep, filling behavior of melt front advancement and void trapping position.

• 한국수산과학회지
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• 제55권1호
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• pp.73-77
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• 2022

The shelf life of oysters Crassostrea gigas, in two different types of packaging containers, polyethylene (PE) and polyethylene terephthalate (PET), was determined by evaluating the pH, glycogen and soluble protein content, turbidity, and viable cell count. After 7 days of storage, the pH of the packing water in the PE container decreased to 5.88, while the pH in the PET container decreased to 6.03. In the PE container, the glycogen content of the oysters decreased by 0.85 g/100 g and the soluble protein content and turbidity of the packing seawater increased by 1,927.21 mg/100 g and 3.24 McF, respectively. In the PET container, the glycogen content of the oysters decreased by 0.96 g/100 g and the soluble protein content and turbidity of the packing seawater increased by 1,674.75 mg/100 g and 0.98 McF, respectively. The reaction rate constants (K) were as follows: glycogen content, -0.18 (PE) and -0.10 (PET); soluble protein content, 0.29 (PE) and 0.26 (PET); and turbidity, 0.41 (PE) and 0.06 (PET). These results suggested that PET can be used as a new packaging container material for raw oysters because the quality is maintained and it offers more convenient handling during distribution.

• 한국포장학회지
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• 제24권3호
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• pp.121-130
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• 2018

새로이 품목으로 육성된 '맛경채'의 수확 후 저장 특성을 보고자, 상온($25^{\circ}C$)에서 관행적으로 유통되는 골판지 종이박스로 저장하면서 유공 PP 필름 포장과 비교하였으며 동일한 필름 소재로 $5^{\circ}C$와 $15^{\circ}C$로 저장하여, 저장 중의 외관변화, 생체중량 감소, 색소와 색상차, 호홉 등을 측정하였다. '맛경채'는 상온인 $25^{\circ}C$에서 4일 정도까지 상품성을 유지하였는데, 상품성 지수에서 유공 PP 필름 포장이 골판지 종이박스 포장보다 다소 높았으며, 또한 유공 PP 필름 포장하여 저장온도를 달리하면 $5^{\circ}C$에서는 24일까지 상품성을 유지하였고, $15^{\circ}C$에서는 8일간이었다. 이는 SPAD와 같은 색소 함량이나 Hue angle과 같은 색상변화에서도 온도별로 같은 결과를 보여주었다. 포장 방법에 따른 차이는 상온($25^{\circ}C$)에서 관행적으로 저장 유통되는 골판지 종이 박스 포장과 유공 PP필름의 소포장을 비교하였는데 외관 변화에서는 차이가 없었으나, 생체중량이나 색소 및 색상에서 차이를 보여, 필름에 의한 소포장 효과가 인정되었다. 온도에 따라서 저온 저장이 다른 온도 조건보다 선도를 더 유지할 수 있는 것은 생체중량이나 호흡과 같이 저장 온도가 낮은 $5^{\circ}C$에서 중량 변화나 호흡이 낮아 선도 변화가 지연된 것으로 보인다. 본 실험에서 '맛경채'와 같은 엽채류의 품질을 유지하기 위해서는 저온 $5^{\circ}C$와 같이 낮은 온도에서 저장 유통하는 것이 효과적이며, 또한 필름 포장에 소포장하는 것이 부가적으로 선도가 유지되는 것으로 나타나, 필름 포장과 함께 저온에서 저장 유통하여 상품성을 관리해야 될 것으로 보인다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 국제표면실장 및 인쇄회로기판 생산기자재전:전자패키지기술세미나
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• pp.1-19
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• 2003

The electronic market thrust for many hybrid circuit manufacturers is changing because commercial market segments such as telecommunications, automotive and consumer electronics have increased the demand world wide for environmentally friendly thick film products. This, in turn, places a stronger emphasis on the material suppliers within the circuit fabrication industry to provide toxin free products with equal or higher performance than traditional technology. A new group of silver based thick film conductors, which are totally free of such toxins as cadmium, nickel and Bead have been developed to meet new environmental requirements. Traditional thick film products and newly developed toxin free compositions will be compared and data will be presented. To evaluate their performance, both groups of conductors were tested for solder acceptance, leach resistance and aged adhesion with standard lead-containing solder and higher temperature lead-free solder.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.119-119
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• 2000

A new type of low voltage driven SrTiO3 varistor was investigated. $SrTi3_3$ sintered with CuO-SiO2 additions, the sintering temperature was reduced to 1250-1300C. With the sintering additives, the semiconducting SrTi03 was able to fabricate single time sintering in reducing atmosphere(95% N2 + 5% H2), The non-linear coefficient value was 10.3 and the operating voltage was about 7 V.

• 한국포장학회지
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• 제5권1호
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• pp.1-5
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• 1999

식품의 선도가 될 수 있는대로 오래 유지되도록 하여 소비자들에게 보다 신선한 식품이 공급되도록 하는 것은 매우 중요한 일중의 하나이다. 지금까지는 식품의 선도가 유지되도록 하기 위한 방편으로서 식품보존용기에 사람에게 유해한 방부제를 첨부하거나 분위기를 제어하는 방법, 혹은 식품의 표면을 특수처리하는 방법 등이 활용되어 왔다. 그러나 이러한 방법들은 모두 나름대로의 장단점을 안고 있다. 본 연구에서는 식품보존방법에 대해 새로운 개념을 도입하여 다른 이물질을 식품 보관용 필름에 혼입하지 않고도 식품자체의 선도가 유지되도록 하는 기술을 개발하고자 하였다. 기술의 요체는 식품이 오래 선도를 유지할 수 있도록 하는 정보를 물에 각인한 다음에 이를 식품 보관용 필름에 전사하여 그러한 기능을 갖도록 한 것으로서 일종의 기능성 필름이라고 할 수 있다. 이러한 개념에 입각한 기술의 실용화 가능성을 검토하기 위하여 실험을 수행한 결과 선도유지 기능이 우수한 것으로 나타났다. 앞으로 이러한 기술이 보다 더 다듬어지고 그 작용기전이 밝혀진다면 더욱 우수한 제품이 개발될 가능성이 높다고 하겠다.