• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.19-24
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• 2016

Along the few nano sizing dimensions of integrated circuit (IC) devices, acceptable interlayer material for design is inevitable. The interlayer which include dielectric, interconnect, barrier etc. needs to achieve not only electrical properties, but also mechanical properties for endure post manufacture process and prolonging life time. For developing intermetallic dielectric (IMD) the mechanical issues with post manufacturing processes were need to be solved. For analyzing specific structural problem and material properties Raman spectroscopy was performed for various researches in Si semiconductor based materials. As improve of the laser and charge-coupled device (CCD) technology the total effectiveness and reliability was enhanced. For thin film as IMD developed material could be analyzed by Raman spectroscopy, and diverse researches of developing method to analyze thin layer were comprehended. Also In-situ analysis of Raman spectroscopy is introduced for material forming research.

• 마이크로전자및패키징학회지
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• 제26권2호
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• pp.55-58
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• 2019

최근 표면 플라즈몬 효과는 광 신호 향상에 중요하게 대두되고 있는 분야로써, 약한 광학적 신호를 증가시킴에 따라 바이오 분야나 뉴로사이언스에 매우 중요한 분야로 대두되었다. 플라즈모닉 구조를 제작하기 위해선 나노 구조의 크기 높이 그리고 입사광의 입사각 등 다양한 변수들이 존재하는데 본 논문에서는 플라즈모닉 나노구조의 제작을 위한 은 증착 높이에 따른 플라즈모닉 나노구조의 광학적 특성에 대한 연구를 진행하였다. 은 증착은 플라즈모닉 효과를 보기 위해 다양하게 사용하고 있는 금속으로 특정 파장에 반응을 보기 위해 제작한 구조 형태와 유사한 구조를 시간영역 유한차분(FDTD)법을 통해 광 특성을 예측하여, 최종적으로 제작한 구조의 은 나노 입자 부근에 에너지가 집중되는 결과를 확인하였다.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.25-34
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• 2018

In this paper, we review the latest technical progress and commercialization of stretchable interconnectors, stretchable strain sensors, and stretchable substrates for stretchable electronics. The development of stretchable electronics can pave a way for new applications such as wearable devices, bio-integrated devices, healthcare and monitoring, and soft robotics. The essential components of stretchable electronic devices are stretchable interconnector and stretchable substrate. Stretchable interconnector should have high stretchability and high electrical conductivity as well as stability under severe mechanical deformation. Therefore several nanocomposite-based materials using CNT, graphene, nanowire, and metal flake have been developed. Geometric engineering such as wavy, serpentine, buckled and mesh structure has been well developed. Stretchable substrate should also pose high stretchability and compatibility with stretchable sensing or interconnecting material. We summarize the recent research results of new materials for stretchable interconnector and substrate as well as strain sensors. The Important challenges in development of the stretchable interconnector and substrate are also briefly discussed.

• Transactions on Electrical and Electronic Materials
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• 제15권2호
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• pp.91-95
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• 2014

This paper presents the structure and process technology of simple and low-cost wafer-level packaging (WLP) for thin film radio frequency (RF) devices. Low-cost practical micromachining processes were proposed as an alternative to high-cost processes, such as silicon deep reactive ion etching (DRIE) or electro-plating, in order to reduce the fabrication cost. Gold (Au)/Tin (Sn) alloy was utilized as the solder material for bonding and hermetic sealing. The small size fabricated WLP of $1.04{\times}1.04{\times}0.4mm^3$ had an average shear strength of 10.425 $kg/mm^2$, and the leakage rate of all chips was lower than $1.2{\times}10^{-5}$ atm.cc/sec. These results met Military Standards 883F (MIL-STD-883F). As the newly proposed WLP structure is simple, and its process technology is inexpensive, the fabricated WLP is a good candidate for thin film type RF devices.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.85-89
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• 2014

본 연구에서는 자기 소프트 몰드를 이용하여 피치 143.59 nm의 고 성능 NWGP(Nano Wire Grid Polarizer) 필름의 새로운 제조 방법을 제안하였다. 제작된 편광필름은 $6cm{\times}6cm$의 PET기판위에 알루미늄 격자 구조를 가지고 있으며, 이는 TFT-LCD(Thin Flat Transistor Liquid Crystal Display)에 응용 가능할 것으로 보인다. 자기 소프트 몰드는 너비 70.39 nm의 규격으로 제작되었으며, 이를 이용하여 2단계의 복제과정을 거쳐 제작되어진다. 이를 통해 본 연구에서는 기판위에 75.68 nm 선폭과 64.76 nm의 높이 143.59 nm pitch를 가지는 격자구조의 NWGP 패턴을 제작하였다. 또한, 이는 800 nm 파장 영역 대에서 75%의 최대 투과율과 10%의 최소 투과율을 가지는 것을 확인하였다. 따라서, 본 공정을 통해 독창적인 저 비용의 나노패터닝 기술로 디스플레이 산업에서 적용되어 질 것으로 보여진다.

• 센서학회지
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• 제15권4호
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• pp.277-283
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• 2006

We presented that fabrication process and characteristics of 3 axes flexible tactile sensor available for normal and shear force fabricated using Si micromachining and packaging technologies. The fabrication processes for 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1 %/N and 0.5 %/N in applying normal and shear force, respectively. The flexibility of fabricated 3 axes flexible tactile sensor array was good enough to place on the finger-tip.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1587_1588
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• 2009

In this paper, PCB embedded balanced-to-unbalamced duplexer using coupled LC resonator was introduced for low cost dualband WiMax front-end-module application. In order to obtain the function of bandpass filter and balun transformer, proposed duplexer was configured by using magnetically coupled LC resonator. Out-of-band suppression was enhanced by applying two m-Derived transform circuits to obtain transmission zeros at 2GHz and 4.8GHz. In order to reduce the size of embedded duplexer, BaSrTiO3 (BST) composite high Dk RCC film was applied to improve the capacitance density. This high Dk film provided the capacitance density of 12.2 pF/mm2. The simulation results shows that fabricated duplexer had an insertion loss of 2.9dB and 5.5dB and return loss of 15dB and 16dB for 2.5GHz~2.6GHz and 3.5GHz~3.6GHz, respectively. The maximum magnitude and phase imbalance were 0.01dB and 0.17dB, and 1degree and 2degree in its passband, respectively. The out-of-band suppression was observed approximately 29dB and 40dB below 1.9GHz and over 4.5GHz, respectively. It has a volume of 6 mm $\times$ 7 mm $\times$ 0.7 mm (height).

• 대한기계학회논문집B
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• 제34권3호
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• pp.251-258
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• 2010

본 논문은 다기능 미소유체시스템의 일체형 패키징을 위한 MSI (microfluidic system interface) 기술을 제안하고, 이를 설계, 제작, 시험 평가하였다. MSI 기술을 통해 플러그 방식의 유체 인터커넥터, 유체제어를 위한 미소밸브, 광학 인터페이스를 위한 광학창을 유체시스템에 일체형으로 쉽게 구현할 수 있었다. MSI 기술의 유용성을 보이기 위해 미소 유전자시료전처리시스템에 적용되었으며, 미소 유전자시료전처리시스템은 세포정제, 세포분리, 세포용해, DNA 고체상추출, 중합효소연쇄반응, 그리고 모세관전기영동 기능으로 구성되었다. 나아가 MSI 기술이 적용된 미소 유전자시료전처리시스템의 DNA 고체상추출 및 중합효소연쇄반응의 실험결과로부터 MSI가 미소유체시스템을 위한 실용적 패키징 기술임이 검증되었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1627-1628
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• 2006

In this paper, mesoporous only platinum electrode and micro pore platinum electrode with mesoporous Pt are fabricated and characterized on a silicon substrate to check their usability as enzymeless sensing electrodes for developing non-disposable glucose sensors integrated with silicon CMOS read out circuitry. Since most of electrochemical glucose sensors are disposable due to the use of the enzymes that are living creatures, these are limited to use in the in-vivo and continuous monitoring system applications. The proposed mesoporous Pt electrode with approximately 2.5nm in pore diameter and 150nm in height was fabricated by using a nonionic surfactant $C_{16}EO_8$ and an electroplating technique. The micro pore Pt electrode with mesoporous Pt means the mesoporous Pt electrode fabricated on top of micro pore arrayed Pt electrode with approximately $10{\mu}m$ in pore diameter and $80{\mu}m$ in height. The measured current responses at 10mM glucose solution of plane Pt, micro pore Pt, micro pore with mesoporus Pt, and mesoporous Pt electrodes are approximately $9.9nA/mm^2$, $92.4nA/mm^2$, $3320nA/mm^2$ and $44620nA/mm^2$, respectively. These data indicate that the mesoporous Pt electrode is much more sensitive than the other Pt electrodes. Thus, it is promising for non-disposable glucose sensor and electrochemical sensor applications.

• 펄프종이기술
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• 제37권3호
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• pp.33-40
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• 2005

In this study, a nano-colloidal silica sol was applied to control the anti-slip property by spraying on kraft paper. Two kinds of nano-colloidal silica sol which have cationic and anionic charge were applied in kraft paper, and the friction and physical strength properties of kraft paper were investigated. The application of colloidal silica sol on wet web in wet-end process by spraying method was tried to improve the friction property and to avoid the general problems of machine contaminations caused by the scattering of sprayed silica particles in dryer part. The physical properties of sheet were also improved by the application of wet web spraying method, and the optimum conditions of wet web spraying operation were closely related with the conditions of pH and electrical charge of wet web and silica sol.