• Title/Summary/Keyword: n type Si

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Charge trapping characteristics of the zinc oxide (ZnO) layer for metal-oxide semiconductor capacitor structure with room temperature

  • Pyo, Ju-Yeong;Jo, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.310-310
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    • 2016
  • 최근 NAND flash memory는 높은 집적성과 데이터의 비휘발성, 낮은 소비전력, 간단한 입, 출력 등의 장점들로 인해 핸드폰, MP3, USB 등의 휴대용 저장 장치 및 노트북 시장에서 많이 이용되어 왔다. 특히, 최근에는 smart watch, wearable device등과 같은 차세대 디스플레이 소자에 대한 관심이 증가함에 따라 유연하고 투명한 메모리 소자에 대한 연구가 다양하게 진행되고 있다. 대표적인 플래시 메모리 소자의 구조로 charge trapping type flash memory (CTF)가 있다. CTF 메모리 소자는 trap layer의 trap site를 이용하여 메모리 동작을 하는 소자이다. 하지만 작은 window의 크기, trap site의 열화로 인해 메모리 특성이 나빠지는 문제점 등이 있다. 따라서 최근, trap layer에 다양한 물질을 적용하여 CTF 소자의 문제점을 해결하고자 하는 연구들이 진행되고 있다. 특히, 산화물 반도체인 zinc oxide (ZnO)를 trap layer로 하는 CTF 메모리 소자가 최근 몇몇 보고 되었다. 산화물 반도체인 ZnO는 n-type 반도체이며, shallow와 deep trap site를 동시에 가지고 있는 독특한 물질이다. 이 특성으로 인해 메모리 소자의 programming 시에는 deep trap site에 charging이 일어나고, erasing 시에는 shallow trap site에 캐리어들이 쉽게 공급되면서 deep trap site에 갇혀있던 charge가 쉽게 de-trapped 된다는 장점을 가지고 있다. 따라서, 본 실험에서는 산화물 반도체인 ZnO를 trap layer로 하는 CTF 소자의 메모리 특성을 확인하기 위해 간단한 구조인 metal-oxide capacitor (MOSCAP)구조로 제작하여 메모리 특성을 평가하였다. 먼저, RCA cleaning 처리된 n-Si bulk 기판 위에 tunnel layer인 SiO2 5 nm를 rf sputter로 증착한 후 furnace 장비를 이용하여 forming gas annealing을 $450^{\circ}C$에서 실시하였다. 그 후 ZnO를 20 nm, SiO2를 30 nm rf sputter로 증착한 후, 상부전극을 E-beam evaporator 장비를 사용하여 Al 150 nm를 증착하였다. 제작된 소자의 신뢰성 및 내구성 평가를 위해 상온에서 retention과 endurance 측정을 진행하였다. 상온에서의 endurance 측정결과 1000 cycles에서 약 19.08%의 charge loss를 보였으며, Retention 측정결과, 10년 후 약 33.57%의 charge loss를 보여 좋은 메모리 특성을 가지는 것을 확인하였다. 본 실험 결과를 바탕으로, 차세대 메모리 시장에서 trap layer 물질로 산화물 반도체를 사용하는 CTF의 연구 및 계발, 활용가치가 높을 것으로 기대된다.

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Analysis of Thermal Stability and Schottky Barrier Height of Pd Germanide on N-type Ge-on-Si Substrate (N형 Ge-on-Si 기판에 형성된 Pd Germanide의 열안정성 및 Schottky 장벽 분석)

  • Oh, Se-Kyung;Shin, Hong-Sik;Kang, Min-Ho;Bok, Jeong-Deuk;Jung, Yi-Jung;Kwon, Hyuk-Min;Lee, Ga-Won;Lee, Hi-Deok
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.4
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    • pp.271-275
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    • 2011
  • In this paper, thermal stability of palladium germanide (Pd germanide) is analyzed for high performance Schottky barrier germanium metal oxide semiconductor field effect transistors (SB Ge-MOSFETs). Pd germanide Schottky barrier diodes were fabricated on n-type Ge-on-Si substrates and the formed Pd germanide shows thermal immunity up to $450^{\circ}C$. The barrier height of Pd germanide is also characterized using two methods. It is shown that Pd germanide contact has electron Schottky barrier height of 0.569~0.631 eV and work function of 4.699~4.761 eV, respectively. Pd germanide is promising for the nanoscale Schottky barrier Ge channel MOSFETs.

Si1-xGex Positive Feedback Field-effect Transistor with Steep Subthreshold Swing for Low-voltage Operation

  • Hwang, Sungmin;Kim, Hyungjin;Kwon, Dae Woong;Lee, Jong-Ho;Park, Byung-Gook
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.17 no.2
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    • pp.216-222
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    • 2017
  • The most prominent challenge for MOSFET scaling is to reduce power consumption; however, the supply voltage ($V_{DD}$) cannot be scaled down because of the carrier injection mechanism. To overcome this limit, a new type of field-effect transistor using positive feedback as a carrier injection mechanism (FBFET) has been proposed. In this study we have investigated the electrical characteristics of a $Si_{1-x}Ge_x$ FBFET with one gate and one-sided $Si_3N_4$ spacer using TCAD simulations. To reduce the drain bias dependency, $Si_{1-x}Ge_x$ was introduced as a low-bandgap material, and the minimum subthreshold swing was obtained as 2.87 mV/dec. This result suggests that a $Si_{1-x}Ge_x$ FBFET is a promising candidate for future low-power devices.

Development of Nano Crystal Embedded Polymorphous Silicon Thin Film by Neutral Beam Assisted CVD Process at Room Temperature

  • Jang, Jin-Nyoung;Lee, Dong-Hyeok;So, Hyun-Wook;Yoo, Suk-Jae;Lee, Bon-Ju;Hong, Mun-Pyo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.171-171
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    • 2012
  • Neutral beam assisted chemical vapor deposition (NBa-CVD) process has been developed as a nove,l room temperature deposition process for the light-soaking free nano-crystalline silicon (nc-Si) thin films including intrinsic and n-type doped thin film. During formation of nc-Si thin films by the NBa-CVD process with silicon reflector at room temperature, the energetic particles enhance doping efficiency and crystalline phase in nc-Si thin films without additional heating at substrate. The effects of incident NB energy controlled by the reflector bias have been confirmed by Raman spectra analysis. Additionally, TEM images show uniform nc-Si grains which imbedded amorphous phase without incubation layer. The nc-Si films by the NBa-CVD are hardly degenerated by light soaking; the degradations of photoconductivity were just a few percents before and after light irradiation.

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이종접합 태양전지를 위한 PECVD 방식으로 증착 된 Intrinsic a-Si:H layer 최적화에 관한 연구

  • Jo, Jae-Hyeon;Heo, Jong-Gyu;Lee, Jun-Sin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.152-152
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    • 2010
  • 이종접합 태양전지에서 Intrinsic a-Si:H의 역할은 상당히 중요하다. Passivation 효과와 높은 Voc에 이르는 핵심적인 Layer이다. 본 연구는 Intrinsic a-Si:H Layer의 증착조건을 가변하여 최적의 Passivation 효과를 얻는데 목적이 있다. 웨이퍼는 n-Type $500\;{\mu}m$두께에를 사용하였다. Intrinsic a-Si:H Layer는 $SiH_4$ 가스와 $H_2$ 가스를 혼합하여 증착하게 되는데 혼합비는 1:5로 고정하였다. 증착두께는 이종접합 태양전지에서 필요한 5nm로 고정하였으며 증착장비는 PECVD를 이용하였다. PECVD는 VHF(60MHz)를 이용하였고 증착온도는 $200^{\circ}C$로 고정하여 진행하였다. 가변내용은 전극거리와 파워, 압력이다. 전극거리는 20mm에서 80mm까지 가변하였고 압력은 100mTorr에서 500mTorr까지 가변하였다. 파워는 플라즈마의 방정특성을 알아본 후 최소파워를 이용하여 증착하였다. 이는 증착 시 플라즈마에 의한 박막 손상을 최소화하기 위함이다. 측정은 QSSPC 방식으로 Carrier Lifetime과 Implied Voc를 측정하였으며 두께는 Ellipsometry를 이용하여 측정하였다. 전극거리 60mm에서 증착압력은 400mTorr이고 파워는 $14mW/cm^2$에서 가장 높은 Carrier Lifetime 과 Implied Voc를 나타내었다. Carrier Lifetime은 2.2ms이고 Implied Voc는 709mV를 달성 하였다. Carrier Lifetime이 높으면 Surface Recombination이 낮다는 의미이며 이는 고효율 이종접합 태양전지 제작에 있어서 직렬저항을 줄일 수 있는 필수적인 요소이다. Implied Voc는 이종접합 태양전지의 Voc에 직결된 인자로 이종접합 태양전지의 Voc를 예상할 수 있는 중요한 요소이다.

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Influence of neutron irradiation and ageing on behavior of SAV-1 reactor alloy

  • Tsay, K.V.;Rofman, O.V.;Kudryashov, V.V.;Yarovchuk, A.V.;Maksimkin, O.P.
    • Nuclear Engineering and Technology
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    • v.53 no.10
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    • pp.3398-3405
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    • 2021
  • This study observed the effect of neutron irradiation and ageing on the microstructure, hardness, and corrosion resistance of SAV-1 (Al-Mg-Si) alloy. The investigated material was irradiated with neutrons to fluences of 1021-1026 n/m2 in the WWR-K research reactor and kept in dry storage. Long-term irradiation led to an increase in hardness of the alloy and a deterioration of pitting corrosion resistance. Post-irradiation ageing for 1 h at 100-300 ℃ resulted in a decrease in microhardness of the irradiated SAV-1. The effect of post-irradiation ageing on pitting corrosion was made clear through the formation of Guinier-Preston zones and secondary precipitates in the Al matrix. Ageing at 250 ℃ corresponded to the development of stable microstructure and the highest corrosion resistance for the irradiated samples. Mg2Si, Si, and needle-shaped β" precipitates were formed in SAV-1 alloy that was irradiated with low fluences. β" and clusters of rod-shaped B-type precipitates were observed in highly irradiated samples. The precipitates were similar to those seen in non-irradiated pseudo-binary Al-Mg2Si alloys with Si excess.

A Study on Implanted and Annealed Antimony Profiles in Amorphous and Single Crystalline Silicon Using 10~50 keV Energy Bombardment (비정질 및 단결정 실리콘에서 10~50 keV 에너지로 주입된 안티몬 이온의 분포와 열적인 거동에 따른 연구)

  • Jung, Won-Chae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.28 no.11
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    • pp.683-689
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    • 2015
  • For the formation of $N^+$ doping, the antimony ions are mainly used for the fabrication of a BJT (bipolar junction transistor), CMOS (complementary metal oxide semiconductor), FET (field effect transistor) and BiCMOS (bipolar and complementary metal oxide semiconductor) process integration. Antimony is a heavy element and has relatively a low diffusion coefficient in silicon. Therefore, antimony is preferred as a candidate of ultra shallow junction for n type doping instead of arsenic implantation. Three-dimensional (3D) profiles of antimony are also compared one another from different tilt angles and incident energies under same dimensional conditions. The diffusion effect of antimony showed ORD (oxygen retarded diffusion) after thermal oxidation process. The interfacial effect of a $SiO_2/Si$ is influenced antimony diffusion and showed segregation effects during the oxidation process. The surface sputtering effect of antimony must be considered due to its heavy mass in the case of low energy and high dose conditions. The range of antimony implanted in amorphous and crystalline silicon are compared each other and its data and profiles also showed and explained after thermal annealing under inert $N_2$ gas and dry oxidation.

Fabrication of Various Semiconductor/Metal Structured Nanowires Using Metal Coating (금속 코팅을 통한 다양한 반도체/금속 나노선 제작)

  • Park, Byoung-Jun;Kim, Kyung-Hwan;Kim, Hyun-Suk;Cho, Kyoung-Ah;Kim, Jin-Hyong;Lee, Joon-Woo;Kim, Sang-Sing
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.252-255
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    • 2004
  • Various Semiconductor/Metal structured nanowires were synthesized from the simple thermal annealing of ball-milled compound powders and the thermal evaporation of metals. Their structural properties were investigated by Scanning Electron Microscopy(SEM) and Transmission Electron Microscopy(TEM), Energy Dispersive X-ray spectroscopy(EDX). Depending on the type of metals and the material of nanowires, uniform somiconductor/metal nanowires(GaN/Al, GaN/Ag) or isolated metal particles on semiconductor nanowires$(SnO_2/Ti,\;Si/Ti)$ were formed on the surface of nanowires.

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Improved Rs Monitoring for Robust Process Control of High Energy Well Implants

  • Kim, J.H.;Kim, S.;Ra, G.J.;Reece, R.N.;Bae, S.Y.
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2007.06a
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    • pp.109-112
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    • 2007
  • In this paper we describe a robust method of improving precision in monitoring high energy ion implantation processes. Ion implant energy accuracy was measured in the device manufacturing process using an unpatterned implanted layer on an intrinsic p-type silicon wafer. To increase Rs sensitivity to energy at the well implant process, a PN junction structure was formed by P-well and deep N-well implants into the p-type Si wafer. It was observed that the depletion layer formed by the PN junction was very sensitive to energy variation of the well implant. Conclusively, it can be recommended to monitor well implant processes using the Rs measurement method described herein, i.e., a PN junction diode structure since it shows excellent Rs sensitivity to variation caused by energy difference at the well implant step.

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Screen printed contacts formation by rapid thermal annealing in multicrystalline silicon solar cells

  • Kim, Kyung hae;U. Gangopadhyay;Han, Chang-Soo;K. Chakrabarty;J. Yi
    • Journal of Korean Vacuum Science & Technology
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    • v.6 no.3
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    • pp.120-125
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    • 2002
  • The aim of the present work is to optimized the annealing parameter in both front and back screen printed contacts realization on p-type multicrystalline silicon and with phosphorus diffused. The RTA treatments were carried out at various temperatures from 600 to 850$\^{C}$ and annealing time ranging from 3 min to 5 min in air, O$_2$and N$_2$ ambiance. The contacts parameters are obtained according to Transmission Line Model measurements. A good RTA cycle is obtained with a temperature plateau of 700$\^{C}$-750$\^{C}$ and annealing ambiance of air. Several processing parameters required for good cell efficiency are discussed with an emphasis placed on the critical role of the glass frit in the aluminum paste. A anamolus behaviour of Aluminum n-doping on p-type Si wafer, contact at high temperature have also been studied.

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