• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.1-10
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• 2018

Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.

• Journal of the Korea institute for structural maintenance and inspection
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• v.23 no.6
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• pp.26-37
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• 2019

This paper aims to investigate the seismic characteristics of strip-type damping devices possessing optimized shapes for the moment-resisting mechanism throughout analytical and experimental studies. Predicting equations for initial stiffness and yielding strength were introduced and compared with analytical results obtained from finite element analyses (FEAs) using commercial FEA program ABAQUS. In order for establishing predicting equations, two idealized processes were considered and both predicting equations showed that they could provide enough approximations for seismic applications in building structures. Throughout experimental studies, it was noted that structural uncertainties on mild steels, connection details and structural types linking damping devices with building structures could interrupt predicting structural behavior of the devices. Also, it was observed that shear stress concentrations should be considered if shear yielding type devices are applied into building structures. Nevertheless, it was shown that structural conservatism can be established using the predicting equations and seismic applications of the damping devices can enhance the seismic performance of building structures efficiently in the viewpoint that they have high resistance to low-cycle fatigue failures.

• Journal of the Korean Geotechnical Society
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• v.31 no.5
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• pp.35-46
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• 2015

In this study, the behavior of self-supported earth retaining wall with stabilizing piles was investigated by using a numerical study and field tests in urban excavations. This earth retaining wall can provide stable support against lateral earth pressures through its use of stabilizing piles that provide passive resistance to lateral earth pressures arising due to ground excavations. Field tests at two sites were performed to verify the performance of instrumented retaining wall with stabilizing piles. Furthermore, detailed 3D numerical analyses were conducted to provide insight into the in situ wall behavior. The 3D numerical methodology in the present study represents the behavior of the self-supported earth retaining wall with stabilizing piles. A number of 3D numerical analyses were carried out on the self-supported earth retaining wall with stabilizing piles to assess the results stemming from wide variations of influencing parameters such as the soil condition, the pile spacing, the distance between the front pile and the rear pile, and the pile embedded depth. Based on the results of the parametric study, the maximum horizontal displacement and the maximum bending moment significantly decreased when the retaining wall with stabilizing piles is used. Moreover, the horizontal displacement reduction effect of influencing parameters such as the pile spacing and the distance between the front pile and the rear pile is more sensitive in sandy soil, with a higher friction angle compared to clayey soil. In engineering practice, reducing the pile spacing and increasing the distance between the front pile and the rear pile can effectively improve the stability of the self-supported earth retaining wall with stabilizing piles.