• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2007년도 동계학술발표대회 논문집
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• pp.600-605
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• 2007

In this study, the risk rates of different contamination sources of the Foreign material in a minienvironment were analyzed through CFD simulation. From the results, the ambient contamination sources mainly affect wafers in the FOUP, whereas the internal contamination sources mainly affect wafers laid on the robot arm in the minienvironment. And the purging plenum system is very useful in protecting the wafers in the FOUP from Foreign materials transferred from the FFU. However, this system is unable to protect the wafers on the robot arm from internal Foreign materials and the wafers in the FOUP from sources of the interface between the FOUP and the minienvironment.

• 한국입자에어로졸학회지
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• 제14권4호
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• pp.181-189
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• 2018

In this study, the risk rates of different contamination sources of the contaminant in a minienvironment were analyzed through Computational Fluid Dynamics (CFD) simulation. The airflow pattern characteristics can only predict the qualitative variation of contaminant concentration, but cannot evaluate the quantitative variations in the risk rate of sources. From the results, the ambient contamination sources mainly affect wafers in the Front Opening Unified Pod (FOUP), whereas the internal contamination sources mainly affect wafers laid on the robot arm in the minienvironment. And the purging plenum system is very useful in protecting the wafers in the FOUP from contaminants transferred from the Fan Filter Unit (FFU). However, this system is unable to protect the wafers on the robot arm from internal contaminants and the wafers in the FOUP from sources of the interface between the FOUP and the minienvironment.

• 공기청정기술
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• 제8권4호통권31호
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• pp.16-25
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• 1995