• Proceedings of the KIEE Conference
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• 2003.10b
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• pp.193-196
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• 2003

This paper describes a micro DC-DC converter using LTCC(Low Temperature Cofired Ceramics) technology. We have designed a inductor, an embedded structure to maximize the effect of miniaturizing, and applied the Neumann's formula to calculate inductance. Also, we have implemented a micro DC-DC conveter of which whole volume is $13{\times}18{\times}0.13[mm^3]$ by embeding other passive components such as resistors and capacitors.

• Proceedings of the KIEE Conference
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• 2003.04a
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• pp.266-269
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• 2003

A sterilizer equipment by using electrical energy has merits that no process of chemical and no second environmental pollution. Also, the power conversion circuit for sterilizer equipment has merits that are reducing switching loss for soft switching topology by using zero current and zero voltage switching, and miniaturizing size of equipment. Thus, it is expected that the cost of sterilization process, when quality of the device is measured by power consumption, will be reduced. Therefore, the purpose of this research is to solve the sterilization problems of existing powder with plasma sterilization device, to find more economical and effective way, and to suggest more improved sterilizer.

• Journal of international Conference on Electrical Machines and Systems
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• v.3 no.3
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• pp.282-288
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• 2014

A large capacity power conversion system constructed by using two or more existing power converters has a lot of flexibility in how the power converters are used. However, at the same time, it has a problem of cross current flows between power converters. The cross current must be suppressed by controlling the system while miniaturizing the combination reactor. This paper focuses on two current control methods of a power conversion system constructed by using two power converters connected in parallel supplying the same power. In order to elucidate the control performance of cross current, each control method which are aimed at controlling cross current and not directly controlling it are examined in simulations.

• The Transactions of the Korean Institute of Power Electronics
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• v.9 no.2
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• pp.171-177
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• 2004

Piezoelectric transformer(PZT) can be used advantageously in high output voltage power supply. Recently, it also can be used in AC/DC Converter for miniaturizing size nd lightening weight. The modeling of PZT was performed by the calculation method through the physical and electrical constants of the material. The attributes of PZT were derived by an approximate analysis for output voltage gain, and resonant frequency. The proposed method is verified by computer simulation and experiment.

• Applied Chemistry for Engineering
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• v.4 no.2
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• pp.264-272
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• 1993

Current research aimed at investigating of heat-resistance of magnet wire to endow miniaturizing electronic equipment with a high efficiency or reliability. Thermal stability of magnet wire has a close relationship with physical properties of polymeric coating that is formed from enamel varnish. Design of heat-resistant enamel varnish and coating technology of varnish solution were briefly described. Some factors which have a thermal effect on wire were discussed through the evaluation method of the wire properties.

• Journal of Welding and Joining
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• v.35 no.2
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• pp.1-5
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• 2017

Many microelectronic devices are miniaturizing the capacitance density and the size of the capacitor. Along with this miniaturization of electronic circuits, tantalum (Ta) capacitors have been on the market due to its large demands worldwide and advantages such as high volumetric efficiency, low temperature coefficient of capacitance, high stability and reliability. During a tantalum capacitor manufacturing process, arc welding has been used to weld base frame and sub frame. This arc welding may have limitations since the downsizing of the weldment depends on the size of welding electrode and the contact time may prevent from improving productivity. Therefore, to solve these problems, this study applies laser spot welding to weld nickel (Ni) and Au-Sn-Ni alloy using CW IR fiber laser with lap joint geometry. All laser parameters are fixed and the only control variable is laser irradiance time. Four different shapes, such as no melting upper workpiece, asymmetric spherical-shaped weldment, symmetric weldment, and, excessive weldment, are observed. This shape may be due to different temperature distribution and flow pattern during the laser spot cutting.

• ETRI Journal
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• v.38 no.5
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• pp.903-910
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• 2016

We propose a novel multi-stack (MS) technique for a compact and wideband electromagnetic bandgap (EBG) structure in high-speed multilayer printed circuit boards. The proposed MS technique efficiently converts planar EBG arrays into a vertical structure, thus substantially miniaturizing the EBG area and reducing the distance between the noise source and the victim. A dispersion method is presented to examine the effects of the MS technique on the stopband characteristics. Enhanced features of the proposed MS-EBG structure were experimentally verified using test vehicles. It was experimentally demonstrated that the proposed MS-EBG structure efficiently suppresses the power/ground noise over a wideband frequency range with a shorter port-to-port spacing than the unit-cell length, thus overcoming a limitation of previous EBG structures.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• Journal of international Conference on Electrical Machines and Systems
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• v.1 no.1
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• pp.61-66
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• 2012

Linear motors has been developed for factory automation, transportation applications, among other applications. As the trend toward compact sizes in micro electronic products progresses, the required motor drives in these applications need to be downsized with increased power densities. It appears that the winding of miniature linear motors is the most awkward part to be scaled down from conventional motor designs when miniaturizing. This paper presents an alternative design for slotless linear motors. A novel flexible printed circuit winding has been applied to obtain a simplified but qualified result. Having explained the prototyping and inspection, a discussion is given to examine the achievement of this study.

• Journal of Electrical Engineering and Technology
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• v.9 no.2
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• pp.622-627
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• 2014

A method to reduce the specific absorption rate(SAR) of the antenna for WiMAX mobile communication is proposed in this paper. The SAR reduction is achieved by miniaturizing the physical size of the antenna for the given resonance frequency by devising a metamaterial-composite right- and left-handed(CRLH) configuration-based radiator much smaller than the quarter-guided wavelength adopted a lot in the conventional planar inverted F antenna(PIFA) or modified monopole antenna. The proposed antenna is placed near the head-phantom and its SAR is evaluated by the full-wave simulations(SEMCAD X), where the metamaterial-inspired antenna is shown to have the lower value than a modified monopole as the reference in terms of the SAR.