• Title/Summary/Keyword: microwave devices

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A 3-stage Wideband Q-band Monolithic Amplifier for WLAN

  • Kang, Dong-Min;Lee, Jin-Hee;Yoon, Hyung-Sup;Shim, Jae-Yeob;Lee, Kyung-Ho
    • Proceedings of the IEEK Conference
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    • 2002.07b
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    • pp.1054-1057
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    • 2002
  • The design and fabrication of Q-band 3-stage monolithic microwave integrated circuit(MMIC) amplifier for WLAN are presented using 0.2$\square$ AIGaAs/lnGaAs/GaAs pseudomorphic high electron mobility transistor (PHEMT). In each stage of the MMIC, a negative feedback is used for both broadband and good stability. The measurement results are achieved as an input return loss under -4dB, an output return loss under -10dB, a gain of 14dB, and a PldB of 17dBm at Q-band(36~44GHz). These results closely match with design results. The chip size is 2.8${\times}$1.3mm$^2$. This MMIC amplifier will be used as the unit cell to develop millimeter-wave transmitters for use in wideband wireless LAN systems.

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40-㎓-band Low Noise Amplifier MMIC with Ultra Low Gain Flatness

  • Chang, Woo-Jin;Lee, Jin-Hee;Yoon, Hyung-Sup;Shim, Jae-Yeob;Lee, Kyung-Ho
    • Proceedings of the IEEK Conference
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    • 2002.07a
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    • pp.654-657
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    • 2002
  • This paper introduces the design and implementation of 40-㎓-band low noise amplifier (LNA) with ultra low gain flatness for wide-band wireless multimedia and satellite communication systems. The 40-㎓-band 4-stage LNA MMIC (Monolithic Microwave Integrated Circuit) demonstrates a small signal gain of more than 20 ㏈, an input return loss of 10.3 ㏈, and an output return loss of 16.3 ㏈ for 37$\square$42 ㎓. The gain flatness of the 40-㎓-band 4-stage LNA MMIC was 0.1 ㏈ for 37$\square$42 ㎓. The noise figure of the 40 ㎓-band LNA was simulated to be less than 2.7 dB for 37~42 ㎓. The chip size of the 4-stage LNA MMIC was 3.7${\times}$1.7 $\textrm{mm}^2$.

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Optimum Design of EHF CPW using FDTD (시간영역유한차분법을 이용한 극초고주파용 CPW의 최적화 설계)

  • Jang, In-Bum;Lee, Joon-ung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.12
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    • pp.1129-1132
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    • 2005
  • The purpose of this reserch is to establish the new design technology for microwave Coplanar structure. The components in microwave circuit are classified to transmission devices, EM devices, and quasi-TEM devices. After design of these devices, we analyzed these CPWs electromagnetically using FDTD method, and suggested optimum CPW structure. In oder to realize a CPW module up to 30 GHz-100 GHz band, we research on a technology of 3-dimensional microwave CPW, and GaAs substrate with Si layer for ohmic loss. As a result this research, we suppressed the leakage, resonance, coupling, and radiation of CPW EMI, and improved resonance quality of CPW.

Breakdown and Destruction Characteristics of the TTL IC by the Artificial Microwave (인위적인 전자파에 의한 TTL IC의 오동작 및 파괴 특성)

  • Hong, Joo-Il;Hwang, Sun-Mook;Huh, Chang-Su
    • Journal of the Korean Society of Safety
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    • v.22 no.5
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    • pp.27-32
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    • 2007
  • We investigated the damage of the TTL ICs which manufactured five different technologies by artificial microwave. The artificial microwave was rated at a microwave output from 0 to 1000W, at a frequency of 2.45GHz. The microwave power was extracted into a standard rectangular waveguide(WR-340) and TTL ICs were located into the waveguide. TTL ICs were damaged two types. One is breakdown which means no physical damage is done to the system and after a reset the system is going back into function. The other is destruction which means a physical damage of the system so that the system will not recover without a hardware repair. TTL SN74S08N and SN74ALS08N devices get a breakdown and destruction occurred but TTL SN74LS08N, SN74AS08N and 74F08N devices get a destruction occurred. Also destructed TTL ICs were removed their surface and a chip conditions were analyzed by SEM. The SEM analysis of the damaged devices showed onchipwire and bondwire destruction like melting due to thermal effect. The tested results expect to be applied to the fundamental data which interprets the combination mechanism of the semiconductors from artificial microwave environment.

Fabrication of Microstrip Band-Pass Filter using HTS Thin Film (고온초전도 박막을 이용한 마이크로스트립 대역통과 필터의 제작)

  • 허원일;정동철;김민기;임성훈;한병성
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1996.11a
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    • pp.389-392
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    • 1996
  • The recent development of high temperature superconducting epitaxial thin film offer great potential for planar passive microwave application such as ring resonator, filters, transmission lines, and antennas. This paper describes the fundamental properties of Microstrip Band-Pass Filter using HTS Thin Film and its application to microwave devices. In order to fabricate HTS microstrip multiple filters, We have grown laser ablated HTS thin films, patterned by photolithographic process and wet etching processes intro HTS microwave devices.

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60 GHz Low Noise Amplifier MMIC for IEEE802.15.3c WPAN System (IEEE802.15.3c WPAN 시스템을 위한 60 GHz 저잡음증폭기 MMIC)

  • Chang, Woo-Jin;Ji, Hong-Gu;Lim, Jong-Won;Ahn, Ho-Kyun;Kim, Hae-Cheon;Oh, Seung-Hyueb
    • Proceedings of the IEEK Conference
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    • 2006.06a
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    • pp.227-228
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    • 2006
  • In this paper, we introduce the design and fabrication of 60 GHz low noise amplifier MMIC for IEEE802.15.3c WPAN system. The 60 GHz LNA was designed using ETRI's $0.12{\mu}m$ PHEMT process. The PHEMT shows a peak transconductance ($G_{m,peak}$) of 500 mS/mm, a threshold voltage of -1.2 V, and a drain saturation current of 49 mA for 2 fingers and $100{\mu}m$ total gate width (2f100) at $V_{ds}$=2 V. The RF characteristics of the PHEMT show a cutoff frequency, $f_T$, of 97 GHz, and a maximum oscillation frequency, $f_{max}$, of 166 GHz. The performances of the fabricated 60 GHz LNA MMIC are operating frequency of $60.5{\sim}62.0\;GHz$, small signal gain ($S_{21}$) of $17.4{\sim}18.1\;dB$, gain flatness of 0.7 dB, an input reflection coefficient ($S_{11}$) of $-14{\sim}-3\;dB$, output reflection coefficient ($S_{22}$) of $-11{\sim}-5\;dB$ and noise figure (NF) of 4.5 dB at 60.75 GHz. The chip size of the amplifier MMIC was $3.8{\times}1.4\;mm^2$.

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V-Band Power Amplifier MMIC with Excellent Gain-Flatness (광대역의 우수한 이득평탄도를 갖는 V-밴드 전력증폭기 MMIC)

  • Chang, Woo-Jin;Ji, Hong-Gu;Lim, Jong-Won;Ahn, Ho-Kyun;Kim, Hae-Cheon;Oh, Seung-Hyueb
    • Proceedings of the IEEK Conference
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    • 2006.06a
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    • pp.623-624
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    • 2006
  • In this paper, we introduce the design and fabrication of V-band power amplifier MMIC with excellent gain-flatness for IEEE 802.15.3c WPAN system. The V-band power amplifier was designed using ETRI' $0.12{\mu}m$ PHEMT process. The PHEMT shows a peak transconductance ($G_{m,peak}$) of 500 mS/mm, a threshold voltage of -1.2 V, and a drain saturation current of 49 mA for 2 fingers and $100{\mu}m$ total gate width (2f100) at $V_{ds}$=2 V. The RF characteristics of the PHEMT show a cutoff frequency, $f_T$, of 97 GHz, and a maximum oscillation frequency, $f_{max}$, of 166 GHz. The gains of the each stages of the amplifier were modified to have broadband characteristics of input/output matching for first and fourth stages and get more gains of edge regions of operating frequency range for second and third stages in order to make the gain-flatness of the amplifier excellently for wide band. The performances of the fabricated 60 GHz power amplifier MMIC are operating frequency of $56.25{\sim}62.25\;GHz$, bandwidth of 6 GHz, small signal gain ($S_{21}$) of $16.5{\sim}17.2\;dB$, gain flatness of 0.7 dB, an input reflection coefficient ($S_{11}$) of $-16{\sim}-9\;dB$, output reflection coefficient ($S_{22}$) of $-16{\sim}-4\;dB$ and output power ($P_{out}$) of 13 dBm. The chip size of the amplifier MMIC was $3.7{\times}1.4mm^2$.

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Direct Microwave Sintering of Poorly Coupled Ceramics in Electrochemical Devices

  • Amiri, Taghi;Etsell, Thomas H.;Sarkar, Partha
    • Journal of Electrochemical Science and Technology
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    • v.13 no.3
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    • pp.390-397
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    • 2022
  • The use of microwaves as the energy source for synthesis and sintering of ceramics offers substantial advantages compared to conventional gas-fired and electric resistance furnaces. Benefits include much shorter processing times and reaching the sintering temperature more quickly, resulting in superior final product quality. Most oxide ceramics poorly interact with microwave irradiation at low temperatures; thus, a more complex setup including a susceptor is needed, which makes the whole process very complicated. This investigation pursued a new approach, which enabled us to use microwave irradiation directly in poorly coupled oxides. In many solid-state electrochemical devices, the support is either metal or can be reduced to metal. Metal powders in the support can act as an internal susceptor and heat the entire cell. Then sufficient interaction of microwave irradiation and ceramic material can occur as the sample temperature increases. This microwave heating and exothermic reaction of oxidation of the support can sinter the ceramic very efficiently without any external susceptor. In this study, yttria stabilized zirconia (YSZ) and a Ni-YSZ cermet support were used as an example. The cermet was used as the support, and a YSZ electrolyte was coated and sintered directly using microwave irradiation without the use of any susceptor. The results were compared to a similar cell prepared using a conventional electric furnace. The leakage test and full cell power measurement results revealed a fully leak-free electrolyte. Scanning electron microscopy and density measurements show that microwave sintered samples have lower open porosity in the electrode support than conventional heat treatment. This technique offers an efficient way to directly use microwave irradiation to sinter thin film ceramics without a susceptor.

Temperature Distributions of Inner Microwave for Various Working Conditions (구동조건에 따른 전자레인지 내부 온도 분포)

  • Choi, Yoon-Hwan;Kim, Dong-Kyun
    • Journal of Advanced Marine Engineering and Technology
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    • v.34 no.6
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    • pp.792-797
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    • 2010
  • Microwave oven and household cooker are devices of high voltage producer and high voltage storage batteries respectively for formation of necessary high frequencies at drive. These devices emit much heat energy because they are run at high voltages. Therefore, emitted heat energy becomes a factor that raises temperature of microwave ovens' main frame. In this research, the analysis shows the temperature distribution in microwave oven with the cooling fan drive conditions and the heat energy occurrence conditions. According to the analysis, as the speed of air outpoured in cooling fan increases, and the internal temperature decreases quantitatively. Also the inside temperature distribution was investigated by controlling heat energy emission.