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Optimum Design of EHF CPW using FDTD

시간영역유한차분법을 이용한 극초고주파용 CPW의 최적화 설계

  • Published : 2005.12.01

Abstract

The purpose of this reserch is to establish the new design technology for microwave Coplanar structure. The components in microwave circuit are classified to transmission devices, EM devices, and quasi-TEM devices. After design of these devices, we analyzed these CPWs electromagnetically using FDTD method, and suggested optimum CPW structure. In oder to realize a CPW module up to 30 GHz-100 GHz band, we research on a technology of 3-dimensional microwave CPW, and GaAs substrate with Si layer for ohmic loss. As a result this research, we suppressed the leakage, resonance, coupling, and radiation of CPW EMI, and improved resonance quality of CPW.

Keywords

References

  1. H.-Y. Lee, 'Wideband characterization of a typical bonding wire for microwave and millimeterwave integrated circuits', IEEE Trans. Microwave Theory and Tech, Vol. MTT-43, No.1, p. 63, 1995
  2. 박윤권, 이덕중, '수직형 Feed-throu호 갖는 RF-MEMS 소자의 웨이퍼 레벨 패키징', 전기전자재료학회논문지, 15권, 10호, p. 889, 2002
  3. T. Krems, W. Haydl, H. Massler, and J. Rudiger, 'Millimeter-wave performance of interconnections using wire bonding and flip chip', Proc. IEEE MTT-s. Dig., San Francisco, CA, p. 247, 1996
  4. T. Krems, W. H. Haydl, H. Massler, and J. Rudiger, 'Advantages of flip chip technology in millimeter-wave packaging', IEEE MTT-S lnt. Microwave Symp. Dig., p. 987, 1997
  5. G.-A. Lee and H.-Y. Lee, 'Suppression of Leakage and Crosstalk in Typical Millimeter -wave Flip-chip Packages', 6th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 97, p. 195, 1997
  6. 이계안, 이해영, '밀리미터파 플립 칩 실상구조 에서의 누설파와 간섭효과 억제방법', 전자공학회논문지-D, 35권, 4호, p. 40, 1998
  7. B. Golia, H. B. Sequeira, S. Duncan, G. Mendenilla, and N. E. Byer, 'A Coplanar-to-microstrip Transition for W -band Circuit Fabrication with 100-$\mu$m-thick GaAs Wafers', IEEE MTT-S lnt. Microwave Symp. Dig., p. 889, 1999