• Title/Summary/Keyword: microsystems

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Fabrication of a novel micromachined measurement device for temperature distribution measurement in the microchannel (마이크로채널 내의 온도 분포 측정을 위한 미소 측정 구조물의 제작)

  • Park, Ho-Joon;Lim, Geun-Bae;Son, Sang-Young;Song, In-Seob;Pak, James-Jung-Ho
    • Proceedings of the KIEE Conference
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    • 2001.07c
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    • pp.1921-1923
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    • 2001
  • In this work, an array of resistance temperature detector(RTD) was fabricated inside the microchannel in order to investigate in-situ flow characteristics. A rectangular straight microchannel, integrated with RTD's for temperature sensing and a heat source for generating the temperature gradient along the channel. were fabricated with the dimension of $200{\mu}m(W){\times}{\mu}m(D){\times}$48mm(L), while RTD measured precise temperatures at the inside-channel wall. 4" $525{\pm}25{\mu}m$ thick P-type <100> Si wafer was used as a substrate. For the fabrication of RTDs. 5300$\AA$ thick Pt/Ti layer was sputtered on a Pyrex glass wafer. Finally, glass wafer was bonded with Si wafer by anodic bonding, therefore RTD was located inside the microchannel. The temperature distribution inside the fabricated microchannel was obtained from 4 point probe measurements and Dl water is used as a working fluid. Temperature distribution inside the microchannel was measured as a function of mass flow rate and heat flux. As a result, precise temperatures inside the microchannel could be obtained. In conclusion, this novel temperature distribution measurement system will be very useful to the accurate analysis of the flow characteristics in the microchannel.

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The surface propery change of multi-layer thin film on ceramic substrate by ion beam sputtering (이온빔 스퍼터링법에 의한 다층막의 표면특성변화)

  • Lee, Chan-Young;Lee, Jae-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.259-259
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    • 2008
  • The LTCC (Low Temperature Co-fired Ceramic) technology meets the requirements for high quality microelectronic devices and microsystems application due to a very good electrical and mechanical properties, high reliability and stability as well as possibility of making integrated three dimensional microstructures. The wet process, which has been applied to the etching of the metallic thin film on the ceramic substrate, has multi process steps such as lithography and development and uses very toxic chemicals arising the environmental problems. The other side, Plasma technology like ion beam sputtering is clean process including surface cleaning and treatment, sputtering and etching of semiconductor devices, and environmental cleanup. In this study, metallic multilayer pattern was fabricated by the ion beam etching of Ti/Pd/Cu without the lithography. In the experiment, Alumina and LTCC were used as the substrate and Ti/Pd/Cu metallic multilayer was deposited by the DC-magnetron sputtering system. After the formation of Cu/Ni/Au multilayer pattern made by the photolithography and electroplating process, the Ti/Pd/Cu multilayer was dry-etched by using the low energy-high current ion-beam etching process. Because the electroplated Au layer was the masking barrier of the etching of Ti/Pd/Cu multilayer, the additional lithography was not necessary for the etching process. Xenon ion beam which having the high sputtering yield was irradiated and was used with various ion energy and current. The metallic pattern after the etching was optically examined and analyzed. The rate and phenomenon of the etching on each metallic layer were investigated with the diverse process condition such as ion-beam acceleration energy, current density, and etching time.

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Development of Cu CMP process for Cu-to-Cu wafer stacking (Cu-to-Cu 웨이퍼 적층을 위한 Cu CMP 특성 분석)

  • Song, Inhyeop;Lee, Minjae;Kim, Sungdong;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.4
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    • pp.81-85
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    • 2013
  • Wafer stacking technology becomes more important for the next generation IC technology. It requires new process development such as TSV, wafer bonding, and wafer thinning and also needs to resolve wafer warpage, power delivery, and thermo-mechanical reliability for high volume manufacturing. In this study, Cu CMP which is the key process for wafer bonding has been studied using Cu CMP and oxide CMP processes. Wafer samples were fabricated on 8" Si wafer using a damascene process. Cu dishing after Cu CMP and oxide CMP was $180{\AA}$ in average and the total height from wafer surface to bump surface was approximately $2000{\AA}$.

Simple Fabrication of Micromixer Based on Non-Equilibrium Electrokinetics in Micro/Nano Hybrid Fluidic System (단순공정으로 제작된 마이크로/나노 하이브리드 채널의 불균형 동전기성을 이용한 미세혼합기 연구)

  • Yu, Samuel;Kim, Sun-Min
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.4
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    • pp.385-390
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    • 2011
  • In this study, we developed a micromixer based on the non-equilibrium electrokinetics at the junction of a microchannel and nanochannel. Two fluid streams were mixed by an electro-osmotic flow and a vortex flow created as a result of the non-equilibrium electrokinetics at the junction of the microchannel and nanochannel. Initially, the microchannel was fabricated using Polydimethylsiloxane (PDMS) by the general soft lithography process and the nanochannel was created at a specific position on the microchannel by applying a high voltage. To evaluate the mixing performance of the micromixer, fluorescent distribution was analyzed by using the fluorescent dye, Rhodamine B. About 90% mixing was achieved with this novel micromixer, and this micromixer can be used in microsystems for biochemical sample analysis.

Changes in Breast-tumor Blood Flow in Response to Hypercapnia during Chemotherapy with Laser Speckle Flowmetry

  • Kim, Hoonsup;Lee, Youngjoo;Lee, Songhyun;Kim, Jae Gwan
    • Current Optics and Photonics
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    • v.3 no.6
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    • pp.555-565
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    • 2019
  • Development of a biomarker for predicting tumor-treatment efficacy is a matter of great concern, to reduce time, medical expense, and effort in oncology therapy. In a preclinical study, we hypothesized that the blood-flow parameter based on laser speckle flowmetry (LSF) could be a potential indicator to estimate the efficacy of breast-cancer treatment. To verify this hypothesis, a 13762-MAT-B-III rat breast tumor was grown in a dorsal skinfold window chamber applied to a nude mouse, and the change in blood flow rate (BFR) - or the speckle flow index (SFI) is used together as the same meaning in this manuscript - was longitudinally monitored during tumor growth and metronomic cyclophosphamide treatment. Based on the daily LSF angiogram, several BFR parameters (baseline SFI, normalized SFI, and △rBFR) were compared to tumor size in the normal, treated, and untreated tumor groups. Despite the incomplete tumor treatment, we found that the daily changes in all BFR parameters tended to have partially positive correlation with tumor size. Moreover, we observed that the changes in baseline SFI and normalized SFI responded one day earlier than the tumor shrinkage during chemotherapy. However, daily variations in the hypercapnia-induced △rBFR lagged tumor shrinkage by one day. This study would contribute not only to evaluating tumor vascular response to treatment, but also to monitoring blood-flow-mediated diseases (in brain, skin, and retina) by using LSF in preclinical settings.

A Study on the Direction of Mathematics Education according to the Perspective of the Classroom Ecology (교실생태학적 관점에 따른 수학교육의 방향 탐색)

  • Lee, Dae-Hyun
    • Education of Primary School Mathematics
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    • v.14 no.1
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    • pp.1-12
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    • 2011
  • This paper provides an outline of mathematics education based on the classroom ecology. Ecology is the subject that concentrates on the relations of human and environment. As mathematics education consists of many factors, it is natural that mathematics education should be interest in the perspective of ecology. This paper examines the meaning of ecology and classroom ecology of mathematics education in the perspective of ecology. And it provides the directions of ecological mathematics education. In special, I set the frame of mathematics classroom in the perspective of ecology. The ecological structure divides microsystem(teacher, student, content), mesosysten(relations of microsystems), exosystem(school), and macrosystem(the objects of mathematics education). Lastly, I suggest the ways of mathematical learning and research of classroom ecology in mathematics education. For we should focus the improvement of students' mathematical ability, we must search for the various teaching and learning methods and the ares of research in the perspective of ecology classroom. Therefore, we should be interested in the classroom environments as well as teaching methods, contents based on the ecology classroom in mathematics education.

Multimodality Image Registration and Fusion using Feature Extraction (특징 추출을 이용한 다중 영상 정합 및 융합 연구)

  • Woo, Sang-Keun;Kim, Jee-Hyun
    • Journal of the Korea Society of Computer and Information
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    • v.12 no.2 s.46
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    • pp.123-130
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    • 2007
  • The aim of this study was to propose a fusion and registration method with heterogeneous small animal acquisition system in small animal in-vivo study. After an intravenous injection of $^{18}F$-FDG through tail vain and 60 min delay for uptake, mouse was placed on an acryl plate with fiducial markers that were made for fusion between small animal PET (microPET R4, Concorde Microsystems, Knoxville TN) and Discovery LS CT images. The acquired emission list-mode data was sorted to temporally framed sinograms and reconstructed using FORE rebining and 2D-OSEM algorithms without correction of attenuation and scatter. After PET imaging, CT images were acquired by mean of a clinical PET/CT with high-resolution mode. The microPET and CT images were fusion and co-registered using the fiducial markers and segmented lung region in both data sets to perform a point-based rigid co-registration. This method improves the quantitative accuracy and interpretation of the tracer.

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Fabrication of SOI Structures with Buried Cavities for Microsystems SDB and Electrochemical Etch-stop (SDB와 전기화학적 식각정지에 의한 마이크로 시스템용 매몰 공동을 갖는 SOI 구조의 제조)

  • Chung, Gwiy-Sang;Kang, Kyung-Doo;Choi, Sung-Kyu
    • Journal of Sensor Science and Technology
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    • v.11 no.1
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    • pp.54-59
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    • 2002
  • This paper describes a new process technique for batch process of SOI(Si-on-Insulator) structures with buried cavities for MEMS(Micro Electro Mechanical System) applications by SDB(Si-wafer Direct Bonding) technology and electrochemical etch-stop. A low-cost electrochemical etch-stop method is used to control accurately the thickness of SOI. The cavities were made on the upper handling wafer by Si anisotropic etching. Two wafers are bonded with an intermediate insulating oxide layer. After high-temperature annealing($1000^{\circ}C$, 60 min), the SDB SOI structure with buried cavities was thinned by electrochemical etch-stop. The surface of the fabricated SDB SOI structure have more roughness that of lapping and polishing by mechanical method. This SDB SOI structure with buried cavities will provide a powerful and versatile substrate for novel microsensors arid microactuators.

- A Case Study on OOP Component Build-up for Reliability of MRP System - (MRP 시스템의 신뢰성을 위한 객체재향 컴포넌트 개발 사례)

  • Seo Jang Hoon
    • Journal of the Korea Safety Management & Science
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    • v.6 no.3
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    • pp.211-235
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    • 2004
  • Component based design is perceived as a key technology for developing advanced real-time systems in a both cost- and time effective manner. Already today, component based design is seen to increase software productivity, by reducing the amount of effort needed to update and maintain systems, by packaging solutions for re-use, and easing distribution. Nowdays, a thousand and one companies in If(Information Technology) industry such as Sl(System Integration) and software development companies, regardless of scale of their projects, has spent their time and endeavor on developing reusable business logic. The component software is the outcome of software developers effort on overcoming this problem; the component software is the way propositioned for quick and easy implementation of software. In addition, there has been lots of investment on researching and developing the software development methodology and leading If companies has released new standard technologies to help with component development. For instance, COM(Component Object Model) and DCOM(Distribute COM) technology of Microsoft and EJB(Enterprise Java Beans) technology of Sun Microsystems has turned up. Component-Based Development (CBD) has not redeemed its promises of reuse and flexibility. Reuse is inhibited due to problems such as component retrieval, architectural mismatch, and application specificness. Component-based systems are flexible in the sense that components can be replaced and fine-tuned, but only under the assumption that the software architecture remains stable during the system's lifetime. In this paper, It suggest that systems composed of components should be generated from functional and nonfunctional requirements rather than being composed out of existing or newly developed components. about implements and accomplishes the modeling for the Product Control component development by applying CCD(Contract-Collaboration Diagram), one of component development methodology, to MRP(Material Requirement Planning) System

Effects of Sputtering Condition on Structural Properties of PZT Thin Films on LTCC Substrate by RF Magnetron Sputtering (저온동시소성세라믹 기판 위에 제작된 PZT 박막의 증착조건이 박막의 구조적 특성에 미치는 영향)

  • Lee, Kyung-Chun;Hwang, Hyun-Suk;Lee, Tae-Yong;Hur, Won-Young;Song, Joon-Tae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.4
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    • pp.297-302
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    • 2011
  • Recently, low temperature co-fired ceramic (LTCC) technology is widely used in sensors, actuators and microsystems fields because of its very good electrical and mechanical properties, high reliability and stability as well as possibility of making 3D micro structures. In this study, we investigated the effects of sputtering gas ratio and annealing temperature on the crystal structure of $Pb(ZrTi)O_3$ (PZT) thin films deposited on LTCC substrate. The LTCC substrate with thickness of $400\;{\mu}m$ were fabricated by laminating 4 green tapes which consist of alumina and glass particle in an organic binder. The PZT thin films were deposited on Pt / Ti / LTCC substrates by RF magnetron sputtering method. The results showed that the crystallization of the films were enhanced as increasing $O_2$ mixing ratio. At about 25% $O_2$ mixing ratio, was well crystallized in the perovskite structure. PZT thin films was annealed at various temperatures. When the annealing temperature is lower, the PZT thin films become a phyrochlore phase. However, when the annealing temperature is higher than $600^{\circ}C$, the PZT thin films become a perovskite phase. At the annealing temperature of $700^{\circ}C$, perovskite PZT thin films with good quality structure was obtained.