References
- R. S. List, C. Webb, and S. E. Kim, "3D wafer stacking technology", AMC, 29 (2002).
- M. K. Choi, E. Kim, "Ultra-thinned Si wafer processing for wafer level 3D packaging", J. KWJS, 26(1), 12 (2008). https://doi.org/10.5781/KWJS.2008.26.1.012
- P. Morrow, M. Kobrinsky, M. Harmes, C. Park, S. Ramanathan, V. Ramachandrarao, "Wafer-level 3D interconnects via Cu bonding", AMC, 125 (2004).
- Y. Kim, S. Kang, S. D. Kim, S. E. Kim, "Wafer warpage analysis of stacked wafers for 3D integration", Microelectron. Eng., 89, 46 (2012). https://doi.org/10.1016/j.mee.2011.01.079
- B. Vandevelde, C. Okoro, M. Gonzalez, B. Swinnen, E. Beyne, "Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies", IEEE EuroSimE, 1 (2008).
- K. Oh, J. Ma, S. Kim, S. E. Kim, "Interconnect Process Technology for High Power Delivery and Distribution", J. Microelectron. Packag. Soc., 19(3), 9 (2012). https://doi.org/10.6117/kmeps.2012.19.3.009
- Y-S Tang, Y-J Chang, and K-N Chen, "Wafer-level Cu-Cu bonding technology", Microelectron. Reliab., 52, 312 (2012). https://doi.org/10.1016/j.microrel.2011.04.016
- P. R. Morrow, C. M. Park, S. Ramanathan, M. J. Kobrinsky, M. Harmes, "Three-dimensional wafer stacking via Cu-Cu bonding integrated with 65-nm strained-Si/low-k CMOS technology", IEEE EDL, 27(5), 335 (2006). https://doi.org/10.1109/LED.2006.873424
- A. Jourdain, S. Stoukatch, P. De Moor, W. Ruythooren, "Simultaneous Cu-Cu and compliant dielectric bonding for 3D stacking of ICs", IEEE IITC, 207 (2007).
- J. Q. Lu, J. J. McMahon, R. J. Gutmann, "3D Integration using adhesive, metal, and metal/adhesive as wafer bonding interfaces", MRS Proceedings, 1112(1) (2008).
- P. Y. H. Cho, S. E. Kim, S. Kim, "Wafer Level Bonding Technology for 3D Stacked IC", J. Microelectron. Packag. Soc., 20(1), 1(2013). https://doi.org/10.6117/kmeps.2013.20.1.007
- S. Kang, J. Lee, E. Kim, N. Lim, S. Kim, S. Kim, S. E. Kim, "Fabrication and Challenges of Cu-to-Cu Wafer Bonding", J. Microelectron. Packag. Soc., 19(2), 29 (2012). https://doi.org/10.6117/kmeps.2012.19.2.029
- E. Kim, M. Lee, S. Kim, S. E. Kim, "Ti/Cu CMP process for wafer level 3D integration", J. Microelectron. Packag. Soc., 19(3), 37 (2012). https://doi.org/10.6117/kmeps.2012.19.3.037
- E. Kim, M. Lee, S. E. Kim, S. Kim, "Cu CMP evaluation for 3D wafer stacking", IUMRS-ICA , MoP003 (2012).
- Y. Ein-Eli and D. Starosvetsky, "Review on copper chemicalmechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)-An electrochemical perspective", Electrochimica Acta, 52, 1825 (2007). https://doi.org/10.1016/j.electacta.2006.07.039
- K. Gurnett, T. Adams, "Ultra-thin semiconductor wafer applications and process", Adv. Semicon. Mag., 19(4), 36-40 (2006).
- Y-J Kang, D-H Eom, J-H Song, J-G Park, "The effect of pH adjustor in Cu Slurry on Cu CMP", PacRim-CMP, 197 (2004)
- F. Spaepen, "Interfaces and stresses in thin films", Acta mater. 48, 31-42 (2000) https://doi.org/10.1016/S1359-6454(99)00286-4
Cited by
- Study of micro flip-chip process using ABL bumps vol.21, pp.2, 2014, https://doi.org/10.6117/kmeps.2014.21.2.037
- Characterization of flip chip bonded structure with Cu ABL power bumps vol.54, pp.8, 2013, https://doi.org/10.1016/j.microrel.2014.03.022