• Title/Summary/Keyword: microsystems

검색결과 100건 처리시간 0.034초

OLED-Microdisplay with embedded camera for HMD applications

  • Vogel, Uwe;Herold, Rigo;Kreye, Daniel;Richter, Bernd;Bunk, Gerd;Reckziegel, Sven;Scholles, Michael;Grillberger, Christiane;Toerker, Michael;Amelung, Jorg
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.408-410
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    • 2009
  • First demonstrators of bi-directional OLED microdisplay devices have been developed and integrated into see-through HMD optics. The device combines 'display' and 'imaging' by nested OLED pixels and photodetectors in a single CMOS chip. Major aim of this integration is to provide capabilities for eyetracking to achieve gaze-based human-displayinteraction.

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초기 비결합된 수직빗살 전극형 정전 스캐너의 거동제어 (Feedback control for initially unengaged vertical comb type electrostatic scanner)

  • 이병렬;원종화;조진우;정희문;조용철;이진호;고영철
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2006년도 하계종합학술대회
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    • pp.845-846
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    • 2006
  • In this paper, we describe a capacitive position sensing and motion control scheme of a MEMS scanner used for laser display application. The laser displays can be made by scanning laser beams much the same way a CRT scans electron beams. So the accuracy of the scanner motion determines the quality of the displayed image. The MEMS scanner under consideration is composed of electrostatic comb electrodes with initial gap and requires large driving voltage. Due to the under-damping and nonlinear driving characteristics, the scanner motion is subject to be an unwanted oscillation. For the linear scanner motion, we devise a differential charge amplifier and phase compensator. The experimental results show that the implemented feedback control system provides sufficient electrical damping and improves the dynamic performance of the scanner.

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Fabrication of Multi-layered Macroscopic Hydrogel Scaffold Composed of Multiple Components by Precise Control of UV Energy

  • Roh, Donghyeon;Choi, Woongsun;Kim, Junbeom;Yu, Hyun-Yong;Choi, Nakwon;Cho, Il-Joo
    • BioChip Journal
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    • 제12권4호
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    • pp.280-286
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    • 2018
  • Hydrogel scaffolds composed of multiple components are promising platform in tissue engineering as a transplantation materials or artificial organs. Here, we present a new fabrication method for implementing multi-layered macroscopic hydrogel scaffold composed of multiple components by controlling height of hydrogel layer through precise control of ultraviolet (UV) energy density. Through the repetition of the photolithography process with energy control, we can form several layers of hydrogel with different height. We characterized UV energy-dependent profiles with single-layered PEGDA posts photocrosslinked by the modular methodology and examined the optical effect on the fabrication of multi-layered, macroscopic hydrogel structure. Finally, we successfully demonstrated the potential applicability of our approach by fabricating various macroscopic hydrogel constructs composed of multiple hydrogel layers.

PMOLED Driver ASIC Supporting Multi-Line Addressing

  • Vogel, Uwe;Konig, Peter;Bunk, Gerd;Barth, Siegfried;Wahl, Jurgen
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.1240-1242
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    • 2009
  • This paper describes a new 160x80 passive-matrix OLED driver ASIC capable in applying multi-line addressing (MLA). Application is directed towards highly-reliable displays, e.g. in automobiles.

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마이크로 플랜트 모듈 (Microplant Module)

  • 서정현;손정민;조준연;권영운;최재훈
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.211-215
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    • 2005
  • Microsystems combine several microcomponents, optimized an entire system, to provide several specific technical functions by the shape of the microstructure. Microfabrication and micromachining techniques have played the key role in the fast development and commercialization of microsystems. Microreaction technology based on microsystems is a powerful tool for the evaluating new process and reaction pathways in chemical engineering. Because of the small characteristic dimensions of microreaction devices, mass and heat transfer processes are enhanced and, in addition, reaction conditions can be precisely controlled for optimizing yield and selectivity. The paper will report on the mixer design principle and explore several application fields of microreaction technology in the chemical synthesis

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Flexible 마이크로시스템을 위한 압전 박막 공진기의 설계 및 제작 (Design and fabrication of film Bulk Acoustic Resonator for flexible Microsystems)

  • 강유리;김용국;김수원;주병권
    • 한국전기전자재료학회논문지
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    • 제16권12S호
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    • pp.1224-1231
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    • 2003
  • This paper reports on the air-gap type thin film bulk acoustic wave resonator(FBAR) using ultra thin wafer with thickness of 50$\mu\textrm{m}$. It was fabricated to realize a small size devices and integrated objects using MEMS technology for flexible microsystems. To reduce a error of experiment, MATLAB simulation was executed using material characteristic coefficient. Fabricated thin FBAR consisted of piezoelectric film sandwiched between metal electrodes. Used piezoelectric film was the aluminum nitride(AlN) and electrode was the molybdenum(Mo). Thin wafer was fabricated by wet etching and dry etching, and then handling wafer was used to prevent damage of FBAR. The series resonance frequency and the parallel frequency measured were 2.447㎓ and 2.487㎓, respectively. Active area is 100${\times}$100$\mu\textrm{m}$$^2$.Q-factor was 996.68 and K$^2$$\_$eff/ was 3.91%.

3-D 마이크로시스템을 위한 신호 간섭 분석 (Analysis of Signal Interference for 3-D Microsystems)

  • 정두연;이종호
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.41-44
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    • 2001
  • In this paper, we explain briefly polysilicon guard layer in a simple 3-D structure. Simulation was performed extensively to see interference and characterize the role of the polysilicon guard layer. Especially, we performed extensively S-parameter simulation to analysis the signal interference. The interference was characterized in terms of oxide thickness, polysilicon doping concentration, thickness, number of contact of polysilicon guard, and metal guard size.

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