• Journal of Advanced Navigation Technology
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• v.17 no.6
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• pp.658-663
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• 2013

In this paper, a microstrip line implementation using via transition and its application of multilayer compact ring hybrid coupler are presented. This transition is the sandwich structure with via hole to connect two microstrip lines in different layer. For designing a compact RF/Microwave passive circuit, the microstrip line using via-hole transition is proposed to reduce a size of microwave circuit with long transmission line. For the validation of the microstrip line with via-hole transition, the multilayer ring hybrid coupler is implemented at center frequency of 2 GHz. The measured performances are in good agreement with simulation results and about 50% size reduction compare to conventional ring hybrid coupler.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.7
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• pp.3474-3481
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• 2013

In this work, a new high frequency transmission line structure combined with defected ground structure (DGS) and artificial dielectric substrate (ADS) structure is proposed. DGS patterns give add the additional inductance to transmission lines and results in the increased characteristic impedance for a given line width. To the contrary, ADS presents increased capacitance and reduced line impedance. So both play a role in reducing the length of transmission lines commonly, but in preserving the line impedance complementarily. This means that the length of transmission lines can be reduced furtherly by DGS and ADS without a critical change of line width compared to the cases when one of DGS and ADS is used only. As examples, $35{\sim}100{\Omega}$ transmission lines having DGS and ADS are designed, fabricated, measured, and compared to the simulation results. A good agreement between the simulated and measured line impedances is presented. In addition, the physical lengths of the proposed transmission lines are only 55.4~76.9% of those of the normal microstrip lines for the same electrical lengths.

• JSTS:Journal of Semiconductor Technology and Science
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• v.10 no.3
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• pp.232-239
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• 2010

By using the clock timing control at transmitter (TX), the crosstalk-induced jitter (CIJ) is compensated for in the 2-bit parallel data transmission through the coupled microstrip lines on printed circuit board (PCB). Compared to the authors' prior work, the delay block circuit is simplified by combining a delay block with a minimal number of stages and a 3-to-1 multiplexer. The delay block generates three clock signals with different delays corresponding to the channel delay of three different signal modes. The 3-to-1 multiplexer selects one of the three clock signals for TX timing depending on the signal mode. The TX is implemented by using a $0.18\;{\mu}m$ CMOS process. The measurement shows that the TX reduces the RX jitters by about 38 ps at the data rates from 2.6 Gbps to 3.8 Gbps. Compared to the authors' prior work, the amount of RX Jitter reduction increases from 28 ps to 38 ps by using the improved implementation.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.8
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• pp.878-883
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• 2003

New feeding structures using linearly and exponentially tapered lines to planar microstrip resonators are proposed. These can overcome the design problems from coupling losses and impedance mismatching by increasing the coupling efficiency. The variation of its feeding angle is evaluated for the insertion loss and bandwidth and the feedline length is optimized at ${\lambda}_g$/2. The ring resonators and patches fed by the tapered line have been designed and implemented. The experimental results show that the insertion loss is enhanced by about 7 dB. Both rings and antennas are better matched, without disturbing the single-mode resonance or distorting their radiation pattern

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.10
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• pp.826-831
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• 2009

In this paper, a high power RF amplifier module using AlN substrate of high thermal conductivity has been proposed. This RF amplifier module has the advantage of compact size and effective heat dissipation for the packaging of high power chip. To fabricate the thru-hole and scribing line on AlN substrate, the key parameters of $CO_2$ laser were experimented. And then, microstrip lines and spiral planar inductors were fabricated on an AlN substrate using the thin-film process. The fabricated microstrip lines on the AlN substrate has an attenuation value of 0.1 dB/mm up to 10 GHz. The fabricated spiral planar inductor has a high quality factor, a maximum of about 62 at 1 GHz for a 5.65 nH inductor. Packaging of a RF power amplifier was implemented on an AlN substrate with thru-hole. From the measured results, the gain is 24 dB from 13 to 15 GHz and the output power is 33.65 dBm(2.3 W).

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.8
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• pp.47-55
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• 1995

Proximity-coupled open-end microstrip interconnections in bilevel planar structures are investigated through three-dimensional finite-difference time-domain(3D-FDTD) method. Three types of EMC (electromagnetically coupled) microstriplines are considered, collinear lines, transverse lines and modified EMC structure. From the analyzed results, it is found that these EMC interconnections have the coupling coefficient enough to interconnect lines in bilevel structures over a broad-band. The computed results of the modified EMC structure was compared with measurement from physical model and the computed results of via hole interconnection.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.6 s.109
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• pp.529-537
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• 2006

Multi-layer PCBs are of ien used In compact microwave circuit design as density of PCB layout is increased. In this paper, the crosstalk between coupled lines connected with vias in a 4-layer PCB is investigated theoretically based on the circiuit-concept approach. Coupled lines connected with vias in a 4-layer PCB are divided into three sections, which are coupled microstrip lines and upper via section, center via section, and lower via and coupled microstrip lines section, respectively. Each section is represented by ABCD matrix. By cascading these three ABCD matrices crosstalk between coupled lines connected with vias in a 4-layer PCB is approximately calculated. The validity of this theoretical approach is verified by comparing the calculated results with the simulated ones using HFSS.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.40 no.1
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• pp.37-46
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• 2003

The transient responses on arbitrarily interconnected digital transmission lines are analyzed by an efficient node discretization technique. Since the proposed node discretization technique offers an efficient means to discretize transmission lines, the transient waveform at any position on the arbitrarily interconnected lines is easily predicted. Dispersive microstrip multiconductor transmission lines arbitrarily connected are analized for generality. The derivation of frequency-dependent equivalent circuit elements of coupled transmission lines have been carried out by the spectral domain approach(SDA). The effects of variations of excited pulse width on the crosstalks of the high-speed microstrip coupled-lines are also investigated. It has been well known that the crosstalk spike level is monotonously increased when the coupling length and effective permittivity of substrate are increased. In this paper, it is found that the variations of crosstalk level are not further monotonous as shortening the exciting pulse width toward several picosecond. The results are verified by the generalized S-parameter technique.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.4
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• pp.604-609
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• 2002

Microstrip - slot line transitions are analyzed in the spectral domain. Some kinds of transitions which depend on the orientation angle between two lines and the stub types are designed and fabricated at 5GHz. It is shown that experiment results of the transition are in good agreement with those obtained from spectral domain analysis.

• Journal of Industrial Technology
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• v.28 no.B
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• pp.251-255
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• 2008

Metamaterial are artificial structures that can be designed to exhibit specific electromagnetic properties not commonly found in nature. Metamaterial transmission lines are usually fabricated with a microstrip structure and it's equivalent circuit is composed of two series capacitances and a shunt inductance. However microstrip structure need a via hall for realizing a shunt inductance. To eliminate via hall, we proposed a CRLH transmission line using a CPW structure, and obtained equivalent circuit values, line parameters.