• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.156-159
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• 2002

Film Bulk Acoustic wave Resonator (FBAR) using thin piezoelectric films can be fabricated as monolithic integrated devices with compatibility to semiconductor process, leading to small size, low cost and high Q RF circuit elements with wide applications in communications area. This paper presents a MMIC compatible Suspended FBAR using surface micromachining. It is possible to make Si$_3$N$_4$/SiO$_2$/Si$_3$N$_4$membrane by using surface micromachining and its good effect is to remove the substrate silicon loss. FBAR was made on 2$\mu\textrm{m}$ multi-layered membrane using CVD process. According to our result, Fabricated film bulk acoustic wave resonator has two adventages. First, in the respect of device Process, our Process of the resonator using surface micromachining is very simple better than that of resonator using bull micromachining. Second, because of using the multiple layer, thermal expansion coefficient is compensated, so, the stress of thin film is reduced.

• Laser Solutions
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• v.11 no.1
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• pp.12-18
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• 2008

Laser micromachining is a promising technique to fabricate the micro-scale devices. However, there remains important challenges to reducethe redeposition of ablated materials around the laser irradiated zone and to get a smooth surface, especially for metal and semiconductor materials. To achieve the high-quality micromachined devices, various methods have been developed. Liquid-assisted micromachining can be a good solution to overcome the previously mentioned problems. During the laser ablation process, the liquid around the solid sample dramatically changes the ablation characteristics, such as ablation rate, surface profile, formation of debris, and so on. In this investigation, we conducted the laser micromachining of Si in various liquid environmental conditions, such as liquid types, liquid thickness. In addition, using nanoscale time-resolved shadowgraphy technique, we observed the ablation process in liquid environments to understand the mechanism of liquid-assisted laser micromachining.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.1
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• pp.87-92
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• 2010

Micromachining technology using a ultra-precision micromachining system is widely applied in the fields of optics, biotechnology and analytical chemistry, etc. specially in microfabrication of fresnel lens, light guide panels of TFT-LED and PDP ribs with micro-patterns, machining errors have an effect on the performance of those products. The deflection of tool and tool holder is known to be one of the very important factors that is due to machining errors in micromachining. The deflections of diamond tool and tool holder used in micro-grooving are analysed by FEM. We analysed by FEM. With an linearity valuation of FEM, deflection of tool and tool holder is calculated by using the data of cutting force which is acquired from micro-V groove machining experiments in micromachining system.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1971-1973
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• 1996

In this paper various types of gyroscope fabricated by micromachining technologies were reviewed. Four common types of gyroscope reported in the past few years are beam, tuning fork, gimbal, and vibrating shell structure made by surface micromachining using sacrificial layer, bulk micromachining using RIE, or electroplating method. In the study of these new gyroscopes, the fabrication methods, advantages and disadvantages of each structure were examined as well as the direction of development in the future.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.7
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• pp.52-58
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• 2000

최근 첨단 미세가공기술로 주목을 받고 있는 실리콘 마이크로머시닝 기술과 이를 기반으로 한 산업용 MEMS 개발현황을 소개한다. 전반부에서는 마이크로머시닝 기술의 종류를 소개하고 각각의 기술에 대해 기술근원, 미세가공원리와 기본 가공공정을 간략히 요약한 후 기전 집적형태의 마이크로머신과의 연계성을 고려한 시스템적인 측면에서의 기술특성을 상호 비교한다. 또한 가공의 양산성, 재현성, 조립성 측면에서 마이크로머시닝의 가공성을 조명함과 동시에 향후 발전방향을 전망한다.(중략)

• Journal of the Korean Society for Precision Engineering
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• v.23 no.1 s.178
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• pp.13-22
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• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.223-224
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• 2006

In this study, we have investigated the micromachining of PZT to fabricate interdigitated electrodes of electro active material actuator using Nd:YAG laser We have observed groove shapes of PZT with changing beam power, scanning speed, gas, and so on to find optimum conditions of the laser processing for PZT grooves. As a result, this method has been applied to the laser micromachining for grooves in PZT surface, and we could have optimum parameters of Nd:YAG laser Finally it was shown that the laser micromachining of PZT can substitute fer bonding, etching and deposition processes in fabricating electro active material actuator embedded with interdigitated electrodes.

• Laser Solutions
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• v.13 no.1
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• pp.1-5
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• 2010

ln this work, the feasibility of using a UV laser for micromachining of powder injection molded parts is examined experimentally. The results, although preliminary, indicate that microfabrication of various parts by laser micromachining of the injection molded parts and then sintering is promising. Particularly, micromachining of a mixture composed of stainless steel particles and polyrner binders was studied using a KrF excimer laser.

• Laser Solutions
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• v.11 no.2
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• pp.33-38
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• 2008

Laser micromachining has increasingly been adopted in various advanced industries where the high-precision machining of large-area, high-density and multi-layered components is in a strong demand. To effectively meet the requirements, the laser micromachining process must be carefully monitored. In order to facilitate the development of a new laser micromachining process and/or a new system, we have fabricated a UV laser micromachining platform that is equipped with optical modules for monitoring the process online. They include a laser power stabilizing module, a module for laser-induced breakdown spectroscopy, and an auto-focusing module.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.887-890
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• 1997

Recently micromachining using DPSSL(Diode Pumped Solid State Laser) with 3rd harmonic wavelength is actively studied in laser machining area. Micromachining using DPSSL have outstanding advantages as UV source comparing with excimer laser in various aspect such a maintenance cost, maskless machining, high repetition rate and so on. In this study micro-drilling of PCB type substrate which consists of Cu-PI-Cu layer was performed using DPSS Nd:YAG laser(355nm, wavelength) in vector scanning method. Experimental and numerical method(Matlab simulation, FEM) are used to optimize process parameter and control machining depth. The man mechanism of this process is laser ablation. It is known that there is large gap between energy threshold of copper and that of PI. Matlab simulation considering energy threshold of material is performed to effect of duplication of pulse and FEM thermal analysis is used to predict the ablation depth of copper. This study could be widely used in various laser micromachining including via hole microdrilling of PCB, and micromachining of semiconductor components, medical parts and printer nozzle and so on.