• Title/Summary/Keyword: microassembly.

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Microassembly System for the assembly of photonic components (광 부품 조립을 위한 마이크로 조립 시스템)

  • 강현재;김상민;남궁영우;김병규
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.241-245
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    • 2003
  • In this paper, a microassembly system based on hybrid manipulation schemes is proposed and applied to the assembly of a photonic component. In order to achieve both high precision and dexterity in microassembly, we propose a hybrid microassembly system with sensory feedbacks of vision and force. This system consists of the distributed 6-DOF micromanipulation units, the stereo microscope, and haptic interface for the force feedback-based microassembly. A hybrid assembly method, which combines the vision-based microassembly and the scaled teleoperated microassembly with force feedback, is proposed. The feasibility of the proposed method is investigated via experimental studies for assembling micro opto-electrical components. Experimental results show that the hybrid microassembly system is feasible for applications to the assembly of photonic components in the commercial market with better flexibility and efficiency.

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Teleoperated Microassembly and its Application to Peg-in-Hole Task

  • Kim, Deok-Ho;Kim, Yoon-Kyong;Kim, Kyunghwan;Won Choe
    • 제어로봇시스템학회:학술대회논문집
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    • 2001.10a
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    • pp.103.4-103
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    • 2001
  • This paper presents a scaled teleoperation scheme for 3-D microassembly on the experimental microassembly workcell. A workspace mapping between a master and a slave microrobot system is presented to teleoperatively control the microrobot system for microassembly such as peg-in-hole task. Based on this result, a scaling factor is designed and applied to the teleoperated micromanipulation for peg-in-hole task in a mesoscale. Using 3-D virtual simulator, the workspace of microrobot system, and the working path trajectory for microassembly is visually represented. The proposed method is validated through the execution of 3-D microassembly such as peg-in-hole task on the experimental microassembly workcell. The proposed method in the developed ...

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Intelligent User Interface for Teleoperated Microassembly

  • Song, Eun-Ha;Kim, Deok-Ho;Kim, Kyunghwan;Lee, Jaehoon
    • 제어로봇시스템학회:학술대회논문집
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    • 2001.10a
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    • pp.168.2-168
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    • 2001
  • Generally, operators suffer much difficulty in manipulating micro-nano-sized objects without assisting of human interface, due to the scaling effects in micro/nano world. Thus, the micromanipulation system based on the teleoperation techniques enables operators to manipulate the micro objects easily by transferring both human motion and manipulation skills to the micromanipulator. In teleoperated microassembly, it is necessary to provide a useful user interface for facilitating micro assembly task executed by human operators. In this paper, Intelligent User Interface (UI) for teleoperated microassembly is proposed. The proposed intelligent UI improves task performance by teleoperated micromanipulation as well as guides operators to succeed in desirable ...

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Automation of a Teleoperated Microassembly Desktop Station Supervised by Virtual Reality

  • Antoine Ferreira;Fontaine, Jean-Guy;Shigeoki Hirai
    • Transactions on Control, Automation and Systems Engineering
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    • v.4 no.1
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    • pp.23-31
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    • 2002
  • We proposed a concept of a desktop micro device factory for visually servoed teleoperated microassembly assisted by a virtual reality (VR) interface. It is composed of two micromanipulators equipped with micro tools operating under a light microscope. First a manipulator, control method for the micro object to follow a planned trajectory in pushing operation is proposed undo. vision based-position control. Then, we present the cooperation control strategy of the micro handling operation under vision-based force control integrating a sensor fusion framework approach. A guiding-system based on virtual micro-world exactly reconstructed from the CAD-CAM databases of the real environment being considered is presented for the imprecisely calibrated micro world. Finally, some experimental results of microassembly tasks performed on millimeter-sized components are provided.

Fabrication and Sensorization of a Superelastic Alloy Microrobot Gripper using Piezoelectric Polymer Sensors (초탄성 마이크로 그리퍼의 제작 및 압전폴리머 센서를 이용한 센서화)

  • 김덕호;김병규;강현재;김상민
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.251-255
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    • 2003
  • This paper presents the design, fabrication, and calibration of a piezoelectric polymer-based sensorized microgripper. Electro discharge machining technology is employed to fabricate super-elastic alloy based micro gripper. It is tested to present improvement of mechanical performance. For integration of force sensor on the micro gripper, the sensor design based on the piezoelectric polymer PVDF film and fabrication process are presented. The calibration and performance test of force sensor integrated micro gripper are experimentally carried out. The force sensor integrated micro gripper is applied to perform fine alignment tasks of micro opto-electrical components. It successfully supplies force feedback to the operator through the haptic device and plays a main role in preventing damage of assembly parts by adjusting the teaching command.

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Design, Fabrication, and Performance Evaluation of a Sensorized Superelastic Alloy Microrobot Gripper (센서화된 초탄성 마이크로그리퍼의 설계, 제작 및 성능평가)

  • Kim, Deok-Ho;Kim, Byung-Kyu;Kang, Hyun-Jae;Kim, Sang-Min
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.10
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    • pp.1772-1777
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    • 2003
  • This paper presents the design, fabrication, and calibration of a piezoelectric polymer-based sensorized microgripper. Electro discharge machining technology is employed to fabricate super-elastic alloy based micro gripper. It is tested to present improvement of mechanical performance. For integration of force sensor on the micro gripper, the sensor design based on the piezoelectric polymer PVDF film and fabrication process are presented. The calibration and performance test of force sensor integrated micro gripper are experimentally carried out. The force sensor integrated micro gripper is applied to perform fme alignment tasks of micro opto-electrical components. It successfully supplies force feedback to the operator through the haptic device and plays a main role in preventing damage of assembly parts by adjusting the teaching command.

Manufacturing Micrometer Scale Structures by an Optical Tweezers System Controlled by CyberGlove (가상장갑으로 제어되는 광핀셋 시스템을 이용한 마이크로 구조물의 제작)

  • Park, I.Y.;Lee, J.H.;Lee, Y.G.
    • Korean Journal of Computational Design and Engineering
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    • v.12 no.4
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    • pp.298-307
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    • 2007
  • In recent years, researchers are actively investigating new methods that are applicable for manufacturing micrometer to nanometer scale structures. Among them, optical tweezers that can manipulate microscopic objects using a laser is receiving one of the key attentions. Optical tweezers have been used actively in the field of science. For example, for measuring mechanical characteristics in the scale of piconewtons or for manipulating and sorting large numbers of particles, bacteria, cells. etc. However, little works have been reported for "manufacturing" objects. In this paper, we present a new method for manufacturing micrometer scale structures using micrometer scale biotin coated polystyrene particles. Particles will be controlled with a user interface that utilizes a CyberGlove and glued together by the bonding force between biotin and streptavidin.

ADHESION PHENOMENON AND ITS APPLICATION TO MANIPULATION FOR MICRO-ASSEBMLY

  • Takahashi, Kunio;Himeno, Hideo;Saito, Shigeki;Onzawa, Tadao
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.781-784
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    • 2002
  • Adhesion phenomenon is more significant for smaller objects, because adhesional force is proportional to size of the objects while gravitational force is proportional to the third power of it. For the purpose of microassembly, theoretical understanding is required for the Adhesion phenomenon. Authors have developed a force measurement system in an ultra-high vacuum chamber of Auger electron spectroscopy. The force between arbitrary combination of materials can be measured at a pressure less than 100 nPa after and before Ar ion sputtering and chemical analysis for several atomic layers of the surface. The results are successfully interpreted with a theory of contact mechanics. Since surface energy is quite important in the interpretation, electronic theory is used to evaluate the surface energy. In the manipulation of small objects, the adhesional force is always attractive. Repulsive force is essential for the manipulation. It can be generated by Coulomb interaction. The voltage required for detachment is theoretically analyzed and the effect of boundary conditions on the detachment is obtained. The possibility and limitations of micro-manipulation using both the adhesion phenomenon and Coulomb interaction are theoretically clarified. Its applicability to nano-technology is found to be expected.

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