• 한국분말재료학회지
• /
• 제9권4호
• /
• pp.267-272
• /
• 2002

The production of micro components is one of the leading technologies in the fields of information and communiation, medical and biotechnology, and micro sensor and micro actuator system. Microfabrication (micromachining) techniques such as X-ray lithography, electroforming, micromolding and excimer laser ablation are used for the production of micro components out of silicon, polymer and a limited number of pure metals or binary alloys. However, since the first development of microfabrication technologies there have been demands for the cost-effective replication in large scale series as well as the extended range of available material. One such promising process is micro powder injection molding (PIM), which inherits the advantages of the conventional PIM technology, such as low production cost, shape complexity, applicability to many materials, applicability to many materials, and good tolerance. This paper reports on a fundamental investigation of the application of W-Cu powder to micro metal injection molding (MIM), especially in view of achieving a good filling and a safe removal of a micro mold conducted in the experiment. It is absolutely legitimate and meaningful, at the present state of the technique, to continue developing the micro MIM towards production processes for micro components.

• 한국산학기술학회논문지
• /
• 제5권2호
• /
• pp.186-190
• /
• 2004

Nano size 몰드의 제작은 X-ray lithography 방법을 이용하여 몰드를 제작하고, micro size의 경우 Deep UV lithography 방법을 이용하여 몰드를 제작하고 있다. 본 연구에서는 SLS(Selective Laser Sintering)형 RP(Rapid Prototyping System)을 이용하여 미세구조 몰드를 제작하였으며, 패턴의 깊이는 400 ㎛까지 구현하였다. 제작된 몰드의 강도와 내열성을 높이기 위하여 전해도금을 이용하여 몰드의 표면에 Ni를 300 ㎛생성 시켰다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2006년도 춘계학술대회 논문집
• /
• pp.143-144
• /
• 2006

In this paper, we proposed XP KMPR-1050 negative tone resist to replace SU-8 resist for multi-layer micro-structures and thick plating mold fabrication using UV-LIGA process. XP KMPR resist proposed in this paper can be easily striped using a common stripping solution such as NMP without damage of micro-structure. The conditions for the fabrication of XP KMPR micro-structure were optimized by adjustment of exposure and post-exposure bake(PEB). The $140{\mu}m$ -thick and an aspect ratio at least 10 micro-structure and multi-layer structures were successfully fabricated through the process conditions. Through-mold electroplating and PR striping of XP KMPR has been successfully demonstrated.

• 한국표면공학회지
• /
• 제47권6호
• /
• pp.293-296
• /
• 2014

Fe-Ni has been of great interest because it is known as one of low thermal expansion alloys as various application areas. This alloy was fabricated by electroforming process, and effect of heat treatment on thermal expansion and hardness was investigated. Nano-crystalline structure of 13.3 - 63.5 nm in size was observed in the as-deposited alloy. To investigate the effect of heat treatment on grain growth and mechanical/thermal properties, we conducted hardness and coefficient of thermal expansion (CTE). From this, we confirmed these properties were varied by heat treatment. In this nano-crystalline alloy, we could observe abnormal behavior in thermal expansion between $350-400^{\circ}C$. Additionally, an abrupt change in hardness has also been observed. However, once the grains grow up to micro-sized the mechanical and thermal properties mentioned above were stabilized similar to those of bulk alloys due to heat treatment.

• 소성∙가공
• /
• 제13권3호
• /
• pp.236-241
• /
• 2004

UV-molded microlens arrays with high replication quality were fabricated using a parametric design method. It is important to maximize the replication quality, because one can obtain the replicated micro-optical components with desired properties by accurate control of the shape. In the present study, nickel mold inserts for microlens arrays with lenses having diameters between $3\mu\textrm{m}$ and $230\mu\textrm{m}$ were fabricated by electroforming process. An UV-molding system was designed and constructed, a simple technique to avoid micro-air bubbles was first suggested, and the effects of the compression pressure and UV-curing dose on the replication quality of UV-molded microlens arrays with a diameter of $14\mu\textrm{m}$ were examined experimentally. Finally, geometrical and optical properties of the replicated microlens arrays were measured and analyzed.

• 한국레이저가공학회지
• /
• 제6권3호
• /
• pp.19-28
• /
• 2003

The manufacturing process for the microfluidic device can include sequential steps such as master fabrication, electroforming, and injection molding. The laser ablation, using masks, has been applied to the fabrication of channels in microfluidic devices. In this research, an excimer laser was used to engrave microscopic channels on the surface of PET (polyethylene terephthalate), which shows a high absorption ratio for an excimer laser beam with a wavelength of 248 m. When 50-${\mu}{\textrm}{m}$-wide rectangular microscopic channels are ablated with a 500 ${\times}$ 500 ${\mu}{\textrm}{m}$ square mask at a magnification ratio of 1/10, ditch-shaped defects were found in both corners. The measurement of laser beam intensity showed that a coherent image in the PET target caused such defects. Analysis based on the Fourier diffraction theory enabled the prediction of the coherent shape at the image surface as well as the diffraction beam shape between the mask and the image surface. It also showed that the diameter of the aperture had a dominant effect. The application of aperture with a diameter of less than 3 mm helped to eliminate such defects in the ablated rectangular microscopic channels on PET without such ditch-shaped defects.

• 한국표면공학회지
• /
• 제51권1호
• /
• pp.62-70
• /
• 2018

Sulfamate plating solution containing a small amount of chloride bath was fabricated to study the properties of the electrodeposited Ni thin films. Effects of the changes of current density and additive concentration on current efficiency, residual stress, surface morphology and microstructure of Ni thin films electrodeposited from Ni sulfamate-chloride baths were investigated. The current efficiency was measured to be more than about 95%, independent of the changes of current density and saccharin concentration in the baths. Residual stress of Ni thin film was appeared to be the compressive stress modes in the range of $5{\sim}30mA/cm^2$ current density. Maximum compressive stress was observed at the current density of $10mA/cm^2$. Compressive stress values of Ni thin/thick films were increased to be about -85~-100 MPa with increasing saccharin concentration from 0 to 0.0195 M(4 g/L). Surface morphology was changed from smooth to nodule surface appearance with increasing the current density. Smooth surface morphology of Ni thin films electrodeposited from the baths containing saccharin was observed, independent of the saccharin concentration. Ni thin/thick films consist of FCC(111), FCC(200), FCC(220), FCC(311) and FCC(222) peaks. It was revealed that the FCC(200) peak of Ni thin films is the preferred orientation in the range of $5{\sim}30mA/cm^2$ current density. The intensity of FCC(200) peak was gradually decreased and the intensity of FCC(111) peak was increased with increasing saccharin concentration in the baths.