• Title/Summary/Keyword: micro-defect

Search Result 220, Processing Time 0.028 seconds

Local Binary Feature and Adaptive Neuro-Fuzzy based Defect Detection in Solar Wafer Surface (지역적 이진 특징과 적응 뉴로-퍼지 기반의 솔라 웨이퍼 표면 불량 검출)

  • Ko, JinSeok;Rheem, JaeYeol
    • Journal of the Semiconductor & Display Technology
    • /
    • v.12 no.2
    • /
    • pp.57-61
    • /
    • 2013
  • This paper presents adaptive neuro-fuzzy inference based defect detection method for various defect types, such as micro-crack, fingerprint and contamination, in heterogeneously textured surface of polycrystalline solar wafers. Polycrystalline solar wafer consists of various crystals so the surface of solar wafer shows heterogeneously textures. Because of this property the visual inspection of defects is very difficult. In the proposed method, we use local binary feature and fuzzy reasoning for defect detection. Experimental results show that our proposed method achieves a detection rate of 80%~100%, a missing rate of 0%~20% and an over detection (overkill) rate of 9%~21%.

Are critical size bone notch defects possible in the rabbit mandible?

  • Carlisle, Patricia L.;Guda, Teja;Silliman, David T.;Hale, Robert G.;Baer, Pamela R. Brown
    • Journal of the Korean Association of Oral and Maxillofacial Surgeons
    • /
    • v.45 no.2
    • /
    • pp.97-107
    • /
    • 2019
  • Objectives: Small animal maxillofacial models, such as non-segmental critical size defects (CSDs) in the rabbit mandible, need to be standardized for use as preclinical models of bone regeneration to mimic clinical conditions such as maxillofacial trauma. The objective of this study is the establishment of a mechanically competent CSD model in the rabbit mandible to allow standardized evaluation of bone regeneration therapies. Materials and Methods: Three sizes of bony defect were generated in the mandibular body of rabbit hemi-mandibles: $12mm{\times}5mm$, $12mm{\times}8mm$, and $15mm{\times}10mm$. The hemi-mandibles were tested to failure in 3-point flexure. The $12mm{\times}5mm$ defect was then chosen for the defect size created in the mandibles of 26 rabbits with or without cautery of the defect margins and bone regeneration was assessed after 6 and 12 weeks. Regenerated bone density and volume were evaluated using radiography, micro-computed tomography, and histology. Results: Flexural strength of the $12mm{\times}5mm$ defect was similar to its contralateral; whereas the $12mm{\times}8mm$ and $15mm{\times}10mm$ groups carried significantly less load than their respective contralaterals (P<0.05). This demonstrated that the $12mm{\times}5mm$ defect did not significantly compromise mandibular mechanical integrity. Significantly less (P<0.05) bone was regenerated at 6 weeks in cauterized defect margins compared to controls without cautery. After 12 weeks, the bone volume of the group with cautery increased to that of the control without cautery after 6 weeks. Conclusion: An empty defect size of $12mm{\times}5mm$ in the rabbit mandibular model maintains sufficient mechanical stability to not require additional stabilization. However, this defect size allows for bone regeneration across the defect. Cautery of the defect only delays regeneration by 6 weeks suggesting that the performance of bone graft materials in mandibular defects of this size should be considered with caution.

Automatic Analysis of Bone Formation in a Mouse Model of Frontal Bone Defect (전두골 결손 마우스 모델의 골형성 자동 분석)

  • Kang, Sun-Kyung;Jung, Sung-Tae
    • Journal of Korea Multimedia Society
    • /
    • v.18 no.9
    • /
    • pp.997-1007
    • /
    • 2015
  • In this paper, we propose a method for automatically analyzing the bone formation in a mouse model of frontal bone defect. We perforate two holes of 0.8mm diameter in the frontal bone and observe the bone formation process using a micro CT. Because the conventional analysis software of the micro CT does not support automatic analysis of the bone formation status, we have to use a manual analysis method. However the manual analysis is very cumbersome and requires a lot of time, we propose an automatic analysis method. It rotates the image around three axes directions so that the mouse's skull come into regular position. It calculates the cumulative image of the voxel values for the perforated bone surface. It estimates the hole location by finding the darkest point in the cumulative image. The proposed method was applied to 24 CT images of saline administration group and PTH administration group and hole location was estimated. BV/TV index was calculated for the estimated hole to evaluate the bone formation status. Experimental results showed that bone formation process is more active in PTH administration group. The method proposed in this paper could replace successfully the cumbersome and time consuming manual job.

A Study on the Thickness Measurement of Thin Film and the Flaw Detection of the Interface by Digital Signal Processing (디지털 신호처리에 의한 박판두께측정 및 접합경계면의 결함검출에 관한 연구)

  • Kim, Jae-Yeol;Yiu, Shin;Kim, Byung-Hyun
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 1997.04a
    • /
    • pp.123-127
    • /
    • 1997
  • Recently, it is gradually raised necessity that interface is measured accurately and managed in industrial circles and medical world, An Ultrasonic wave transmitted from a focused beam transducer is being expected as a powerful tool for NDE of micro-defect. The ultrasonic NDE of the defect is based on the form of the wave reflected form the interface In this study, regarding to the thickness of film which is in opaque object and thickness measurement was done by MEM-cepstrum analysis of received ultrasonic wave. In measument results, film thickness which is beyond distance resolution capacity was measured accurately. Also, automatically repeated discrimination analysis method can be decided in the category of all kinds of defects on semiconductor package.

  • PDF

Micro-crack Detection in Silicon Solar Wafer through Optimal Parameter Selection in Anisotropic Diffusion Filter (비등방 확산 필터의 최적조건 선정을 통한 태양전지 실리콘 웨이퍼의 마이크로 크랙 검출)

  • Seo, Hyoung Jun;Kim, Gyung Bum
    • Journal of the Semiconductor & Display Technology
    • /
    • v.13 no.3
    • /
    • pp.61-67
    • /
    • 2014
  • Micro-cracks in crystalline silicon wafer often result in wafer breakage in solar wafer manufacturing, and also their existence may lead to electrical failure in post fabrication inspection. Therefore, the reliable detection of micro-cracks is of importance in the photovoltaic industry. In this paper, an experimental method to select optimal parameters in anisotropic diffusion filter is proposed. It can reliably detect micro-cracks by the distinct extension of boundary as well as noise reduction in near-infrared image patterns of micro-cracks. Its performance is verified by experiments of several type cracks machined.

TEM Stud of GaN Thick Film Crystals Grown by HVPE

  • 송세안;이성국
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 1999.07a
    • /
    • pp.121-121
    • /
    • 1999
  • Gallium nitride (GaN) semiconductor is intensively under investigation for commercialization of short wavelength light emitting devices and laser diodes. One of serious obstacles to overcome is to reduce the defect density in GaN film grown by various techniques such as MOCVD, HVPE, etc. Many research groups including SAIT are trying to improve the defect density to 106-107/cm2 from the level of 108-1010/cm2. We have investigated epitaxial growth behaviour of GaN thin and thick films under hidride vapour phase epitaxy (HVPE) condition. In this report, we present the microstructural and crystallographical characteristics of the GaN films grown on sapphire (0001) substrate which were studied by both conventional and high-resolution transmission electron microscopy (TEM). Also we present some microscopic analysis results obtained from GaN films grown by ELO(dpitzsial lateral overgrowth)-HVPE and from GaN quantum well structures grown by MOCVD. Another serious problem in growing GaN thick film by HVPE is internal micro-cracks. We also comment the origin of the micro-crack.

  • PDF

A Special Pre-Service-Inspection Using Radiographic Testing(RT) for Brazing Fitting Uused in Aircraft Hydraulic System

  • Kim, Gyu-Ho
    • Journal of the Korean Society for Nondestructive Testing
    • /
    • v.30 no.3
    • /
    • pp.271-281
    • /
    • 2010
  • Brazing fitting which is one of the aircraft hydraulic power system components is widely used for saving weight and achieving higher reliability. Any inherent defects or damage of fitting can cause system failure and/or physical damage of human body due to highly pressurized fluid. Radiographic testing(RT) technique and additional micro-structure investigation on cut-away surfaces have been accomplished to find out some defect-like-inhomogeneity in the fittings. The radiography results showed that some defect-like-inhomogeneity existed inside body. Additional micro-structure investigation on cut-away surface reveals that the inhomogeneity is due to internal voids. In this study, it can be is said that RT technique can be a useful tool for field acceptance test of hydraulic brazing fitting in short time.

High Temperature Oxidation Behavior and Surface Defect in Fe-25Mn-1.5Al-0.5C Steel (Fe-25Mn-1.5Al-0.5C강의 고온 산화 거동과 표면 결함)

  • Park, Shin Hwa;Hong, Soon Taik;Kim, Tai Wung;Chung, In-Sang
    • Journal of the Korean Society for Heat Treatment
    • /
    • v.13 no.3
    • /
    • pp.158-162
    • /
    • 2000
  • The high temperature oxidation behavior and the surface defect in Fe-25Mn-1.5A1-0.5C steel was investigated by XRD (X-ray Diffractin) and electron microscopy. The intra- and inter-granular oxides were formed by the selective oxidation of manganese and aluminum, which were identified to MnAl2O4 phase. Aluminum nitride (AlN) was formed in front of these oxides. The ${\gamma}$-matrix was transformed to ${\alpha}$- and ${\varepsilon}$- phases by the selective oxidation of manganese. The surface defect, micro-scab was induced by the difference of the high temperature ductility between the matrix and the inter-granular oxide.

  • PDF

Aging Effect on CMP slurry (CMP 실리카 슬러리 입도분석특성)

  • Lee, Woo-Sun;Ko, Pil-Ju;Seo, Yong-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2003.08a
    • /
    • pp.12-14
    • /
    • 2003
  • As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP). process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. It is well known that the presence of hard and larger size particles in the CMP slurries increases the defect density and surface roughness of the polished wafers. In this paper, we have studied. aging effect the of CMP slurry as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

  • PDF

CMP slurry aging effect by Particle Size analysis (입도 분석을 통한 CMP 슬러리 에이징 효과)

  • Shin, Jae-Wook;Lee, Woo-Sun;Choi, Kwon-Woo;Ko, Pil-Ju;Seo, Yong-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2003.05c
    • /
    • pp.37-40
    • /
    • 2003
  • As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. It is well known that the presence of hard and larger size particles in the CMP slurries increases the defect density and surface roughness of the polished wafers. In this paper, we have studied aging effect the of CMP slurry as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

  • PDF