• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2004년도 ICCAS
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• pp.1666-1668
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• 2004

By wireless transmission data, there is high possibility to get distortion and lose by noise and barrier on wireless. If the data check damaged and lost at receiver, can't make it clear and can't judge whether this data is right or not. Therefore, by wireless transmission data need the data error check algorithm in order to decrease the data's distortion and lose and to monitoring the transmission data as real time. This study consists of RF station for wireless transmission, Water Level Meter station for water level measurement and Error check algorithm for error check of transmission data. This study is also that investigation and search for error check algorithm in order to wireless digital data transmission in condition of the least data's damage and lose. Designed transmitter and receiver with one - chip micro process to protect to swell the volume of circuit. Had designed RF transmitter - receiver station simply by means of ATMEL one - chip micro process in the systems. Used 10mW of the best RF power and 448MHz-449MHz on frequency band which can get permission to use by Frequency Law made by Korean government

• 지질공학
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• 제17권1호
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• pp.135-142
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• 2007

토목구조물의 기초가 되는 암반은 암석자체로서는 강도가 높고 투수성이 작지만 공학적 성질은 암반내의 존재하는 크랙, 절리 등 불연속면의 영향을 크게 받는다. 천부 암반내에 지배적으로 분포하는 것은 절리이지만 그 수가 적은 지하심부에 있어서 지하수 투수성의 가능성을 고려하면 암석자체의 미소크랙의 연결성이 투수성 크랙으로서 충분히 고려되어져야 한다. 이 연구에서는 절리성 암반의 절리분포 및 투수성 해석 모델화 방법을 화강암 공시체의 미소크랙에 응용하여 손상진행에 따른 화강암의 투수 특성을 추정하는 것을 목적으로 하였다. 미소크랙 데이터로부터 투수모델을 작성하여 해석한 결과 평균투수계수에 있어서 실제의 투수시험 값과 잘 일치하는 것으로 나타났다. 또한 3차원 모델의 가시화를 가지고 모델표면에서의 미소크랙과의 비교로부터 손상발달에 의한 미소크랙 발생수와 유출면으로부터 계산한 평균투수계수는 비례관계로 실험결과와 잘 일치하는 것으로 해석되었다.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.77-81
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• 2020

Silicon wafer etching in micro electro mechanical systems (MEMS) fabrication is challenging to form 3-D structures. Well known Si-wet etch of silicon employs potassium hydroxide (KOH), tetramethylammonium hydroxide (TMAH) and sodium hydroxide (NaOH). However, the existing silicon wet etching process has a fatal disadvantage that etching of the back side of the wafer is hard to avoid. In this study, a wet etching bath for 150 mm wafers was designed to prevent back-side etching of silicon wafer, and we demonstrated the optimized process recipe to have anisotropic wet etching of silicon wafer without any damage on the backside. We also presented the design of wet bath for 300 mm wafer processing as a promising process development.

• Steel and Composite Structures
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• 제15권2호
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• pp.203-220
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• 2013

The study of the tensile strength of composite materials is far more complex than analysis of the properties of elasticity and plasticity. Indeed, during mechanical loading, micro-cracks in the matrix, the fibers break, debonding of the interfaces are created. The failure process of composites is of great diversity and cannot be described if even we know: the strength criterion of each individual component, the state of stress and strain in the material, the propagation phenomena cracks in the structure and nature of the interface between the matrix and the reinforcement. This information is only partially known and the obtained by the analysis of a stress limit beyond which there is destruction of the material is almost impossible. To partially process the issue, a solution lies in a mesoscopic approach of seeking a law to locate the ultimate strength of the material for a plane stress state. Tests on rectangular plates in bending PEEK/APC2 and T300/914 three were made and this in order to validate our approach, the calculation has been implemented in a nonlinear finite element code (Castem 2000), in order to make comparison with the numerical results. The results show good agreement between numerical simulation and the two materials; however, it would be interesting to consider other phenomena in the criterion.

• Steel and Composite Structures
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• 제44권6호
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• pp.817-828
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• 2022

In this study, considering dissipated energy in fracture process zone (FPZ), a novel criterion based on maximum strain energy release rate (SER) for orthotropic materials is presented. General case of in-plane loading for cracks along the fibers is assumed. According to the experimental observations, crack propagation is supposed along the fibers and the reinforcement isotropic solid (RIS) concept is employed as a superior model for orthotropic materials. SER in crack initiation and propagation phases is investigated. Elastic properties of FPZ are extracted as a function of undamaged matrix media and micro-crack density. This criterion meaningfully links between dissipated energy due to toughening mechanisms of FPZ and the macroscopic fracture by defining stress intensity factors of the damaged zone. These coefficients are used in equations of maximum SER criterion. The effect of crack initiation angle and the damaged zone is considered simultaneously in this criterion and mode II stress intensity factor is extracted in terms of stress intensity factors of damage zone and crack initiation angle. This criterion can evaluate the effects of FPZ on the fracture behavior of orthotropic material. Good agreement between extracted fracture limit curves (FLC's) and available experimental data proves the ability of the new proposed criterion.

• 한국항행학회논문지
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• 제12권6호
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• pp.653-658
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• 2008

자동차에 적용되는 각종 전자 부품의 복잡도는 21세기를 맞이하면서 급속도로 변화하고 있다. 특히, 각종 전기, 전자 시스템의 급증은 자동차의 안전과 직결되는 문제로 인식되고 있다. 차량의 전장 및 전자부품을 연결해주는 커넥터는 인간의 신경망과 같아서 조그마한 접촉 불량도 차량의 운전에 심각한 영향을 미칠 수 있다. 차량의 진동과 커넥터 단자의 열 변형으로 인한 프레팅 부식은 산화막을 형성하여 접촉저항을 증가시키고 특히 산화층은 진접촉면적의 감소와 상승저항 등 터널 효과에서 급격한 상승을 보이는 결과로 제어신호를 왜곡하여 작동기의 동작오류를 초례한다. 본 논문에서는 이러한 프레팅 부식 현상을 검증하기 위한 주석으로 도금된 구리 커넥터에 스텝핑 모터를 사용하여 일정한 변위를 갖는 미세 진동을 유발하여 프레핑 부식의 진행과 접촉저항의 변화를 고찰하여 이에 대한 대비책을 강구하고자 한다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.1033-1036
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• 2002

Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.

• Composites Research
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• 제14권5호
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• pp.46-53
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• 2001

집중하중을 받는 일방향 보강(singly oriented ply, SOP) 섬유 금속 적층판(fiber metal laminate, FML)의 손상 거동을 음향 방출법(acoustic emission, AE)을 이용하여 연구하였다. 섬유 방향의 영향을 연구하기 위하여 다양한 섬유 방향을 가지는 SOP FML을 제작하였으며, UTM을 이용하여 압입 하중을 가하였다. 압입 시험 시 발생하는 AE신호는 150kH의 공진 주파수를 가지는 AE센서를 이용하여 측정하였으며, 여기에서 발생된 신호를 하중-변위 선도와 비교하였다. SOP FML의 손상 과정은 균열 개시, 균열 전파, 관통에 따라 3구간으로 나누어 겼다. 균열 개시전까지의 AE 신호의 특성으로 보아 미소 균열이 시편의 하부에서 발생하고 이 균열이 시편의 두께 방향으로 전파되어 섬유 분리를 발생시키는 것으로 생각된다. 발생된 균열은 섬유 방향을 따라 성장하였으며, 이 때 60~80dB의 AE신호들이 발생되었다. 관통이 발생할 때는 80~100dB의 고진폭의 AE신호가 나타나 섬유의 파괴가 발생함을 보였으며, 섬유의 방향이 증가할수록 섬유의 파괴가 많이 발생되었다 누적 AE count선도는 FML의 압입 특성을 잘 나타내어 FML의 특성 변호 예측에 유용하게 사용될 수 있을 것으로 생각된다.

• 대한기계학회논문집A
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• 제26권10호
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• pp.2122-2129
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• 2002

Creep damage using a reference stress(RS) was analyzed for type 316LN stainless steel. The generalized K-R equation was reconstructed into the RS equation using a critical stress value $\sigma$. The RS equation was derived from the critical stress in failure time $t_f$ instead of material damage parameter $\omega$, which indicates the critical condition of collapse or approach to gross instability of materials during creep. For obtaining the reference stress, a series of creep tests and tensile tests were conducted with at 55$0^{\circ}C$ and $600^{\circ}C$. The stress-time data obtained from creep tests were applied to the RS equations to characterize the creep damage of type 316LN stainless steel. The value of creep constant r with stress levels was about 18 at 55$0^{\circ}C$ and 21 at $600^{\circ}C$. This value was almost similar with r = 24 in the K-R equation, which was obtained by using damage parameter $\omega$. Relationship plots of creep failure strain and life fraction $(t_f /t_r)$ were also obtained with different λ values. The RS equation was therefore more convenient than the generalized K-R equation, because the measuring process to quantify the damage parameter $\omega$ such as voids or micro cracks in crept materials was omitted. The RS method can be easily used by designers and plant operator as a creep design tool.

• 한국기계가공학회지
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• 제2권2호
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• pp.5-13
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• 2003

In this study, experiments of high speed grinding had been earned out in a STD11 specimen for evaluating the grindability with designed CBN grinding wheels Ground surfaces were analyzed and evaluated by means of surface Integrities and wheel damages. The surface roughness and 3 dimensional profile had been used for analyzing the micro-surface integrity. The residual stress of the ground surface had been measured by the x-ray diffraction method. Also, the surface state of the ground specimens and the grinding wheels were evaluated by a metallurgical microscope and SEM system after high speed grinding in order to choose the suitable machining conditions.