• Journal of Korea Foundry Society
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• v.14 no.5
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• pp.464-470
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• 1994

The horizontal continuous casting method with the heated mold was applied to study the solidification structures of the pure Al and Al-0.5wt%Si and Al-1.0wt%Si alloy rods. The results could be summarized as follows: 1. The S/L interface structures of pure Al represented the hexagonal cells at the casting speed of 590 and 350mm/min, respectively. However, the hexagonal cells became irregular as the casting speed and(or) Si amount increased. 2. The striation increased as the Si amount and casting speed increased and was found to result from the occurrence of growth twin crystals by XRD analysis. 3. The striation did not affect the mechanical and electrical property of the drawn wire from the casted rod. This means the striation is not a serious defect which has to consider in the production of micro-sized fine wire in the drawing process.

• Journal of the Korean Society for Heat Treatment
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• v.36 no.4
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• pp.230-236
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• 2023

The current study deals with the effect of cooling rate and temperature for annealing on medium-carbon Cr-Mo alloy steel, especially for cold heading quality wire rod, to derive the optimum micro-structures for plastic deformation. This is to optimize the spheroidization heat treatment conditions for softening the material. Heat treatment was performed under seven different conditions at a temperature between A_c1 and A_c3, mostly within 720℃ to 760℃, and the main variables at this time were temperature, retention time and cooling rate. Microstructure and phase changes were observed for each test condition, and it was confirmed that they were greatly affected by the cooling rate. It was also confirmed that the cooling rate was changed in the range of 0.1℃/min to 5℃/min and affected by phase deformation and spheroidization fraction. The larger the spheroidization fraction, the lower the hardness, which is associated with the increasing connection of ferrite phases.

• Restorative Dentistry and Endodontics
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• v.40 no.1
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• pp.30-36
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• 2015

Objectives: This study was performed to determine whether the combined use of one-bottle self-etch adhesives and composite resins from same manufacturers have better bond strengths than combinations of adhesive and resins from different manufacturers. Materials and Methods: 25 experimental micro-shear bond test groups were made from combinations of five dentin adhesives and five composite resins with extracted human molars stored in saline for 24 hr. Testing was performed using the wire-loop method and a universal testing machine. Bond strength data was statistically analyzed using two way analysis of variance (ANOVA) and Tukey's post hoc test. Results: Two way ANOVA revealed significant differences for the factors of dentin adhesives and composite resins, and significant interaction effect (p < 0.001). All combinations with Xeno V (Dentsply De Trey) and Clearfil $S^3$ Bond (Kuraray Dental) adhesives showed no significant differences in micro-shear bond strength, but other adhesives showed significant differences depending on the composite resin (p < 0.05). Contrary to the other adhesives, Xeno V and BondForce (Tokuyama Dental) had higher bond strengths with the same manufacturer's composite resin than other manufacturer's composite resin. Conclusions: Not all combinations of adhesive and composite resin by same manufacturers failed to show significantly higher bond strengths than mixed manufacturer combinations.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.12C
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• pp.1692-1706
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• 2004

Recently, there are rapid development of information and communication and rapid growth of e-business users. Therefore we try to solve security problem on the internet environment which charges from wire internet to wireless internet or wire/wireless internet. Since the wireless mobile environment is limited, researches such as small size, end-to-end and privacy security are performed by many people. Wireless e-business adopts credit card WPP protocol and AIP protocol proposed by ASPeCT. WAP, one of the protocol used by WPP has weakness of leaking out information from WG which conned wire and wireless communication. certification chain based AIP protocol requires a lot of computation time and user IDs are known to others. We propose a Micro-Payment protocol based on credit card. Our protocol use the encryption techniques of the public key with ID to ensure the secret of transaction in the step of session key generation. IDs are generated using ECC based Weil Paring. We also use the certification with hidden electronic sign to transmit the payment result. The proposed protocol solves the privacy protection and Non-repudiation p개blem. We solve not only the safety and efficiency problem but also independent of specific wireless platform. The protocol requires the certification organization attent the certification process of payment. Therefore, other domain provide also receive an efficient and safe service.

• Journal of the Korean Society of Hazard Mitigation
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• v.8 no.5
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• pp.35-44
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• 2008

In this study, to establish a web-based bridge monitoring system with wireless sensor network environment, we constructed microminiaturized sensor based wireless communication techniques and micro processing, databases for data combination and administration, variable control programs and processors for transferring data by internet. Then those data are measured and analyzed by the constructed bridge monitoring system with wireless sensors. To evaluate the practicability of the bridge monitoring system with wireless sensor, we compared the values measured in the tests with wire sensor under same conditions. The results show that the trend of the data obtained from the monitoring systems with wire sensors and wireless sensors was very similar but the some lost data in the communication process with wireless sensor network environment. And through laboratory and field tests, the effectiveness and the applicability of the proposed methods were verified.

• The Journal of the Korea Contents Association
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• v.5 no.3
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• pp.9-17
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• 2005

Recently, there are rapid development of information and communication technology and rapid growing of e-business users. We propose a method for security problem on the internet environment which changes from wire internet to wireless internet or wire/ wireless internet. Wireless e-business adopts credit card WPP protocol and AIP protocol proposed by ASPeCT. WAP, one of the protocol used by WPP has weakness of leaking out information from WG which connected wire and wireless communication. Certification chain based AIP protocol requires a lot of computation time and user IDs are known to others. We propose a Micro-Payment protocol based on credit card. Our protocol use the encryption techniques of the public key with ID to ensure the secret of transaction in the step of session key generation. IDs are generated using ECC based Weil pairing. We also use the certification with hidden electronic sign to transmit the payment result. The proposed protocol also solves the privacy protection and Non-repudiation problem.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.08a
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• pp.307-316
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• 2004

This study examined the cause of the wrinkle defect which is frequently encountered in wire rod rolling of low carbon steel$(C0.08\~0.13wt.\%)$. Even a small defect on the surface of rolled bars can easily develop into fatal cracks during cold heading process of low carbon steel, and it is therefore necessary to minimize inherent defects on the surface of hot rolled bars. Hot rolling process of low carbon steel was analyzed to identify the cause of the wrinkle defect in conjunction with FE analysis. The integrated analysis revealed that the wrinkle defect initiated in the first stage of rolling, and it was at the billet edge where severe deformation and drastic temperature drop were present. To elucidate the micro-mechanical mechanism of the wrinkle defect, hot compression tests were carried out at various temperatures and strain rates using Gleeble-3800. The surface profile of the each other compressed specimens was compared, and rough surface lines were observed at relatively low temperatures. Those surface defects can develop into wrinkles during multi-pass rolling. To control the wrinkle defect in rolling, it is necessary to design an adequate caliber which can minimize the loss of ductility, and thereby prevent flow localization. To use the result of this study fur other steels, the quantitative measure of the wrinkle defect and flow localization parameter should be proposed.

• Current Photovoltaic Research
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• v.1 no.1
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• pp.63-68
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• 2013

We investigated the effects of Au eutectic reaction on Si thin film growth by hot wire chemical vapor deposition. Small SiC and Si nano-particles fabricated through a wet etching process were coated and biased at 50 V on micro-textured Si p-n junction solar cells. Au thin film of 10 nm and a Si thin film of 100 nm were then deposited by an electron beam evaporator and hot wire chemical vapor deposition, respectively. The Si and SiC nano-particles and the Au thin film were structurally embedded in Si thin films. However, the Au thin film grew and eventually protruded from the Si thin film in the form of Au silicide nano-balls. This is attributed to the low eutectic bonding temperature ($363^{\circ}C$) of Au with Si, and the process was performed with a substrate that was pre-heated at a temperature of $450^{\circ}C$ during HWCVD. The nano-balls and structures showed various formations depending on the deposited metals and Si surface. Furthermore, the samples of Au nano-balls showed low reflectance due to surface plasmon and quantum confinement effects in a spectra range of short wavelength spectra range.

• Korean Chemical Engineering Research
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• v.57 no.5
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• pp.730-734
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• 2019

Thermophoresis is a transport phenomenon of particles driven by a temperature gradient of a medium. In this paper, we discuss the thermophoresis of particles in microfluidic channels. In a non-fluidic, stagnant channel, the thermophoretic transport of micro-particles was found to be larger in proportion to the voltage applied to the platinum wire heat source installed in the channel. The variation of the temperature around the platinum wire depending on the voltage was estimated, by using the Callendar-van Dusen equation. The thermophoretic behavior of nano-particles in the same system was observed, which is similar to that of the microparticles. Finally, we fabricated a Y-shaped microfluidic channel with a platinum wire heat source installed in the channel, to realize the thermophoretic phenomenon of the particles in the suspension flowing through the channel. It is shown that the flow of the suspension can be controlled based on the thermophoretic principle.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.8
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• pp.17-27
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• 2000

This paper presents deposition and characterization of hydrogenated microcrystalline silicon (${\mu}c$ -Si:H) films on low cost glass substrate by Hot Wire CVD(HWCVD). The HWCVD ${\mu}c$ -Si:H films had deposition rates ranging from 2${\AA}$/sec to 35${\AA}$/sec with the variations of preparation conditions, which was 10 times higher than that of the films obtained from the conventional PECVD method. From the Raman spectroscopy, the prepared silicon films were found to be composed of the mixture of crystalline and amorphous phases. The crystalline volume fraction and average crystallite size, obtained from the Raman To mode peak near 520cm$^{-1}$, were 37-63% and 6-10 nm, respectively. The conductivity activation energy($E_a$) of the ${\mu}c$ -Si:H films, representing the difference of conduction band and Fermi level in an intrinsic semiconductors, increased from 0.22eV to 0.68eV with increasing pressure from 30mTorr to 300mTorr. The increase of $E_a$ with pressure indicates that the deposited films have properties close to intrinsic semiconductors, which is also proved with low dark conductivity of the ${\mu}c$ -Si:H deposited at 300mTorr. The tungsten concentration incorporated into films was about $6{\times}10^{16}atoms/cm^3$ in the samples prepared at wire temperature of 1800$^{\circ}C$.