• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.9
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• pp.721-728
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• 1991

In this paper, a magneto-optic modulator has been designed by using single crystal BSO and polycrystal ZnSe as Faraday cells. And practical core-type optical current sensors using pure iron and permalloy have been prepared and experimented. In order to obtain efficient magnetic field detection, LED(NEC OD08358, 0.87 $\mu$m) was used as optical source, PIN-PD(OD-8454)as optical receiver and multi-mode optical fiber (100/140$\mu$m) as transmission line. The characteristics matrix of the optical element was calculated by Stokes parameter, and optic modulation characteristics equations were derived by Muller matrix. Electromagnetic analysis program (FLUX 2D, micro VAX 3600) by finite element method was used to find the magnetic flux density around the core. The measuring error of the output voltage to input current has been masured below 5% in the range of 50A to 1000A. As the temperature was changed from -20$^{\circ}C$ to 60$^{\circ}C$, the maximum measurement error of the optical output has been found to be 0.5% at 60$^{\circ}C$. These experimental results show good temperature and linearity characteristics. The SNR of the overall system was 47dB in case of 600A (250.2 Oe) conductor current and the system has good noise immunity.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.21-26
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• 2002

Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.

• Nuclear Engineering and Technology
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• v.54 no.8
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• pp.2801-2808
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• 2022

The synergistic effect of ZrC nanoparticle pining and Re solution in W matrix on the thermal stability of tungsten was studied by investigating the evolution of the microstructure, hardness and tensile properties after annealing in a temperature range of 1000-1700 ℃. The results of metallography, electron backscatter diffraction pattern and Vickers micro-hardness indicate that the rolled W-1wt%Re-0.5 wt% ZrC alloy has a higher recrystallization temperature (1600 ℃-1700 ℃) than that of the rolled pure W (1200 ℃), W-0.5 wt%ZrC (1300 ℃), W-0.5 wt%HfC (1400-1500 ℃) and W-K-3wt%Re alloy fabricated by the same technology. The molecular dynamics simulation results indicated that solution Re atoms in W matrix can slow down the self-diffusion of W atoms and form dragging effect to delay the growth of W grain, moreover, the diffusion coefficient decrease with increasing Re content. In addition, the ZrC nanoparticles can pin the grain boundaries and dislocations effectively, preventing the recrystallization. Therefore, synergistic effect of solid solution Re element and dispersed ZrC nanoparticles significantly increase recrystallization temperature.

• Journal of the Korean Society for Precision Engineering
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• v.11 no.5
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• pp.180-188
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• 1994

Error assessment and evaluation for machine for machine tool slides have been considered as essential tools for improving accuracy. In this paper, a computer aided measurement technique is proposed using photo pin diodes of quadrant type and laser source. In thedeveloped system, three photo diodes are mounted on a sensor mounting table, and the sensored signal is processed by specially designed signal conditioner to give fine resolution with minimum noise. A micro computer inputs the processed signal, and the geometric errors of five degree of freedoms are successfully evaluated. Pitch, roll, yaw, vertical and horizontal straightness errors are thus assessed simultaneously for a machine tool slide. Calibration techniques such as optics calibration, photo diode calibration are proposed and implemented, giving precise calibration for the measurement system. The developed system has been applied to a practical machine tool slide, and has been found as one of efficient and precise technique for machine tool slide.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.12
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• pp.1130-1135
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• 2015

The bond pull test is the most widely used technique for the evaluation and control of wire bond quality. The wire being tested is pulled upward until the wire or bond to the die or substrate breaks. The inspector test strength of wire by manually and it takes around 3 minutes to perform the test. In this paper, we develop a 3D vision system to measure 3D position of wire. It gives 3D position data of wire to move a hook into wires. The 3D measurement method to use here is a confocal imaging system. The conventional confocal imaging system is a spot scanning method which has a high resolution and good illumination efficiency. However, a conventional confocal systems has a disadvantage to perform XY axis scanning in order to achieve 3D data in given FOV (Field of View) through spot scanning. We propose a method to improve a parallel mode confocal system using a micro-lens and pin-hole array to remove XY scan. 2D imaging system can detect 2D location of wire and it can reduce time to measure 3D position of wire. In the experimental results, the proposed system can measure 3D position of wire with reasonable accuracy.

• Tribology and Lubricants
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• v.36 no.4
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• pp.199-206
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• 2020

CoCr-based alloys have been developed as wear-resistant materials owing to their excellent mechanical properties and strong wear resistance. The purpose of this study is to experimentally assess the frictional and wear characteristics of CoCr-based alloys slid against two different counter materials subjected to various normal forces to determine the expansion applicability of CoCr-based alloys. CoCrMo and CoCr alloys were selected as the target materials and NiCr and NiCrB alloys as counter materials. Experimental tests were performed using a pin-on-reciprocating plate tribo-tester under dry lubrication. Before performing the tests, the surface of the specimens was observed through confocal microscopy and the hardness was measured using a micro-Vickers hardness tester. The wear volume of the plate was calculated at the end of the tests using confocal microscope data, and the wear rate was quantitatively obtained based on Archard's wear law. From the results, the wear rates of the CoCrMo specimens that slid against NiCr and NiCrB are 7.69 × 10^-6 ㎣/Nm and 5.26 × 10^-6 ㎣/Nm, respectively. The wear rates of the CoCr specimens that slid against NiCr and NiCrB were higher than those of the CoCrMo specimens by factors of approximately 4 and 8, respectively. The CoCrMo specimens further exhibited lower friction characteristics than the CoCr specimens. The findings of this study will be useful for expanded applications of CoCr-based alloys as wear-resistant materials for various mechanical parts.

• Tribology and Lubricants
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• v.28 no.3
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• pp.136-141
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• 2012

In this paper, we investigated the friction characteristics of $W100^{\circ}{\o}L25m$ ellipse type surface pattern, on bearing steel. These characteristics are researched by utilizing a pin-on-disk wear test machine, under various velocities and other conditions. The reduction of friction is a necessary requirement for the improved efficiency of industrial parts. As the speed increases, there is a decrease in the effect of the dimple of friction characteristic in low velocity, with substantially little change to density. Conversely, as the load increases, the test direction of ellipse type dimple pattern, resulting in a difference in the texture of these two components. At a dimple density of 7.5% the friction characteristic is easily demonstrated, with a consistent change in both speed and load.

• Asian Pacific Journal of Cancer Prevention
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• v.15 no.22
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• pp.9927-9931
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• 2014

The objectives of this study were to examine serum periplakin expression in patients with urothelial carcinoma of the urinary bladder and in normal controls, and to examine relationships with clinicopathological findings. Detection of serum periplakin was performed in 50 patients and 30 normal controls with anti-periplakin antibodies using the automatic dot blot system, and a micro-dot blot array with a 256 solid-pin system. Levels in patients with urothelial carcinoma of the urinary bladder were significantly lower than those in normal controls (0.31 and 5.68, respectively; p<0.0001). The area under the receiver-operator curve level for urothelial carcinoma of the urinary bladder was 0.845. The sensitivity and specificity, using a cut-off point of 4.045, were 83.7% and 73.3%, respectively. In addition, serum periplakin levels were significantly higher in patients with muscle-invasive cancer than in those with nonmuscle-invasive cancer (P = 0.03). In multivariate Cox proportional hazards regression analysis, none of the clinicopathological factors was associated with an increased risk for progression and cancer-specific survival. Examination of the serum periplakin level may play a role as a non-invasive diagnostic modality to aid urine cytology and cystoscopy.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.06a
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• pp.14-14
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• 2001

Nitride films such as TiN, CrN etc. deposited on glass by PVD processes have been developed for many industrial applications. These nitride films deposited on glass were widely used for not only decorative and optical coatings but also wear and corrosion resistance coatings employed as dies and molds made of glass for the example of lens forming molds. However, the major problem of nitride coatings on glass by PVD process is non-uniform film owing to pin-hole and micro crack. It is estimated that nonuniform coating is influenced by a different surface energy between metal nitrides and glass due to binding states. In this work, therefore, for the evaluation of nucleation and growth mechanism of nitride films on glass TiN and CrN film were synthesized on glass with various nitrogen partial pressure by unbalanced magnetron sputtering. Prior to deposition, for the examination of relationship between surface energy and film microstructure plasma pre-treatment process was carried out with various argon to hydrogen flow rate and substrate bias voltage, duty cycle and frequency by using pulsed DC power supply. Surface energy owing to the different plasma pre-treatment was calculated by the measurement of wetting angle and surface conditions of glass were investigated by X-ray Photoelectron Spectroscopy(XPS) and Atomic Force Microscope(AFM). The microstructure change of nitride films on glass with increase of film thickness were analyzed by X-Ray Diffraction(XRD) and Scanning Electron Microscopy(SEM).

• Computers and Concrete
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• v.19 no.5
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• pp.443-449
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• 2017

Taking high geothermal tunnels as background, the deformation of concrete for shotcrete use was studied by simulating hot-humid and hot-dry environments in a laboratory. The research is made up by two parts, one is the influence of two kinds of high geothermal environments on the deformation of shotcrete, and the other is the shrinkage inhibited effect of fiber materials (steel fibers, polypropylene fibers, and the mixture of both) on the concrete in hot-dry environments. The research results show that: (1) in hot and humid environments, wet expansion and thermal expansion happened on concrete, but the deformation is smooth throughout the whole curing age. (2) In hot and dry environments, the concrete suffers from shrinkage. The deformation obeys linear relationship with the natural logarithm of curing age in the first 28 days, and it becomes stable after the $28^{th}$ day. (3) The shrinkage of concrete in a hot and dry environment can be inhibited by adding fiber materials especially steel fibers, and it also obeys linear relationship with the natural logarithm of curing age before it becomes stable. However, compared with no-fiber condition, it takes 14 days, half of 28 days, to make the shrinkage become stable, and the shrinkage ratio of concrete at 180-day age decreases by 63.2% as well. (4) According to submicroscopic and microscopic analysis, there is great bond strength at the interface between steel fiber and concrete. The fiber meshes are formed in concrete by disorderly distributed fibers, which not only can effectively restrain the shrinkage, but also prevent the micro and macro cracks from extending.