• 접착 및 계면
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• 제7권4호
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• pp.28-31
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• 2006

Due to the miniaturization of MEMS and microelectronics the joining techniques also have to be adjusted. The dosing technology with viscous adhesives does not permit reproducible adhesive volumes, which are clearly under a nano-liter. A nano-liter means however a diameter of bonding area within the range of several 100 micrometers. Additional, viscous adhesives need a certain time, until they are cross linked or cured. The problem especially in the MEMS is the initial strength, since it gives the time, which is needed for joining an individual adhesive joint. The time up to the initial strength is with viscous, also with fast curing systems, within the range of seconds until minutes. Until the reach of the initial strength, the micro part must be fixed/held. Without sufficient adjustment/clamping it can come to a shift of the micro parts. Also existing micro adhesive bonding processes are not batch able, i.e. the individual adhesive joints of a micro system must be processed successively. In the context of the WCARP III 2006 now an innovative method is to be presented, how it is possible to solve the existing problems with micro bonding. i.e. a method is presented, which is batch able, possess a minimum joining geometry with some micrometers and is so fast that no problems with the initial strength arise. It is a method, which could revolutionize the sticking technology in the micro system engineering.

• 전자공학회논문지SC
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• 제45권6호
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• pp.16-25
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• 2008

미세 탐침이란 프로브 카드(Probe Card)를 구성하는 초미세탐침을 의미한다. 이러한 미세 탐침은 그 크기가 상당히 미세하기 때문에 외관 이상 유무를 사람의 눈으로 검사하기가 상당히 어렵다. 반면, 프로브카드를 구성하는 미세 탐침의 이상 유무는 상당히 중요한 요소라고 볼 수 있다. 이에 본 연구에서는 사람의 눈으로 검사하기 어려운 미세 탐침의 불량 상태를 자동화된 비전 시스템으로 검사할 수 있는 방법을 개발하였다. 즉 탐침의 구부러진 각도, Tip Length, 종단 직경을 고속으로 자동 검사할 수 있는 비전 기술을 개발한 것이다 제안한 방법에 의한 실험결과, 사람의 육안에 위한 검사보다 검사의 정확도와 속도가 향상되었으며, 또한 조명환경에 대해서도 강건성(robustness)이 향상되었음을 알 수 있었다.

• 센서학회지
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• 제15권3호
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• pp.153-157
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• 2006

This paper presents the method for three-dimensional micro structure with photoresist spray coating system. The system consists of a high temperature rotational chuck, ultrasonic spray nozzle module, angle control module and nozzle moving module. Spray coating system is effected by several parameters such as the solid contents, the dispensed volume, the scanning speed of the spray nozzle and the wafer of dimension. The photoresist (AZ 1512) has been coated on the three-dimensional micro structure by spray coating system and the characteristics have been evaluated.

• 전자공학회논문지A
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• 제32A권9호
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• pp.142-151
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• 1995

The trend of compact size, light weight, low power consumption in the portable telecommunication equipments demands large scale integration and low voltage operation of chips and the minimization of the number of the components in the telecommunication terminal. According to the trend, existing chip components are modulized and are integrated as a part into a bigger chip. This paper is about the development of the peripheral units of micro-controller for mobile telecommunication terminal. Peripherals consist of DMA controller, Interrupt controller, timer, watchdog timer, clock generator, and power management unit. They are designed to be integrated with EU(Execution Unit) and BIU(Bus Interface Unit) into a 16 bit micro-controller which will be used as a core of an ASIC for next generation digital mobile telecommunication terminal. At first, whole block of the micro-controller was described by VHDL behavioral model and simulated to verify its overall operation. Then, watchdog timer, clock generator and power management unit were directly synthesized by using VHDL synthesis tool. Rest of the pheriperal units were designed and simulated by using Compass Design Tool.

• 전력전자학회논문지
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• 제19권4호
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• pp.303-311
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• 2014

This paper shows the test result of 2MVA BESS(Battery Energy Storage System) with wind-turbine in micro-grid of the Gapado. To implement of micro-grid with BESS, characteristics of generator and customer load in grid are considered. Also, to operate of 2-parallel PCU(Power Conversion Unit) in BESS, the droop control is adopted with operating mode of grid independent. Performances of BESS with wind-turbine were verified by analysis of power quality such as voltage harmonics, ratio of voltage and frequency regulation, and by measurement of waveform such as output voltage and current.

• 마이크로전자및패키징학회지
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• 제26권3호
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• pp.7-13
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• 2019

In this paper, the principles, types and characteristics of the laser and laser soldering are introduced. Laser soldering methods for electronics, metals, semiconductors are also presented. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled beam. Demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro joint. Laser absorption ratio depends on materials, and each material has different absorption or reflectivity of the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance. In this paper, the performance of Nd:YAG laser soldering is compared to the hot blast reflow. Meanwhile, a diode laser gives different wavelength and smaller parts with high performance, but it has various reliability issues such as heat loss, high power, and cooling technology. These issues need to be improved in the future, and further studies for laser micro-joining and soldering are required.

• 한국전기전자재료학회논문지
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• 제34권1호
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• pp.8-15
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• 2021

Micro-LEDs can be applied to various parts of a product. However, it has disadvantages compared to general LEDs in large displays such as low efficiency, intensity, and contrast ratio, among others, owing to their short history of study. The simulations were carried out using ray-tracing software to investigate the change in light intensity and light distribution according to pattern shapes on the sapphire substrate of the flip-chip micro-LED (FC μ-LED) array. Three patterns-concave square patterns, convex square patterns, and Ag coated convex patterns-which existed on the opposite side of FC μ-LEDs (115 ㎛ × 115 ㎛) array, were applied. The intensity of FC μ-LEDs on the center of the receivers depends on the pattern depth with shape. The concave square patterns having FC μ-LEDs arrays show that decreasing intensity as the patterns depth. On the contrary, the convex square patterns having FC μ-LEDs arrays shows that increasing intensity as the patterns depth. In addition, the highest intensity shows that FC μ-LEDs having Ag-coated convex patterns on the opposite side of sapphire lead to a reduction in light crosstalk owing to the Ag film.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.15-20
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• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

• 정보처리학회논문지C
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• 제9C권1호
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• pp.97-106
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• 2002

3GPP2가 제안하는 방식에서는 Macro Mobility 지원을 위하여 MIP를 이용하며 PDSN은 FA의 기능을 수행한다. 이때 하나의 PDSN에서 다른 PDSN으로 MS가 이동할 경우 지원되는 이동성을 Macro Mobility라 하며, PDSN 관리 영역 내의 하나의 RN에서 다른 RN으로 이동 시에 지원되는 이동성을 Micro Mobility라 한다. 3GPP2가 제안하는 방식에서는 PDSN이 FA의 역할을 수행하므로 이동성 지원이 가능하지만, 이는 Macro Mobility를 지원하기 위한 메커니즘으로, Micro Mobility를 지원하기엔 빠르고 Seamless한 핸드오프에 취약하다. 본 논문은 Micro Mobility를 지원하기 위한 멀티캐스트 그룹 메커니즘 기반의 Seamless 핸드오프 알고리즘을 제안하고 있다. 제안된 알고리즘은 MS의 이동방향과 속도를 계산하여, 예상 이동경로에 인접한 RN들을 멀티캐스트 그룹으로 구성하고, 그룹 join 시점을 최대한 늦춤으로서 망의 효율성을 높인다. 또한, 기존의 멀티캐스트 연결 방법이 가지고 있는 버퍼 오버헤드에 대한 문제점을 해결하기 위해, RN은 예상 핸드오프 시간 이후의 데이터만을 버퍼링 한다. 제안된 알고리즘의 Deadlock Freeness 및 Liveness를 검증하기 위해 State Transition Diagram을 작성하고, 페트리네트 모델을 이용 도달성 트리를 작성하였다. 또한, 시뮬레이션을 통한 성능분석을 수행하였다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2004년도 ICCAS
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• pp.1945-1948
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• 2004

This paper describes the design and construction of a micro robotic system addressing such important aspects as versatility and low cost for rapid development and test of new control algorithm. The design and structure of micro robots are presented in detail. The supervision oriented concept is designed for controlling a group of micro robots. In this concept, the vision system recognizes the environment and the host computer decides the micro robot action based on the information from the vision system. In addition, the micro robots can be implemented cheaply and small in size because the structure of supervision oriented system is simplest. The experimental results and the performance of the proposed micro robotic system are discussed.