• Title/Summary/Keyword: micro bonding

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Preparation of Shape Stabilized PCM Using Porous Materials for Application to Buildings (건축적용을 위한 다공성 물질을 이용한 상안정 PCM 제조)

  • Jeong, Su-Gwang;Yu, Seulgi;Jang, Seulae;Park, Jin-Sung;Kim, Taehyun;Lee, Jeong-Hun;Kim, Sumin
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.25 no.8
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    • pp.432-437
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    • 2013
  • The increase of greenhouse gas emission and decrease of fossil fuel are being caused by the indiscreet consumption of energy by people. Recently, green policy has been globally implemented to reduce energy consumption. This paper studied the research to reduce the energy consumption in buildings, by using the heat storage properties of PCM. PCM has to prevent leakage from the liquid state. Therefore, we prepared form stable PCM, by using the vacuum impregnation method. Three kinds of organic PCMs were impregnated into the structure of porous material. The characteristics of the composites were determined by using SEM, DSC, FTIR and TGA. SEM morphology showed the micro structure of silica fume/PCM. Also, thermal properties were examined by DSC and TGA analyses; and the chemical bonding of the composite was determined by FTIR analysis.

Analysis of Bonding Characteristics of Ag-System Brazing Filler Metal (은계 필러메탈 브레이징 접합부의 특성 분석)

  • Soon-Gil Lee;Hwa-In Lee;Jin-Oh Son;Gwang-Il Ha;Bon-Heun Koo
    • Korean Journal of Materials Research
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    • v.33 no.5
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    • pp.214-221
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    • 2023
  • As a filler metal for lowering the melting point of Ag, many alloy metal candidates have emerged, such as cadmium, with zinc, manganese, nickel, and titanium as active metals. However, since cadmium is known to be harmful to the human body, Cd-free filler metals are now mainly used. Still, no study has been conducted comparing the characteristics of joints prepared with and without cadmium. In addition, studies have yet to be conducted comparing the typical characteristics of brazing filler metals with special structures, and the joint characteristics of brazing filler metals with available frames. In this study, the characteristics of junctions of silver-based intercalation metals were compared based on the type of filler metal additives, using a special structure, a filler metal sandwich structure, to protect the internal base metal. The general filler metal was compared using the structure, and the thickness of the filler metal according to the thickness was reached. A comparison of the characteristics of the junction was conducted to identify the characteristics of an intersection of silver-based brazing filler metal and the effect on joint strength. Each filler metal's collective tensile strength was measured, and the relationship between joint characteristics and tensile joint strength was explored. The junction was estimated through micro strength measurement, contact angle measurement with the base metal when the filler metal was melted, XRD image observation, composition analysis for each phase through SEM-EDS, and microstructure phase acquisition.

EFFECT OF CHLORHEXIDINE ON MICROTENSILE BOND STRENGTH OF DENTIN BONDING SYSTEMS (Chlorhexidine 처리가 상아질 접착제의 미세인장결합강도에 미치는 영향)

  • Oh, Eun-Hwa;Choi, Kyoung-Kyu;Kim, Jong-Ryul;Park, Sang-Jin
    • Restorative Dentistry and Endodontics
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    • v.33 no.2
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    • pp.148-161
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    • 2008
  • The purpose of this study was to evaluate the effect of chlorhexidine (CHX) on microtensile bond strength (${\mu}TBS$) of dentin bonding systems. Dentin collagenolytic and gelatinolytic activities can be suppressed by protease inhibitors, indicating that MMPs (Matrix metalloproteinases) inhibition could be beneficial in the preservation of hybrid layers. Chlorhexidine (CHX) is known as an inhibitor of MMPs activity in vitro. The experiment was proceeded as follows: At first, flat occlusal surfaces were prepared on mid-coronal dentin of extracted third molars. GI (Glass Ionomer) group was treated with dentin conditioner, and then, applied with 2 % CHX. Both SM (Scotchbond Multipurpose) and SB (Single Bond) group were applied with CHX after acid-etched with 37% phosphoric acid. TS (Clearfil Tri-S) group was applied with CHX, and then, with adhesives. Hybrid composite Z-250 and resin-modified glass ionomer Fuji-II LC was built up on experimental dentin surfaces. Half of them were subjected to 10,000 thermocycle, while the others were tested immediately. With the resulting data, statistically two-way ANOVA was performed to assess the ${\mu}TBS$ before and after thermo cycling and the effect of CHX. All statistical tests were carried out at the 95 % level of confidence. The failure mode of the testing samples was observed under a scanning electron microscopy (SEM). Within limited results, the results of this study were as follows; 1. In all experimental groups applied with 2 % chlorhexidine, the microtensile bond strength increased, and thermo cycling decreased the micro tensile bond strength (P > 0.05). 2. Compared to the thermocycling groups without chlorhexidine, those with both thermocycling and chlorhexidine showed higher microtensile bond strength, and there was significant difference especially in GI and TS groups. 3. SEM analysis of failure mode distribution revealed the adhesive failure at hybrid layer in most of the specimen. and the shift of the failure site from bottom to top of the hybrid layer with chlorhexidine groups. 2 % chlorhexidine application after acid-etching proved to preserve the durability of the hybrid layer and microtensile bond strength of dentin bonding systems.

Microtensile bond strength of resin inlay bonded to dentin treated with various temporary filling materials (임시 가봉재가 상아질과 레진 인레이의 미세인장 결합 강도에 미치는 영향)

  • Kim, Tae-Woo;Lee, Bin-Na;Choi, Young-Jung;Yang, So-Young;Chang, Hoon-Sang;Hwang, Yun-Chan;Hwang, In-Nam;Oh, Won-Mann
    • Restorative Dentistry and Endodontics
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    • v.36 no.5
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    • pp.419-424
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    • 2011
  • Objectives: This study was aimed to determine the effects of temporary sealing materials on microtensile bond strength between resin-coated dentin and resin inlay and to compare the bonding effectiveness of delayed dentin sealing and that of immediate dentin sealing. Materials and Methods: The teeth were divided into 4 groups: group 1, specimens were prepared using delayed dentin sealing after temporary sealing with zinc oxide eugenol (ZOE); group 2, specimens were prepared using immediate dentin sealing and ZOE sealing; group 3, specimens were prepared using immediate dentin sealing and Dycal (Dentsply) sealing; group 4, specimens were prepared using immediately sealed, and then temporarily sealed with a resin-based temporary sealing material. After removing the temporary sealing material, we applied resin adhesive and light-cured. Then the resin inlays were applied and bonded to the cavity with a resin-based cement. The microtensile bond strength of the sectioned specimens were measured with a micro-tensile tester (Bisco Inc.). Significance between the specimen groups were tested by means of one-way ANOVA and multiple Duncan's test. Results: Group 1 showed the lowest bond strength, and group 4 showed the highest bond strength (p < 0.01). When temporary sealing was performed with ZOE, immediate dentin sealing showed a higher bonding strength than delayed dentin sealing (p < 0.01). Conclusions: Based on these results, immediate dentin sealing is more recommended than delayed dentin sealing in bonding a resin inlay to dentin. Also, resin-based temporary sealing materials have shown the best result.

The micro-tensile bond strength of two-step self-etch adhesive to ground enamel with and without prior acid-etching (산부식 전처리에 따른 2단계 자가부식 접착제의 연마 법랑질에 대한 미세인장결합강도)

  • Kim, You-Lee;Kim, Jee-Hwan;Shim, June-Sung;Kim, Kwang-Mahn;Lee, Keun-Woo
    • The Journal of Korean Academy of Prosthodontics
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    • v.46 no.2
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    • pp.148-156
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    • 2008
  • Statement of problems: Self-etch adhesives exhibit some clinical benefits such as ease of manipulation and reduced technique-sensitivity. Nevertheless, some concern remains regarding the bonding effectiveness of self-etch adhesives to enamel, in particular when so-called 'mild' self-etch adhesives are employed. This study compared the microtensile bond strengths to ground enamel of the two-step self-etch adhesive Clearfil SE Bond (Kuraray) to the three-step etch-and- rinse adhesive Scotchbond Multi-Purpose (3M ESPE) and the one-step self-etch adhesive iBond (Heraeus Kulzer). Purpose: The purpose of this study was to determine the effect of a preceding phosphoric acid conditioning step on the bonding effectiveness of a two-step self-etch adhesive to ground enamel. Material and methods: The two-step self-etch adhesive Clearfil SE Bond non-etch group, Clearfil SE Bond etch group with prior 35% phosphoric acid etching, and the one-step self-etch adhesive iBond group were used as experimental groups. The three-step etch-and-rinse adhesive Scotchbond Multi-Purpose was used as a control group. The facial surfaces of bovine incisors were divided in four equal parts cruciformly, and randomly distributed into each group. The facial surface of each incisor was ground with 800-grit silicon carbide paper. Each adhesive group was applied according to the manufacturer's instructions to ground enamel, after which the surface was built up using Light-Core (Bisco). After storage in distilled water at $37^{\circ}C$ for 1 week, the restored teeth were sectioned into enamel beams approximately 0.8*0.8mm in cross section using a low speed precision diamond saw (TOPMET Metsaw-LS). After storage in distilled water at $37^{\circ}C$ for 1 month, 3 months, microtensile bond strength evaluations were performed using microspecimens. The microtensile bond strength (MPa) was derived by dividing the imposed force (N) at time of fracture by the bond area ($mm^2$). The mode of failure at the interface was determined with a microscope (Microscope-B nocular, Nikon). The data of microtensile bond strength were statistically analyzed using a one-way ANOVA, followed by Least Significant Difference Post Hoc Test at a significance level of 5%. Results: The mean microtensile bond strength after 1 month of storage showed no statistically significant difference between all adhesive groups (P>0.05). After 3 months of storage, adhesion to ground enamel of iBond was not significantly different from Clearfil SE Bond etch (P>>0.05), while Clearfil SE Bond non-etch and Scotchbond Multi-Purpose demonstrated significantly lower bond strengths (P<0.05), with no significant differences between the two adhesives. Conclusion: In this study the microtensile bond strength to ground enamel of two-step self-etch adhesive Clearfil SE Bond was not significantly different from three-step etch-and-rinse adhesive Scotchbond Multi-Purpose, and prior etching with 35% phosphoric acid significantly increased the bonding effectiveness of Clearfil SE Bond to enamel at 3 months.

The Effect of Aging Treatment on the High Temperature Fatigue Fracture Behavior of Friction Welded Domestic Heat Resisting Steels (SUH3-SUS 303) (마찰용접된 국산내열 강 (SUH3-SUS303 )의 시효열처리가 고온피로강도 및 파괴거동에 미치는 영향에 관한 연구)

  • Lee, Kyu-Yong;Oh, Sae-Kyoo
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.17 no.2
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    • pp.93-103
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    • 1981
  • It is well-known that nowadays heat resisting and anti-corrosive materials have been widely used as the components materials of gas turbines, nuclear power plants and engines etc. In the fields of machine production industry. And materials for engine components, like as the exhaust valve of internal combustion engine, have been required to operate under the high temperature range of $700^{\circ}C$-$800^{\circ}C$ and high pressured gas with repeated mechanical load for the high performance of engines. For these components, friction welding for bonding of dissimilar steels can be applied for in order to obtain process shortening, production cost reduction and excellent bonding quality. And age hardening recently has been noticed to the heat resisting materials for further strengthening of high temperature strength, especially high temperature fatigue strength. However, it is difficult to find out any report concerning the effects of age hardening for strengthening high temperature fatigue strength to the Friction welded heat resisting and anti-corrosive materials. In this study the experiment was carried out as the high temperature rotary bending fatigue testing under the condition of $700^{\circ}C$ high temperature to the friction welded domestic heat resisting steels, SUH3-SUS303, which were 10hr., 100hr. aging heat treated at $700^{\circ}C$ after solution treatment 1hr. at $1, 060^{\circ}C$ for the purpose of observing the effects of the high temperature fatigue strength and fatigue fracture behaviors as well as with various mechanical properties of welded joints. The results obtained are summarized as follows: 1) Through mechanical tests and micro-structural examinations, the determined optimum welding conditions, rotating speed 2420 rpm, heating pressure 8kg/mm super(2), upsetting pressure 22kg/mm super(2), the amount of total upset 7mm (heating time 3 sec and upsetting time 2 sec) were satisfied. 2) The solution treated material SUH 3, SUS 303, have the highest inclination gradient on S-N curve due to the high temperature fatigue testing for long time at $700^{\circ}C$. 3) The optimum aging time of friction welded SUH3-SUS 303, has been recognized near the 10hr. at $700^{\circ}C$ after the solution treatment of 1hr. at $1, 060^{\circ}C$. 4) The high temperature fatigue limits of aging treated materials were compared with those of raw material according to the extender of aging time, on 10hr. aging, fatigue limits were increased by SUH 3 75.4%, SUS 303 28.5%, friction welded joints SUH 3-SUS 303 44.2% and 100hr. aging the rates were 64.9%, 30.4% and 36.6% respectively. 5) The fatigue fractures occurred at the side of the base matal SUS303 of the friction welded joints SUH 3-SUS 303 and it is difficult to find out fractures at the friction welding interfaces. 6) The cracking mode of SUS 303, SUH 3-303 is intergranular in any case, but SUH 3 is fractured by transgranular cracking.

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CHANCE IN CONCENTRATION OF SALIVARY STREPTOCOCCUS MUTANS FOLLOWING THE APPLICATION OF VARNISH CONTAINING CHLORHEXIDINE IN ORTHODONTIC PATIENTS (교정 치료 환자에 있어 항균 varnish 처치 전후의 타액 내 Streptococcus mutans 균주의 변화에 관한 연구)

  • Chang, Young-Il;Kim, Tae-Woo;Chung, Chong-Pyoung;Nahm, Dong-Seok;Yang, Won-Sik;Suhr, Cheong-Hoon
    • The korean journal of orthodontics
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    • v.24 no.3 s.46
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    • pp.659-672
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    • 1994
  • Dental caries is one of the most prevalent dental diseases in Korea and its prevention is very important in orthodontic therapy. For the cleansing action of saliva itself and/or tooth-brushing is lowered in patient with fixed orthodontic appliance, oral hygiene of the patient becomes worse, which provides more favorable environment for micro-organisms. Chlorhexidine, one of the series of bisguanide, has been reported to be strong antimicrobial agent and very effective on Streptococcus mutans. The purpose of this study is to evaluate the possibility of chlorhexidine as a anticariogenic agent in fixed orthodontic therapy. We used the varnish containing chlorhexidine as a main ingredient for the chemical control of salivary S.mutans in patients with fixed appliance therapy We applied the varnish containing chlorhexidine on the labial and interproximal surface of the teeth before bonding and banding teeth of our patients(N=20) and compared to control group patients(N=20). Before the application of chlorhexidine varnish and four times periodically after the completion of fixed appliance set-up, we sampled saliva of both group patients and incuvate S.mutans for 24 hours. In the culture study of sampled saliva, counting the number of S.mutans colonies, we founded as follows : 1. In patients with fixed appliance therapy, the risk of dental caries increase when it compared to that of preorthodontic treatment ; The number of salivary S.mutans increase in Patient's oral cavity. 2. The experimental agent that contain chlorhexidine is effective to reduce the number of salivary S.mutans. 3. For the effect of this agent is not ever-lasting, periodical application is needed, and additional study for economical interval and number of application is needed.

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Channel Structure and Header Design of Printed Circuit Heat Exchanger by Applying Internal Fluid Pressure (유체 내압을 고려한 인쇄기판형 열교환기의 채널구조 및 헤더 설계)

  • Kim, Jungchul;Shin, Jeong Heon;Kim, Dong Ho;Choi, Jun Seok;Yoon, Seok Ho
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.41 no.11
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    • pp.767-773
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    • 2017
  • Printed Circuit Heat Exchanger (PCHE) has an advantage for exchanging thermal energy between high-pressure and high-temperature fluids because its core is made by diffusion bonding method of accumulated metal thin-plates which are engraved of flow channel. Moreover, because it is possible that the flow channel can be micro-size hydraulic diameter, the heat transfer area per unit volume can be made larger than traditional heat exchanger. Therefore, PCHE can have higher efficiency of heat transfer. The smaller channel size can make the larger heat transfer area per unit volume. But if high pressure fluid flows inside the channel, the channel wall can be deformed, the structure and shape of flow channel and header have to be designed appropriately. In this study, the design methodology of PCHE channel in high pressure environment based on pressure vessel codes was investigated. And this methodology was validated by computational analysis.

EFFECT OF INTERMEDIATE RESIN HYDROPHILICITY ON BOND STRENGTH OF SINGLE STEP ADHESIVE (중간레진의 친수성이 상아질 접착에 미치는 영향)

  • Kim, Yong-Sung;Park, Sang-Hyuk;Choi, Gi-Woon;Choi, Kyoung-Kyu
    • Restorative Dentistry and Endodontics
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    • v.32 no.5
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    • pp.445-458
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    • 2007
  • The purpose of this study was to evaluate the bond strength of a new Single step system with different curing mode composites, and to evaluate the effect of the intermediate resins which have different hydrophilicity on bonding ability by means of the micro shear bond testing and TEM examination for the adhesive interface. The adhesive used in this study was an experimental single step system (Bisco Inc., Schaumburg IL). Experimental groups were produced by using six kinds of intermediate resin having different hydrophilicity that was hydrophilic, hydrophobic and most hydrophobic resin and as filled or not after applying adhesive. Each experimental group was further divided into two subgroups whether the adhesive was light cured or not. Dual cured composite (Bis Core, Bisco Ltd., Schaumburg, IL) was placed on the adhesive layer as light cure or self cure mode. The results or bond strength were statistically analyzed using one way ANOVA and multiple comparisons are made using Tukey's test at ${\alpha}\;<\;0.05$ level. The results of this study were as follows ; 1. The application of intermediate resin did not increase the bond strength for light cured composite. 2. The bond strength of an experimental adhesive with self cured composite was significantly increased by the application of intermediate resin layer. 3. The bond strength of adhesive was irrespective of the cure or not of itself before intermediate resin layer applied. 4. As applied hydrophilic resin layer was, the initial bond strength was higher than both hydrophobic and most hydrophobic one used but there was no significance. Using a single step adhesive with dual/self cured composite, the incompatibility between both of them should be solved by the application of intermediate hydrophobic resin to reduce the adhesive permeability. However, Single step adhesive can be used in the light cured composite restoration without any decrease of the initial bond strength.

Effects of PCB Surface Finishes on Mechanical Reliability of Sn-1.2Ag-0.7Cu-0.4In Pb-free Solder Joint (PCB 표면처리에 따른 Sn-1.2Ag-0.7Cu-0.4In 무연솔더 접합부의 기계적 신뢰성에 관한 연구)

  • Kim, Sung-Hyuk;Kim, Jae-Myeong;Yoo, Sehoon;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.4
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    • pp.57-64
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    • 2012
  • Ball shear test was performed by test variables such as loading speed and annealing time in order to investigate the effect of surface finishes on the bonding strength of Sn-1.2Ag-0.7Cu-0.4In Pb-free solder. The shear strength increased and the ductility decreased with increasing shear speed. With increasing shear speed, the electroless nickel immersion gold (ENIG) finish showed dominant brittle fracture mode, while organic solderability preservative (OSP) finish showed pad open fracture mode. The shear strength and toughness for both surface finishes decreased with increasing annealing time under the high-speed shear test of 500 mm/s. Typically, the thickness of intermetallic compound increased with increasing annealing time, which means that exposure of brittle fracture became much easier. With increasing annealing time, the both ENIG and OSP finishes exhibited the pad open fracture mode. Overall, ENIG finish showed higher shear strength rather than OSP finish due to its superior barrier stability.