• Journal of Korea Foundry Society
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• v.28 no.5
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• pp.226-230
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• 2008

본 논문에서는 공정조성 부근의 Al-Si 합금의 미세구조에 미치는 전자기교반(EMS)의 영향에 대하여 연구하였다. 초정 a 상의 형상에 미치는 전자기교반의 세기의 영향을 조사하기 위하여 각각 교반장치에 60, 80,및 120V의 전압을 가하여 미세조직을 관찰하였다. 60V 이하의 전압이 인가되었을 때 전자기교반의 효과가 나타나지 않은 반면에, 80V 이상의 전압으로 5초 이상 인가되었을 때 구상화된 초정 a 상을 얻을 수 있었다. 인가된 전압이 120V일 때 초정 a 상은 보다 균일한 분포를 가지며 구상화 되었다. 전자기교반의 세기와 함께 교반시간의 영향을 확인하기 위하여 교반시간을 증가시키면서 미세조직을 관찰하였다. 또한 초정 a 상의 형상에 미치는 주조변수의 영향에 대해서도 실험하였다.

• Korean Journal of Metals and Materials
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• v.48 no.6
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• pp.543-550
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• 2010

This paper investigated the synthesis conditions of nano-sized $TiO_2$ powder in a hydrothermal process at a temperature range of $100{\sim}180^{\circ}C$ considering the precipitation agent, precipitation pH, reaction temperature and time. Titanium hydroxide formed by $NH_4OH$ exhibited a lower crystallization temperature than that by NaOH and formed less aggregated $TiO_2$ particles. As the precipitation pH increased above 8, the shape of the particles changed from spherical to needle form, which appeared to be caused by dissolution and re-precipitation of the titanium hydroxide in an alkali environment.

• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.860-867
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• 2011

This study was performed to investigate the effects of the driving force for reduction and the surfactant (polyacrylic acid) on the size of Ag particles. As the driving force for reduction increases, the size of particles decreases due to a decrease of initial nuclei-size. Also, an increase of pH increases the amount of ionized surfactant, which leads to a decrease of particle size due to the prevention of particle growth. Both the driving force and the surfactant may affect the particle size, but the surfactant appeared to be a more dominant factor than reduction potential in terms of controlling the particle size. An increase of surfactant in the range of pH=3-4 decreases the size of Ag particles, although the reduction potential also decreases.

• Transactions of the Korean hydrogen and new energy society
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• v.8 no.4
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• pp.181-185
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• 1997

The electrochemical properties of the $AB_2$-type (Zr-Ti-V-Ni-Cr-Co-Mn) metal hydride electrodes prepared by ball milling with $AB_5-type\{(LM)Ni_{3.6}Al_{0.4}Co_{0.7}Mn_{0.3}\}$(LM : Lanthanum-rich mischmetal) alloy powder as a surface activator were investigated. By ball milling with $AB_5$ type alloy powder, the activation of $AB_2$ type metal hydride electrode was accelerated resulting in an increase of discharge capacity from 35% to 85% of the maximum capacity at the first cycle. As the amount of surface activator increased the activation rate increased, whereas the discharge capacity increased with 10wt% and decreased with 20wt% addition of the surface activator. When the amount of the surface activator was kept constant as 10wt%, the discharge capacity and the activation rate increased with ball milling time up to 20 hours. However beyond 20 hours of ball milling time, they decreased drastically due to the nano-crystallization or amorphorzation of the alloy powder.

• Progress in Superconductivity
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• v.6 no.2
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• pp.133-137
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• 2005

We fabricated the Au/Ni template for YBCO coated conductors and evaluated texture formation and the microstructural evolution. The cube textured Ni substrate was fabricated by rolling and recrystallization annealing, and subsequently Au layer formed on the substrate by electroless-plating method. The texture was evaluated by pole-figure with x-ray goniometer with orientation distribution function (ODF) analysis. The surface roughness and grain boundary morphology of template were characterized by atomic force microscopy (AFM) We observed that Au layer deposited epitaxially on Ni substrate and formed a strong cube texture when plating time was optimized. The full-width at half-maximum (FWHM) was $8.4^{\circ}$ for out-of-plane and $9.98^{\circ}$ for in-plane texture for plating time of 30 min. Microstructural observation showed that the Au layer was homogeneous and dense without formation of crack/microcrack. In addition, we observed that root-mean-square (RMS) and depth of grain boundary were 14.6 nm and 160 $\AA$ for the Au layer, respectively, while those were 27.0 nm and 800 $\AA$ for the Ni substrate, indicating that the electoless-plated Au layer had relatively smooth surface and effectively mollified grain groove.

• Journal of the Korean Society for Heat Treatment
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• v.12 no.2
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• pp.145-156
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• 1999

The distribution of the second phase, the change of transformation temperature and mechanical properties with thermomechanical treatment conditions were investigated by metallography, calorimetry, EDS, tensile test and fractography in a Cu-Al-Ni-Ti-Mn alloy. The cast structure revealed Ti-rich precipitates($X_L$ phase) between dendrite arms, which have been identified as $(Cu,Ni)_2TiAl$ intermetallic compounds. By homogenizing above $900^{\circ}C$, the $X_L$ phase was melted in the matrix, while the Xs phase was precipitated in matrix and the volume fraction of it was increased. When hot-rolled specimen was betatized below $750^{\circ}C$, recrystallization could not be observed. However, the specimen betatized above $800^{\circ}C$ was recrystallized and the grain size was about $50{\mu}m$, while Xs phase was precipitated in matrix. With raising betatizing temperature, $M_s$ and $A_s$ temperatures were fallen and transformation hysteresis became larger. The strain of the specimen betatized at $800^{\circ}C$ was 8.2% as maximum value. The maximum shape recovery rate could be obtained in the specimen betatized at $800^{\circ}C$ but it was decreased due to the presence of Xs phase with increasing betatizing temperature.

• Korean Journal of Materials Research
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• v.15 no.4
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• pp.281-284
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• 2005

Room and high temperature deformation behaviors of Cu-Zr-Ti-Pd bulk metallic glasses produced by copper mold casting were investigated. The addition of Pd was shown to enhance the glass forming ability and thermal stability of Cu-Zr-Ti base bulk metallic glass. The compressive strength of $Cu_{55}Zr_{30}Ti_{10}Pd_5$ bulk metallic glass was 2230 MPa with 1.8 plastic strain. The stress overshoot and yield drop phenomenon were observed below $487^{\circ}C$ and a drastic decrease in the flow stress was observed at $487^{\circ}C$. The stress overshoot is thought to be associated with stress-induced structural relaxation.

• Transactions of the Korean hydrogen and new energy society
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• v.10 no.1
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• pp.49-57
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• 1999

In order to study the effect of high energy ball milling on the $Mg_2Ni+Ni$, $Mg_2Ni+0.5Ni+0.5Al$ powders, we have investigated on the discharge properties, microstructures. The powder size of samples decreased as ball milling time. From the XRD results, the crystal structure of $Mg_2Ni+Ni$ mixed powders were changed to amorphous or nano-structure after 60hr ball milling. The discharge capacities of both $Mg_2Ni+Ni$ and $Mg_2Ni+0.5Ni+0.5Al$ powders increased, with increasing ballmilling time, the maximum capacity(342mAh/g) was shown for the 60 hrs ballmilled $Mg_2Ni+Ni$ sample. The capacity decreased drastically after a few charge-discharge cycles.

• Journal of Power System Engineering
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• v.20 no.1
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• pp.36-41
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• 2016

Effects of austenite on the pitting corrosion in 202 stainless steel with two phase of austenite and martensite were investigated through the electrochemical polarization test. Two phases structures of martensite and austenite were obtained by reversed annealing treatment at the range of $500^{\circ}C-700^{\circ}C$ for 10min. in 70% cold-rolled 202 stainless steel. Volume fraction of reversed austenite has increased rapidly with an increase of annealing temperature. Pitting corrosion has arisen mainly on martensite phase in 202 stainless steel with two phases of austenite and martensite. Pitting current density has decreased with an increase of volume fraction of austenite. Consequently, pitting corrosion at martensite has occurred largely with an increase of volume fraction of austenite. Pitting corrosion was affected by volume fraction of austenite.

• Progress in Superconductivity
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• v.4 no.2
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• pp.172-175
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• 2003

Critical current ratio and n-value of Bi(2223)/Ag superconducting joint tape were measured as a function of uniaxial pressure. In the superconducting joint method, MM and MSM joint were used ; MM joint is direct connection of two -multi filamentary tapes, and MSM is connection of them by using a single -filamentary tape. It was observed that the critical current ratio(CCR) for jointed tapes was not dependent on the uniaxial pressure but joining methods. The n-value of jointed tapes has similar trends with that of the CCR. Especially, double MSM joint showed the highest electrical properties as 63.4-76.0%(CCR) and 3.5-5.1 (n-value). It is considered that the improvements are due to the better inter connections of multifilaments by two single filamentary tapes on both sides.