• Title/Summary/Keyword: metal-plating solution

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Coagulation of the Metal-Plating Wastewater using Coal Fly Ash (비산회를 이용한 도금폐수의 응집처리)

  • 연익준;김광렬
    • Journal of environmental and Sanitary engineering
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    • v.17 no.3
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    • pp.37-45
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    • 2002
  • The Purpose of this study is to reduce environmental problems caused by landfill of bituminous coal fly ash emitted from the power plant and to reuse it. First of all, we experimented that Al and Si elements were extracted from fly ash and investigated that extracted Al and Si elements night use a coagulant. The extraction was carried out under various conditions ; concentration of the extraction solution, calcination temperature and calcination time. As the results, it was found that the optimum conditions of the extraction of Al and Si elements from fly ash were as follows, concentration of NaOH was 5N for both of them, calcination temperature was $700^{\circ}C$ and $600^{\circ}C$ and calcination time was 1hr and 1.5hr, respectively The extracted solution was used as a coagulant to treat the diluted metal-plating solutions which contained Pb and Cu, respectively. As the result of treatment on the diluted Pb-plating solution with 315NTU, the removal efficiency of turbidity was more than 90%, and the removal efficiency of Pb was about 80%. As for treatment of the non-turbid diluted Cu-plating solution, the removal efficiency of Cu was about 98%.

Study on Heavy Metal Desorption and Recovery of the Carbon Foam used in Industrial Plating Wastewater Treatment as Adsorbent (산업도금폐수 처리에 사용된 탄소폼 흡착소재의 중금속 탈착 및 회수에 관한 연구)

  • Lee, Da-Young;Lee, Chang-Gu;Kim, Dae-Woon;Park, Sang-Hyen;Kweon, Ji-Hyang;Lee, Sang-Hyup
    • Journal of Korean Society of Environmental Engineers
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    • v.38 no.11
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    • pp.627-634
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    • 2016
  • We investigated the characteristics of heavy metal desorption and recovery from carbon foam after plating wastewater treatment. The heavy metal desorption depends on solution chemistry because desorption occurred in HCl and $H_2SO_4 $ solution but did not occur in distilled water. Heavy metal desorption efficiency was increased using ultrasonication with desorption solution. The higher ultrasonic power and the longer reaction time improve efficiency. The copper plating rinse solution was treated reliably by carbon foam adsorbent during 200 bed volume. The adsorbed copper was dissolved using desorption solution and recovered by DC power supply. After copper recovery, the reuse efficiency of desorption solution was 84.2%.

Electroless Ni-P layer Characteristics in accordance with the plating process conditions (무전해 Ni-P 도금의 공정조건에 따른 도금피막 특성변화)

  • Lee Hong-Kee;Jeon Jun-Mi;Park Hae-Duck
    • Journal of the Korean institute of surface engineering
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    • v.36 no.3
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    • pp.263-271
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    • 2003
  • Optimal conditions of electroless nickel plating in acid baths has been studied for industrial applications of a developed EN solution. The phosphorus content in the deposition ranges from 8 to $12\;wt.\%$. The investigated EN plating parameters are ion concentrations of nickel and hypophosphite, concentration of reducing and complexing agent, temperature, and pH. The average plating rate of Ni-P deposition was ca. $14{\mu}m/h$. The EN solution used shows a deposition rate of $10{\mu}m/h$ up to seven metal turnovers.

The Stability of Plating Solution and the Current Density Characteristics of the Sn-Ag Plating for the Wafer Bumping

  • Kim, Dong-Hyun;Lee, Seong-Jun
    • Journal of the Korean institute of surface engineering
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    • v.50 no.3
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    • pp.155-163
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    • 2017
  • In this study, the effects of the concentration of metal ions and the applied current density in the Sn-Ag plating solutions were examined in regards to the resulting composition and morphology of the solder bumps' surface. Furthermore the effect of any impurities present in the methanesulfonic acid used as a base acid in the Sn-Ag solder plating solution on the stability of plating solution as well as the characteristics of the Sn-Ag alloys films was also explored. As expected, the uniform bump was obtained by means of removing impurities in the plating solution. Consequently the resultant solder bump was obtained in an optimal current density of the range of $1A/dm^2$ to $15A/dm^2$, which has acceptable bump shape and surface roughness with 12inch wafer trial results.

A Reliability Test for ph-free SnCu Plating Solution and It's Deposit (Sn-Cu 무연 도금용액 및 피막의 신뢰성평가)

  • Lee Hong-Kee;Hur Jin-Young
    • Journal of the Korean institute of surface engineering
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    • v.38 no.6
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    • pp.216-226
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    • 2005
  • Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. All products can divide at solder part and finishing part These can tested each and synthetically divide. This research is reliability evaluation for three kind of ph-free SnCu solder plating solution and it's deposit. First, executed analysis about Pure Sn, SnCu solutions and plating surface by way similar to other plating solution analysis. Next, executed reliability about test method and equipment for reliable analyzer system construction. Next, data comparison and estimation, main estimation test method and item's choice. In this paper the systematic surface analysis and reliability for plating solutions and it's deposit in metal surface finishing processes could be shown.

Application of the electroless plating method to the fabrication of metallic bus electrodes of PDP

  • Oh, Young-Joo;Jeung, Won-Young
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.829-831
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    • 2003
  • In the present study, the electroless plating method was applied instead of the sputtering as a formation method of metallic bus electrodes. No additional blackening step is needed in this method since this process provides a metallic seed layer with black color by a single step. The parameters which affects color and morphology of the metallic seed layer in the electroless plating solution were investigated

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Recovery of High Purity Tin from Waste Solution of the Tin Plating by Ion-exchange and Cyclone-electrowinning (주석도금폐액으로부터 이온교환 및 사이클론 전해채취를 이용한 고순도 주석의 회수)

  • Kang, Yong-Ho;Shin, Gi-Wung;Ahn, Jae-Woo
    • Resources Recycling
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    • v.25 no.4
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    • pp.42-48
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    • 2016
  • A research for the recovery of the metal with high purity from the waste tin plating solution was carried out. First, tin plating waste solution was tested to remove the organic substances and metallic impurities such as Fe, Zn, Na etc. using ion exchange resin having iminodiacetic functional groups (Lewatit TP 207). Second, the tin solution was purified to obtain the high purity tin solution using ion exchange resin having ethylhexyl-phosphate functional groups (Lewatit VPOC 1026). Finally, 99.98% of the high purity of tin metal can be recovered from the purified solution by cyclone type electrowinning method.

Preparation of Conductive Silicone Rubber Sheets by Electroless Nickel Plating (무전해 니켈도금에 의한 도전성 실리콘고무 시트의 제조)

  • Lee, Byeong Woo;Lee, Jin Hee
    • Journal of the Korean institute of surface engineering
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    • v.47 no.5
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    • pp.269-274
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    • 2014
  • Electroless plating process as a solution deposition method is a viable means of preparing conductive metal films on non-conducting substrates through chemical reactions. In the present study, the preparation and properties of electroless Ni-plating on flexible silicone rubber are described. The process has been performed using a conventional Ni(P) chemical bath. Additives and complexing agents such as ammonium chloride and glycine were added and the reaction pH was controlled by NaOH aqueous solution. Ni deposition rate and crystallinity have been found to vary with pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity, enhanced adhesion and optimum electric conductivity were formed uniformly on silicone rubber substrates under pH 7 at $70^{\circ}C$. The conductive Ni-plated silicone rubber showed a high electromagnetic interference shielding effect in the 400 MHz-1 GHz range.

Electroless Nickel Plating (무전해 니켈도금에 대하여(I))

  • 지태촌;여운관
    • Journal of the Korean institute of surface engineering
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    • v.15 no.1
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    • pp.1-10
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    • 1982
  • Electroless plating is the continious formation of metallic coatings from metal ions by che-mical reduction without the use of electrical current. This is, however, more expansive than the conventional electroplating but is often used because of certain adventage. Here, general description of past research on electroless nickel plating, especially about the merits of each research was given. Part(Ⅰ) is for the conposition of solution, pretreatment and facilities of electroless nickel plating.

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Design of Fast Acting Fuse Characteristics Using a Precision Multi-layer Thin Film Plating (정밀 다층 박막 도금을 이용한 빠른 동작 퓨즈 특성 설계)

  • Kim, Eun-Min;Kang, Chang-Yong
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.65 no.3
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    • pp.445-451
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    • 2016
  • General fuse elements of solution for fast acting operation characteristics made using silver or silver alloy, those are not able to dominate cost competition to the advanced global leaders that have not only high technology but competitive price. In this study, the method that compose the fuse elements manufactured solution of fast acting operation characteristics by using precision multi-layer thin film plating and helical cutting process from low-priced copper metal. Furthermore, in order to move rated current line of fuse due to the heat loses, the manufacture construction method of fixed resistor is introduced, and then Ni-P plating layer and Sn plating layer are introduced multiply for controling fine opening time characteristics. So this study can establish the high productive and low-priced production method.