• 환경위생공학
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• 제17권3호
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• pp.37-45
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• 2002

The Purpose of this study is to reduce environmental problems caused by landfill of bituminous coal fly ash emitted from the power plant and to reuse it. First of all, we experimented that Al and Si elements were extracted from fly ash and investigated that extracted Al and Si elements night use a coagulant. The extraction was carried out under various conditions ; concentration of the extraction solution, calcination temperature and calcination time. As the results, it was found that the optimum conditions of the extraction of Al and Si elements from fly ash were as follows, concentration of NaOH was 5N for both of them, calcination temperature was $700^{\circ}C$ and $600^{\circ}C$ and calcination time was 1hr and 1.5hr, respectively The extracted solution was used as a coagulant to treat the diluted metal-plating solutions which contained Pb and Cu, respectively. As the result of treatment on the diluted Pb-plating solution with 315NTU, the removal efficiency of turbidity was more than 90%, and the removal efficiency of Pb was about 80%. As for treatment of the non-turbid diluted Cu-plating solution, the removal efficiency of Cu was about 98%.

• 대한환경공학회지
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• 제38권11호
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• pp.627-634
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• 2016

본 연구에서는 탄소폼 흡착소재를 이용하여 산업도금폐수로부터 중금속을 흡착 제거한 후 탈착용액을 이용하여 제거된 중금속을 용출하고 회수하는 과정의 특성을 평가해 보고자 하였다. 용액의 조성에 따른 복합 중금속의 탈착 특성을 살펴본 결과 증류수 조건에서는 용출이 관측되지 않았으며, 탈착용액으로 HCl과 $H_2SO_4 $를 이용한 경우 높은 중금속 농도를 나타내었다. 탈착 용액을 이용함과 더불어 물리적 기술인 초음파 처리를 이용한 경우 중금속의 용출이 증진되는 것을 확인하였으며, 초음파 장치의 출력이 높고 반응 시간이 길수록 효율도 증가하는 것으로 나타났다. 탄소폼 흡착소재를 구리도금 세척수 처리에 적용시켜본 결과 200 반응기부피(Bed volume) 동안 안정적인 제거 성능을 나타내었으며, 흡착된 구리는 탈착용액을 이용하여 용출시킨 후 직류 전원 장치를 이용하여 회수할 수 있었다. 또한 구리가 회수된 탈착용액은 재이용 효율은 84.2%로 나타났다.

• 한국표면공학회지
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• 제36권3호
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• pp.263-271
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• 2003

Optimal conditions of electroless nickel plating in acid baths has been studied for industrial applications of a developed EN solution. The phosphorus content in the deposition ranges from 8 to $12\;wt.\%$. The investigated EN plating parameters are ion concentrations of nickel and hypophosphite, concentration of reducing and complexing agent, temperature, and pH. The average plating rate of Ni-P deposition was ca. $14{\mu}m/h$. The EN solution used shows a deposition rate of $10{\mu}m/h$ up to seven metal turnovers.

• 한국표면공학회지
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• 제50권3호
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• pp.155-163
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• 2017

In this study, the effects of the concentration of metal ions and the applied current density in the Sn-Ag plating solutions were examined in regards to the resulting composition and morphology of the solder bumps' surface. Furthermore the effect of any impurities present in the methanesulfonic acid used as a base acid in the Sn-Ag solder plating solution on the stability of plating solution as well as the characteristics of the Sn-Ag alloys films was also explored. As expected, the uniform bump was obtained by means of removing impurities in the plating solution. Consequently the resultant solder bump was obtained in an optimal current density of the range of $1A/dm^2$ to $15A/dm^2$, which has acceptable bump shape and surface roughness with 12inch wafer trial results.

• 한국표면공학회지
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• 제38권6호
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• pp.216-226
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• 2005

Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. All products can divide at solder part and finishing part These can tested each and synthetically divide. This research is reliability evaluation for three kind of ph-free SnCu solder plating solution and it's deposit. First, executed analysis about Pure Sn, SnCu solutions and plating surface by way similar to other plating solution analysis. Next, executed reliability about test method and equipment for reliable analyzer system construction. Next, data comparison and estimation, main estimation test method and item's choice. In this paper the systematic surface analysis and reliability for plating solutions and it's deposit in metal surface finishing processes could be shown.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.829-831
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• 2003

In the present study, the electroless plating method was applied instead of the sputtering as a formation method of metallic bus electrodes. No additional blackening step is needed in this method since this process provides a metallic seed layer with black color by a single step. The parameters which affects color and morphology of the metallic seed layer in the electroless plating solution were investigated

• 자원리싸이클링
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• 제25권4호
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• pp.42-48
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• 2016

주석도금폐액으로부터 고순도 주석 금속을 회수하는 연구를 실시하였다. 먼저 주석도금폐액을 Iminodiacetic 관능기를 가진 이온교환수지(Lewatit TP 207)를 사용하여 1차적으로 유기물 및 Fe, Zn, Na 등의 불순물을 제거하였고, 2차적으로 Ethylhexyl-phosphate의 관능기를 가진 이온교환수지(Lewatit VPOC 1026)를 사용하여 잔류하고 있는 불순물들을 모두 제거하여 고순도의 주석용액으로 회수하였다. 회수된 주석용액으로부터 고순도 금속주석으로 회수하기 위하여 사이클론식 전해방법을 사용하였으며, 전해채취 결과 약 99.98% 순도의 주석을 회수할 수 있었다.

• 한국표면공학회지
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• 제47권5호
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• pp.269-274
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• 2014

Electroless plating process as a solution deposition method is a viable means of preparing conductive metal films on non-conducting substrates through chemical reactions. In the present study, the preparation and properties of electroless Ni-plating on flexible silicone rubber are described. The process has been performed using a conventional Ni(P) chemical bath. Additives and complexing agents such as ammonium chloride and glycine were added and the reaction pH was controlled by NaOH aqueous solution. Ni deposition rate and crystallinity have been found to vary with pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity, enhanced adhesion and optimum electric conductivity were formed uniformly on silicone rubber substrates under pH 7 at $70^{\circ}C$. The conductive Ni-plated silicone rubber showed a high electromagnetic interference shielding effect in the 400 MHz-1 GHz range.

• 한국표면공학회지
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• 제15권1호
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• pp.1-10
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• 1982

Electroless plating is the continious formation of metallic coatings from metal ions by che-mical reduction without the use of electrical current. This is, however, more expansive than the conventional electroplating but is often used because of certain adventage. Here, general description of past research on electroless nickel plating, especially about the merits of each research was given. Part(Ⅰ) is for the conposition of solution, pretreatment and facilities of electroless nickel plating.

• 전기학회논문지
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• 제65권3호
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• pp.445-451
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• 2016

General fuse elements of solution for fast acting operation characteristics made using silver or silver alloy, those are not able to dominate cost competition to the advanced global leaders that have not only high technology but competitive price. In this study, the method that compose the fuse elements manufactured solution of fast acting operation characteristics by using precision multi-layer thin film plating and helical cutting process from low-priced copper metal. Furthermore, in order to move rated current line of fuse due to the heat loses, the manufacture construction method of fixed resistor is introduced, and then Ni-P plating layer and Sn plating layer are introduced multiply for controling fine opening time characteristics. So this study can establish the high productive and low-priced production method.