• 한국표면공학회지
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• 제12권3호
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• pp.161-166
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• 1979

Theoretical and practical aspects are investigated for electrochemical behavious, plating processes and the structures of electrodeposit of Pb-Sn binary alloy plating through numerous literatures in this report. The anodic and cathodic electrode reaction mechanisms of Pb and Sn could co-deposit and make Pb-Sn alloy deposit from the results of cathode current density-cathode potential curves of Pb, Sn and Pb-Sn alloys in fluoborate solutions. The compositions of the best alloy plating solutions are obtained for the purpose of bearing, anticorrosion and solder plating. In general, the casting anodes of Pb-Sn alloys are used, but separated anodes of Pb and Sn pure metal are used in order to obtain the fine compositions of Pb-Sn alloy deposits. The electrodeposits of Pb-Sn alloy are in nonequilibrium state and saturated solid solutions. Thus, ${\beta}$-phase (Sn-phase) is precipitated by heat treatment. The texture and structure of the electrodeposit are associated with the surface energies of deposit lattice planes and with the cathode polarization. The electrodeposit of Pb-Sn alloy is shown as lamellar structure.

• 전기학회논문지
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• 제65권3호
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• pp.445-451
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• 2016

General fuse elements of solution for fast acting operation characteristics made using silver or silver alloy, those are not able to dominate cost competition to the advanced global leaders that have not only high technology but competitive price. In this study, the method that compose the fuse elements manufactured solution of fast acting operation characteristics by using precision multi-layer thin film plating and helical cutting process from low-priced copper metal. Furthermore, in order to move rated current line of fuse due to the heat loses, the manufacture construction method of fixed resistor is introduced, and then Ni-P plating layer and Sn plating layer are introduced multiply for controling fine opening time characteristics. So this study can establish the high productive and low-priced production method.

• 한국인쇄학회지
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• 제18권2호
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• pp.133-141
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• 2000

Enhanced the value of badge good with the gold plating of emblem, sports pictogram, mascot in 2002 Asian Game and World Cup, applying the plating and coating technique to screen printing. In addition, tourist and characteristic goods were of great value and image of visual communication displayed outside. After the screen printing in the surface of stainless steel, it obtained the plate coloring of beautiful a black glossy with a black Ru plating. At the identical surface, it did that the electrodeposition coating process in order to making a conductor state of image areas and a nonconductor state of nonimage areas. After the electrodeposition process, it removed the printing ink of image areas with solvent. A manufacturing process, it removed the printing ink of image areas with solvent. A manufacturing process completed with copper, nickel and gold plating at bared metal surface.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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• pp.214-219
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• 2009

In high-efficiency crystalline silicon solar cells, If high-efficiency solar cells are to be commercialized. It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper and Silver are applied widely in various electronic manufactures as easily formation is available by plating. The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposite the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 14.68 % on $0.2{\sim}0.6{\Omega}{\cdot}cm,\;20{\times}20mm^2$, CZ(Czochralski) wafer.

• 한국전기전자재료학회논문지
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• 제23권7호
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• pp.575-579
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• 2010

The technologies of Ni/Cu plating contact is attributed to the reduced series resistance caused by a better contact conductivity of Ni with Si and the subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading was combined with the lower resistance of a metal silicide contact and an improved conductivity of the plated deposit. This improves the FF (fill factor) as the series resistance is reduced. This is very much requried in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A Selective emitter structure with highly dopeds regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing In this paper the formation of a selective emitter, and the nickel silicide seed layer at the front side metallization of silicon cells is considered. After generating the nickel seed layer the contacts were thickened by Cu LIP (light induced plating) and by the formation of a plated Ni/Cu two step metallization on front contacts. In fabricating a Ni/Cu plating metallization cell with a selective emitter structure it has been shown that the cell efficiency can be increased by at least 0.2%.

• 한국공작기계학회논문집
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• 제15권1호
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• pp.49-55
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• 2006

The effect of coating temperature with regard to surface properties of TiN-coated layer on hard metal(WC-Co) are experimentally investigated. Hardness, surface roughness, TiN coating thickness and adsorption force were measured in order to evaluate the effect of coating temperature. The two-way ANOVA method is used in order to evaluate the experimental data. In AIP processing, It is concluded that the furnace temperature in the range of $400^{\circ}C\~500^{\circ}C$ affected to a little increasing the number of production with the coating temperature.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권12호
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• pp.601-607
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• 2002

IPMC(Ionic Polymer Metal Composite)actuators were optimized for producing improved forces by changing multiple parameters including repetition of number of plating, surface electroding and additive(PVP)-treatment on reduction. The platinum electrode is deposited on the surface of the material where platinum particle stay in a dense form that appears to introduce a significant level of surface electrode resistance. Actuation tests were performed for such IPMC actuators under a low voltage. The test results show that the lower surface-electrode resistance generates higher actuation capability in the IPMC actuators. In order to investigate relaxation behavior of bending and repeatability in dry condition, the IPMC was coated by$rubber(KRATON^{TM})$to minimize the effect of water evaporation from IPMC. This actuator can be used in air with surface coating to avoid membrane drying.

• 한국분말재료학회지
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• 제29권6호
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• pp.511-516
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• 2022

Electroless plating is widely utilized in engineering for the metallization of insulator substrates, including polymers, glass, and ceramics, without the need for the application of external potential. Homogeneous nucleation of metals requires the presence of Sn-Pd catalysts, which significantly reduce the activation energy of deposition. Therefore, rinsing conducted during Sn sensitization and Pd activation is a key variable for the formation of a uniform seed layer without the lack or excess of catalysts. Herein, we report the optimized rinsing process for the functionalization of Sn-Pd catalysts, which enables the uniform FeCo metallization of the glass fibers. Rinsing enables good deposition of the FeCo alloy because of the removal of excess catalysts from the glass fiber. Concurrently, excessive rinsing results in a complete removal of the Sn-Pd nucleus. Collectively, the comprehensive study of the proposed nanomaterial preparation and surface science show that the metallization of insulators is a promising technology for electronics, solar cells, catalysts, and mechanical parts.

• 한국항행학회논문지
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• 제28권4호
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• pp.544-551
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• 2024

본 연구에서는 도금 공정 시뮬레이션에 필요한 전기화학적 분극 데이터와 도금 조건 시뮬레이션 및 도금층의 특성 평가에 대해 다루었다. Ni과 Cu의 동전위 분극 분석 및 정전류 분극 시험을 통해 얻은 전기화학적 분극 데이터는 도금액의 유동 조건에 따른 과전압 분포 변화를 관찰하는 데 사용되었다. 도금 조건 시뮬레이션에서는 랙 핀의 접점 위치와 개수가 도금 품질에 미치는 영향을 분석하기 위해 다양한 변수 하에서 전류 밀도 분포 및 도금 두께 분포를 평가하였다. 양극 형상, 극간 거리, 보조 양극 배치, 피도금체 간격 변화 등의 변수에 따른 시뮬레이션 결과를 통해 도금 두께 편차를 개선할 수 있는 방안을 모색하였다. 또한, 도금층의 특성 평가는 버퍼레이어 형성 유무에 따른 도금층의 두께, 밀착성 및 박리 여부를 분석하였다. 시뮬레이션을 통해 도금 공정의 효율성과 품질 향상을 위한 중요한 기초 데이터로 활용될 수 있다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.323-323
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• 2013

High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.