• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.96-98
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• 1999

유기전계발광소자(OELD)의 성능 향상을 위한 많은 연구가 진행되고 있지만 아직까지 금속전극과 유기발 광층 사이의 접촉저항(Contact Resistance)에 관한 연구는 거의 보고되지 않고 있다. Ohmic 접합에서 접촉 저항은 효율적이고 신뢰성 있는 소자제작에 있어서 간과되어서는 안될 매우 중요한 부분이다. 본 연구에서는 금속전극과 유기발광충 사이의 접촉저항에 관해서 논의하고자 한다. 본 연구에서 제작된 샘플은 금속전극으로 Ag, 유기발광재료로서 Alq$_3$를 사용하였으며, Alq3의 두께를 100 $\AA$에서 500 $\AA$까지 각각 다르게 하여 서로 다른 두께의 유기발광층을 가지는 샘플을 제작하였다. 금속전극의 매트릭스 구조에 의해 형성된 적선의 크기는 3 mm x 2 mm이며, 제작된 샘플의 접촉비저항은 TLM(Transmission Line Measurement) 방법을 이용하여 구하였다. Planar한 TLM model로부터 새로운 vertical model을 유추하였으며, 이를 근거로 접촉저항 및 transfer length 등을 계산하였다. 상온에서 측정된 전체 저항값은 유기발광층의 두께가 증가함 에 따라 증가하는 경향을 나타냈으며, 이 때 계산된 접촉비저항은 1.49$\times$$10^1$ $\Omega$-$\textrm{cm}^2$ 이다. 접촉저항은 전극 사이의 거리의 증가에 따라 증가하지만, 측정시간의 thermal budget의 영향으로 상대적으로 전체저항이 감 소하였으나, 저항감소분의 포화에 따라서, 거리에 비례하여 다시 저항이 증가하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.63-66
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• 1998

Prototype MFSFET′s using ferroelectric oxide LiNbO$_3$ as a gate insulator have been successfully fabricated with the help of 2 sheets of metal masks and demonstrated nonvolatile memory operations of the MFSFET′s. The estimated field-effect electron mobility and transconductance on a linear region of the fabricated FET were 600 $\textrm{cm}^2$/V.s and 0.16 mS/mm, respectively. The drain current of the "on" state was more than 4 orders of magnitude larger than the "off" state current at the same "read" gate voltage of 0.5 V, which means the memory operation of the MFSFET. A write voltage as low as $\pm$3 V, which is applicable to low power integrate circuits, was used for polarization reversal.

• Progress in Superconductivity and Cryogenics
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• v.13 no.4
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• pp.22-25
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• 2011

A single-coat $YBa_2Cu_3O_{7-{\delta}}$ (YBCO) film of high critical currents ($I_c$) could be successfully fabricated by optimizing the viscosity of the coating solution in the metal-organic deposition (MOD) process. From a Ba-deficient coating solution (Y: Ba: Cu = 1: 1.5: 3) having the viscosity of 212 $mPa{\cdot}sec$, 0.9 ${\mu}m$-thick single coat YBCO film with the $I_c$ value of 289 A/cm-width ($J_c$ = 3.2 MA/$cm^2$) at 77 K was achievable on the $SrTiO_3$ (STO) substrate, which was superior to that of our previous report for 0.8 ${\mu}m$-thick single coat YBCO film from a stoichiometric coating solution (Y: Ba: Cu = 1: 2: 3) on the $LaAlO_3$ (LAO) substrate. This result might be attributed to denser and more homogeneous microstrcuture in the case of the YBCO film from the Ba-deficient coating solution.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.6 s.261
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• pp.665-670
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• 2007

Alpha-phase alumina TGO(Thermally Grown Oxide) forms on the interface between zirconia top coat and bond coat of thermal barrier coating system for superalloys during exposure to high temperature over $1000^{\circ}C$. It is known to provide a good protection against hot corrosion and to cause surface failure such as rumpling and cracking due to difference in thermal expansion coefficient from the substrate metal and the lateral growth. Consequently, mechanical properties of the alumina TGO at the high temperature are the key parameters determining the integrity of TBC system. In this work, by using Fecralloy foils as the alumina forming substrate, creep tests and tensile tests have been performed with various TGO thicknesses$(h=0{\sim}4{\mu}m)$ and yttrium contents(0, 200ppm) at $1200^{\circ}C$. Displacement-time curves and load-displacement curves for each TGO thickness(h=1,2,..) were measured from the creep and tensile tests, respectively, and compared with the curves without TGO thickness(h=0). As the result, the intrinsic tensile and creep properties of TGO itself were determined.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.35.1-35.1
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• 2009

Vertically aligned zinc oxide (ZnO) nanorods (NRs) with different surface morphology were grown by metal organic chemical vapor deposition (MOCVD) on sapphire substrate. The films thus prepared were characterized by measuring X-ray diffraction (XRD), Scanning electron microscopy (SEM) and Transmission electron microscopy (TEM) studies. To study the effect of surface morphology on wettability, the contact angle (CA) of water was measured. It was demonstrated that the CA of the deposited ZnO NRs varied between $104^{\circ}$ and $135^{\circ}$ depending upon the surface morphology. Variable temperature photoluminescence (PL) have employed to probe the exciton recombination in high density and vertically aligned ZnO Nanorod arrays. The low-temperature PL characterizes the dominant near-band-edge excitonic emissions from such nanorod arrays.

• Journal of the Korean Vacuum Society
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• v.12 no.S1
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• pp.113-115
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• 2003

We investigate transmission of light in nanoscale structures. We present spatial and temporal domain measurements of the dephasing of surface plasmon excitations in metal films with periodic nano-hole arrays. By probing coherent spatial SP propagation lengths of a few f1. $\mu$m and an ultrafast decay of the SP polarization on a 10 fs timescale, we demonstrate that the SP transmission peaks are homogeneously broadened by the SP radiative lifetime. The pronounced wavelength and hole size dependence of the dephasing rate shows that the microscopic origin of the conversion of SP into light is a Rayleigh-like scattering by the periodic hole array. We have experimentally studied the dephasing of surface plasmon excitations in metallic nano-hole arrays. By relating nanoscopic SP propagation, ultrafast light transmission and optical spectra, we demonstrate that the transmission spectra of these plasmonic bandgap structures are homogeneously broadened. The spectral line shape and dephasing time are dominated by Rayleigh scattering of SP into light and can varied over a wide range by controlling the resonance energy and/or hole radius. This opens the way towards designing SP nano-optic devices and spatially and spectrally tailoring light -matter interactions on nanometer length scales.

• Journal of Ocean Engineering and Technology
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• v.13 no.1 s.31
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• pp.62-69
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• 1999

67Ni-22Cr-10Al-1Y and $ZrO_2-8Y_2O_3$ were coated on the substrate surface of ST304 and Al2024 by the plasma spraying method. The adgesion of the films varies depending on the substrates and the laminating method. In the case of STS304, the cracks were observed at thermal shock temperature difference ${Delta}T$ of $900^{circ}C$ in the non functionally gradient material(NFGM) and at $1100^{circ}C$ in the functionally gradient material(FGM). The film adhesion of the FGM is better than that of the NFGM in ST304. The cumulative AE count of the FGM of STS304 increased continuously at the bending test. But the NFGM of STS304 showed discontinuity of the AE count. The total AE count for the FGM of STS304 decreased as the number of thermal shock increased, and this tendency was evident as the thermal shock temperature difference increased.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2002.10a
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• pp.307-311
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• 2002

This study was investigated the photoelectrochemical behavior of STS304 steel with $TiO_2$ thin films coating, applied by sol-gel method, for the purpose of cathodic photoprotection of the steel corrosion. One time $TiO_2$-coated STS304 steel adopted two kinds of $TiO_2$ sol solution has the most dominant photopotential abilities, which was -200mV vs. SCE and -500mV vs. SCE under illumination with 40W fluorescent lamp, respectively. That was more negative than the corrosion potential of the bare metal(-150 mV). The bleaching of TCE was confirmed on $TiO_2$-coated STS304 under UV-illumination with 20 W Black-light. This Study was concluded that $TiO_2$-coated STS304 exhibited both a cathodic photoprotection effect against corrosion and photocatalytic self-cleaning effect.

• Journal of the Korean institute of surface engineering
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• v.43 no.3
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• pp.127-131
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• 2010

Adhesion of DLC film is very significant property that exhibits wear resistance, chemical inertness and high hardness when being deposited to metal substrate. This study was considered that change adhesion of DLC film produced by Plasma Enhanced Chemical Vapor Deposition can be presented through inserting interlayer (Cr, Si-C:H). The thickness of interlayer was result of changing adhesion and residual stress. It was showed that the maximum 12 N of adhesion is on DLC film of Cr interlayer, and that a tendency is to be increased residual stress depend on the thickness. DLC film of Si-C:H interlayer represented 16 N of adhesion at $1{\mu}m$, whereas adhesion is decreased when the thickness is increased. For the interlayer at multi-layer, it was the best that adhesion of Cr/Si-C:H/DLC film was 33 N. Si-C:H interlayer at DLC film controled adhesion of the whole film. It was relaxed the internal stress of DLC film produced by inserting Cr, Si-C:H interlayer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.149-153
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• 2003

Chemical mechanical polishing (CMP) technology for global planarization of multi-level inter-connection structure has been widely studied for the next generation devices. CMP process has been paid attention to planarized pre-metal dielectric (PMD), inter-layer dielectric (ILD) interconnections. Expecially, shallow trench isolation (STI) used to CMP process on essential. Recently, the direct STI-CMP process without the conventional complex reverse moat etch process has established by using slurry additive with the high selectivity between $SiO_2$ and $Si_3N_4$ films for the purpose of process simplification and n-situ end point detection(EPD). However, STI-CMP process has various defects such as nitride residue, tom oxide and damage of silicon active region. To solve these problems, in this paper, we studied the planarization characteristics using a high selectivity slurry(HSS). As our experimental results, it was possible to achieve a global planarization and STI-CMP process could be dramatically simplified. Also we estimated the reliability through the repeated tests with the optimized process conditions in order to identify the reproducibility of HSS STI-CMP process.