• 한국분말재료학회지
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• 제18권5호
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• pp.423-429
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• 2011

Thermoelectric-thick films were fabricated by using a screen printing process of n and p-type bismuth-telluride-based pastes. The screen-printed thick films have approximately 30 ${\mu}m$ in thickness and show rough surfaces yielding an empty gap between an electrode and the thick film. The gap might result in an increase of an electrical resistivity of the fabricated thick-film-type thermoelectric module. In this study, we suggest a conductive metal coating onto the surfaces of the screen-printed paste in order to reduce the contact resistance in the module. As a result, the electrical resistivity of the thermoelectric module having a gold coating layer was significantly reduced up to 30% compared to that of a module without any metal coating. This result indicates that an introduction of conductive metal layers is effective to decrease the contact resistivity of a thick-film-typed thermoelectric module processed by screen printing.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2017년도 춘계 학술논문 발표대회
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• pp.124-125
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• 2017

In this study, the shielding effectiveness of the Zn-Al arc thermal metal film coated cement-mortar mixed with copper powder by reflection, absorption, multi-reflection loss in 2.25~2.65 GHz was reviewed. By enhancing the mixing ratio of copper powder, the shielding effectiveness by absorption and multi-reflection loss was increased, but shielding rate(%) based on 80 dB showed below 20%. The Zn-Al arc thermal metal film coated on specimen, the shielding rate increased 3.5 times by reflection loss.

• 한국인쇄학회지
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• 제29권3호
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• pp.133-142
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• 2011

We produce a photosensitive convex plate to research a Nickel metal relief printing plate using galvanic process. A Method for preparing DLC convex plate that is metalized on Nickel metal relief printing plate using CVD(Chemical Vapor Deposition) process and $N_2DLC$-convex plate that is DLC metalized thin film layer of $N_2$ plasma surface treatment are comprised. DLC thin film layers on Nickel surface are fragile. The results of the research indicate that the coefficient of friction on DLC metalized thin film layer is relatively low than Nickel surface and the durability of Nickel surface coated DLC metalized thin film layer is superior to Nickel surface. A relative evaluation of three form plate wetting properties using varnish liquid-drop plate indicates superior printing aptitudes for $N_2DLC$, DLC, Nichel plate order as above.

• 한국광학회지
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• 제12권5호
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• pp.406-413
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• 2001

측면이 코어 가까이 연마된 단일모드 광섬유 위에 금속박막이 포함된 평면 도파로가 올려진 광섬유-평면도파로의 파장 및 편광 선택성에 관하여 이론 및 실험 결과를 보고한다. 금속 박막이 포함된 평면도파로의 특성을 구하기 위한 간단하지만 정확한 해석기법을 기술하였다. 소자를 1차원으로 등가화 시켜 결합모드 이론으로 소자의 거동을 분석하였다. 금속막의 두께와 최상부층 물질의 굴절률이 동작 특성에 미치는 영향을 측정하였고 그 결과는 설명 하였다.

• 대한전자공학회논문지SD
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• 제41권1호
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• pp.15-20
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• 2004

산화막위에 증착된 금속박막과 산화막과의 계면효과를 조사하였다. 산화막으로는 현재 반도체소자제조공정에 많이 사용되고 있는 BPSG 산화막과 PETEOS 산화막을 사용하였다. 이 두 종류의 산화막위에 적층구조의 금속박막을 형성한 후, 금속박막의 열처리에 의한 계면의 영향을 SEM (scanning electron microscopy), TEM (transmission electron microscopy), AES (auger electron spectroscopy)를 사용하여 조사하였다. BPSG 산화막위에 증착된 금속박막을 $650^{\circ}C$ 이상에서 RTP anneal을 한 경우, BPSG 산화막과 금속박막의 계면결합상태가 좋지 않았고, BPSG 산화막과 금속박막의 계면에 phosphorus가 축적된 영역을 확인하였다. 반면에 PETEOS 산화막위에 증착된 금속박막의 경우, RTP anneal 온도에 관계없이 계면결합상태는 좋았다. 본 연구에서 BPSG 산화막위에 금속박막을 증착할 경우 RTP anneal 온도는 $650^{\circ}C$ 보다 작게 하여야 함을 알 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.318.2-318.2
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• 2014

The high contact resistance is still one of the major issues to be resolved in CdS/CdTe thin film solar cells. CdTe/Metal Schottky contact induced a high contact resistance in CdS/CdTe solar cells. It has been reported that the work function of CdTe thin film is more than 5.7 eV. There has not been a suitable back contact metal, because CdTe thin film has a high work function. In a few decades, some buffer layer was reported to improve a back contact problem. Buffer layers which are Te, $Sb_2Te_3$, $Cu_2Te$, ZnTe:Cu and so on was inserted between CdTe and metal electrode. A formed buffer layers made a tunnel junction. Hole carriers which was excited in CdTe film by light absorption was transported from CdTe to back metal electrode. In this report, we reported the variation of solar cell performance with different buffer layer at the back contact of CdTe thin film solar cell.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.90-90
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• 2011

Transparent conducting oxide (TCO) films have been intensively utilized in the electric applications, such as, displays, lightings and solar cells due to the good electric conductivity with an excellent transmittance of the visible light. We, herein present an excellent Al-doped ZnO film (AZO), which has been fabricated by co-sputtering method. An as-deposited AZO film had an optical transmittance of 84.78% at 550 nm and a resistivity of $7.8{\times}10^{-3}{\Omega}cm$. A rapid annealing process significantly improved the optical transmittance and electrical resistivity of the AZO film to 99.67% and $1{\times}10^{-3}{\Omega}cm$, respectively. The fabricated AZO film was fabricated for a metal-semiconductor-metal (MSM) structure. The AZO film-embedding MSM device was highly responsive to a UV light.

• 한국재료학회지
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• 제29권11호
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• pp.715-719
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• 2019

Molybdenum is a low-resistivity transition metal that can be applied to silicon devices using Si-metal electrode structures and thin film solar cell electrodes. We investigate the deposition of metal Mo thin film by plasma-enhanced atomic layer deposition (PE-ALD). $Mo(CO)_6$ and $H_2$ plasma are used as precursor. $H_2$ plasma is induced between ALD cycles for reduction of $Mo(CO)_6$ and Mo film is deposited on Si substrate at $300^{\circ}C$. Through variation of PE-ALD conditions such as precursor pulse time, plasma pulse time and plasma power, we find that these conditions result in low resistivity. The resistivity is affected by Mo pulse time. We can find the reason through analyzing XPS data according to Mo pulse time. The thickness uniformity is affected by plasma power. The lowest resistivity is $176{\mu}{\Omega}{\cdot}cm$ at $Mo(CO)_6$ pulse time 3s. The thickness uniformity of metal Mo thin film deposited by PE-ALD shows a value of less than 3% below the plasma power of 200 W.

• 대한치과보철학회지
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• 제25권1호
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• pp.303-316
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• 1987

The purpose f this study was to evaluate the effect of resin film thickness on the tensile bond strength and to compare the tensile bond strengths of 4 differently treated metal surfaces. For the experiment, seventy metal specimens were cast with Verabond and divided into I, II, III, groups. The metal specimens in group I were electrolytically etched and cemented with Panavia under finger pressure. Cement film thickness was regulated with metal spacers. The metal specimens in Group II were treated by 4 methods, such as electrolytic etching method, salt-roughened method, EZ-oxisor method , chemical etching method and cemented with Panavia. In group III, electrolytically etched metal specimens were cemented with Hy-Bond. The etched surface of metal specimens and the cement film thickness were examined under the scanning electron microscope. Results were as follows; 1. The tensile bond strength showed no significant difference between $30{\mu}m,\;80{\mu}m,\;130{\mu}m$ film thicknessspecimens. 2. There was no significant difference in the tensile bond strength between the 4 differently treated metal specimens. 3. The tensile bond strength showed significant difference between Panavia and Hy-Bond. 4. Scanning electron microscope photograph revealed that tile interdendritic eutectic was removed in electrolytically etched metal surfaces hilt even dendritic arm was removed in Chemically etched metal surfaces. 5. The metal surfaces which were air-abraded with $50{\mu}m$ aluminum oxide showed roughness and small crack on scanning electron microscope photograph.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2011년도 제37회 추계학술대회논문집
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• pp.554-557
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• 2011

금속분말을 연료로 하는 연소기 개발에 있어 발생하는 문제점 중에 하나는 알루미나 slag 처리이다. 연소기 내부에 Water film을 형성시킴으로써 금속분말 연소기의 문제점을 해결할 수 있을 것으로 기대한다. 이를 위한 선행연구로 water film의 형성 조건에 대한 실험을 수행하였다. 실험 모델에 대하여 물 분사 속도가 증가할수록 원형 모델에 대한 water fim 각도가 작아져, 약 10 m/s이상에서 완전한 water film이 형성되는 것을 알 수 있었다.