• Title/Summary/Keyword: metal film

Search Result 2,171, Processing Time 0.041 seconds

A calculation on the Metal-Film Mixing by Intense Pulse Ion Beam (IPIB)

  • Le, X.Y.;Yan, S.;Zhao, W.J.;Wang, Y.G.;Xue, J.M.
    • Journal of the Korean Vacuum Society
    • /
    • v.12 no.S1
    • /
    • pp.74-78
    • /
    • 2003
  • In this paper, we studied, by numerical calculation, a system, which was composed of metal-film and metal-substrate irradiated by IPIB with beam ion energy 250 keV, current density 10 to 250 A/$\textrm{cm}^2$. While the IPIB irradiation was going on, an induced effect named mixing occurred. In this case, metal-film and part of metal-substrate melted and mixed. The mixing state was kept as it was in melting phase due to the fast cooling rate. Our works were simulating the heating and cooling process via our STEIPIB program and tried to find proper parameters for a specific film-substrate system, 500 nmtitanium film coated on aluminum, to get best mixing results. The parameters calculated for such Ti-Al system were compared with the experimental results and were in good accordance to the experimental results.

Surface Chemical Reactions for Metal Organic Semiconductor Films by Alternative Atomic Layer Deposition and Thermal Evaporation

  • Kim, Seong Jun;Min, Pok Ki;Lim, Jong Sun;Kong, Ki-Jeong;An, Ki-Seok
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2014.02a
    • /
    • pp.166.2-166.2
    • /
    • 2014
  • In this work, we demonstrated a facile and effective method for deposition of metal tetraphenylporphyrin (MTPP) thin film by a combined a thermal evaporation (TE) and atomic layer deposition (ALD). For the deposition of Zn-TPP thin film, Tetraphenylporphyrin (TPP) and diethyl zinc (DEZ) were used as organic and inorganic materials, respectively. Optimum conditions for the deposition of Zn-TPP thin film were established systematically: (1) the exposure time of DEZ as inorganic precursor and (2) the substrate temperature were adjusted, respectively. As a result, we verified that the surface reaction between organic semiconductor (TPP) and metal atom (Zn) was ALD process. In addition, we calculated activation energy by using Arrhenius equation for the substrate temperature versus area change rate of pyrrolic nitrogen. The surface and interface reactions between TPP with Zn were investigated by X-ray photoelectron spectroscopy, Raman spectroscopy, UV-vis spectroscopy, and scanning electron microscopy. These results show a facile and well-controllable fabrication technique for the metal-organic thin film for future electronic applications.

  • PDF

In situ growth of Mg-Al hydrotalcite film on AZ31 Mg alloy

  • Song, Yingwei;Chen, Jun;Shan, Dayong;Han, En-Hou
    • Proceedings of the Korean Institute of Surface Engineering Conference
    • /
    • 2012.11a
    • /
    • pp.12-13
    • /
    • 2012
  • An environmentally friendly method for in situ growth of Mg-Al hydrotalcite (HT) film on AZ31 magnesium alloy has been developed. The growth processes and corrosion resistance of the HT film were investigated. Then the HT film was surface modified by phytic acid solution to further improve the corrosion resistance. The film formation involves the dissolution of AZ31 substrate, adsorption of the ions from solution, nucleation of the precursor, followed by the dissolution of $Al^{3+}$, exchanging of $OH^-$ by $CO{_3}^{2-}$ and growth of the HT film. The HT film is very compact and acts as a barrier against $Cl^-$ attack in the early stage of corrosion, and then the surface of the film is dissolved gradually. This dense HT film can provide effective protection to the AZ31 alloy. The HT film with surface modification by phytic acid presents a self-healing feature and exhibits better corrosion resistance.

  • PDF

APPLICATION OF DISPROPORTIONATION REACTION TO SURFACE TREATMENT

  • Oki, Takeo
    • Journal of the Korean institute of surface engineering
    • /
    • v.29 no.5
    • /
    • pp.478-481
    • /
    • 1996
  • Disproportionation reaction is very important and interesting reaction to be applied to such surface treatment as metal, alloy, compound coating, a surface etching and so on. In gaseous system, the reaction of Al chloride is applied to Al and Al alloy coating, and the similar reaction of Ti chloride is also used for Ti, Ti alloy and Ti compound coating. As for aqueous system, this reaction is utilized to such metal coat as Sn etc. and metal etching such as Cu, Fe and so on. Also in molten salts system, this reaction has many application for surface treatment like metal, alloy and compound coatings for corrosion, wear, heat resistance and so forth. For instance, carbide film, nitride film, boride film, alloy film, quite new different film from the components of substrate material are coated in single and multiple component film system by the disproportionation reaction.

  • PDF

TPS Analysis of Various Metal Plates for Belt Source Evaporation in AMOLED Manufacturing

  • Hwang, Chang-Hun
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2007.08b
    • /
    • pp.1603-1606
    • /
    • 2007
  • The TPS (Temperature Programmed Sublimation) technology has been developed to monitor the plane evaporation of the organic films and introduced in SID2007, P53.[4] The Alq3 organic film is deposited on various metal surface such as Cu, Ti, Invar, STS to sublimate. The TPS signal confirms that the Alq3 film consists of nano scale film phase and bulk phase on all the metal plates. The sublimation temperature of the Alq3 film was much lower ($130^{\circ}C$) than the vapor temperature ($265^{\circ}$) of the Alq3 powder.

  • PDF

Metallizations and Electrical Characterizations of Low Resistivity Electrodes(Al, Ta, Cr) in the Amorphous Silicon Thin Film Transistor (비정질 실리콘 박막 트랜지스터 소자 특성 향상을 위한 저 저항 금속 박막 전극의 형성 및 전기적 저항 특성 평가)

  • Kim, Hyung-Taek
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 1993.05a
    • /
    • pp.96-99
    • /
    • 1993
  • Electrical properties of the Thin Film Transistor(TFT) electrode metal films were investigated through the Test Elements Group(TEG) experiment. The main purpose of this investigation was to characterize the electrical resistance properties of patterned metal films with respect to the variations of film thickness and TEG metal line width. Aluminum(Al), Tantalum(Ta) and Chromium(Cr) that are currently used as TFT electrode films were selected as the probed metal films. To date, no work in the electrical characterizations of patterned electrodes of a-Si TFT was accomplished. Bulk resistance$(R_b)$, sheet resistance$(R_s)$, and resistivities($\rho$) of TEG patterned metal lines were obtained. Electrical continuity test of metal film lines was also performed in order to investigate the stability of metallization process. Almost uniform-linear variations of the electrical properties with respect to the metal line displacements was also observed.

  • PDF

Electrical Properties of the Amorphous BaTi4O9 Thin Films for Metal-Insulator-Metal Capacitors (Metal-Insulator-Metal 캐패시터의 응용을 위한 비정질 BaTi4O9 박막의 전기적 특성)

  • Hong, Kyoung-Pyo;Jeong, Young-Hun;Nahm, Sahn;Lee, Hwack-Joo
    • Korean Journal of Materials Research
    • /
    • v.17 no.11
    • /
    • pp.574-579
    • /
    • 2007
  • Amorphous $BaTi_4O_9$ ($BT_4$) film was deposited on Pt/Si substrate by RF magnetron sputter and their dielectric properties and electrical properties are investigated. A cross sectional SEM image and AFM image of the surface of the amorphous $BT_4$ film deposited at room temperature showed the film was grown well on the substrate. The amorphous $BT_4$ film had a large dielectric constant of 32, which is similar to that of the crystalline $BT_4$ film. The leakage current density of the $BT_4$ film was low and a Poole-Frenkel emission was suggested as the leakage current mechanism. A positive quadratic voltage coefficient of capacitance (VCC) was obtained for the $BT_4$ film with a thickness of <70 nm and it could be due to the free carrier relaxation. However, a negative quadratic VCC was obtained for the films with a thickness ${\geq}96nm$, possibly due to the dipolar relaxation. The 55 nm-thick $BT_4$ film had a high capacitance density of $5.1fF/{\mu}m^2$ with a low leakage current density of $11.6nA/cm^2$ at 2 V. Its quadratic and linear VCCs were $244ppm/V^2$ and -52 ppm/V, respectively, with a low temperature coefficient of capacitance of $961ppm/^{\circ}C$ at 100 kHz. These results confirmed the potential suitability of the amorphous $BT_4$ film for use as a high performance metal-insulator-metal (MIM) capacitor.

Study on the Improvement of Physicochemical Properties of PEDOT-Metal Oxide Composite Thin Film by Vapor Phase Polymerization (기상중합법으로 제조된 Poly(3,4-ethylenedioxythiophene)(PEDOT)-금속산화물 복합 박막의 물리화학적 물성 향상에 관한 연구)

  • Nam, Mi-Rae;Yim, Jin-Heong
    • Polymer(Korea)
    • /
    • v.36 no.5
    • /
    • pp.599-605
    • /
    • 2012
  • The physicochemical properties such as surface hardness, solvent mechanical wear resistance, and resistance to scratch properties of poly(3,4-ethylenedioxythiophene) (PEDOT) thin film prepared by vapor phase polymerization (VPP) was effectively improved by post-treatment of various metal alkoxide sol solutions. Metal oxide layer derived from sol-gel process of metal alkoxide was generated on the PEDOT thin film layer by VPP, resulting in improving mechanical properties of the conductive thin films without any deterioration of their original surface resistance. Several kinds of silicone and titanium alkoxide derivatives with various functional groups were used as metal alkoxide sol sources. Among them, PEDOT-metal oxide composite thin film derived tetraethyl orthosilicate showed the best performance in the terms of surface resistance, transmittance, and various physicochemical properties. The effect of metal alkoxide content in washing solution, oxidant content and drying temperature have been investigated in order to optimize the various properties of PEDOT-metal oxide composite thin film.

Development and Application of Group IV Transition Metal Oxide Precursors

  • Kim, Da Hye;Park, Bo Keun;Jeone, Dong Ju;Kim, Chang Gyoun;Son, Seung Uk;Chung, Taek-Mo
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2014.02a
    • /
    • pp.303.2-303.2
    • /
    • 2014
  • The oxides of group IV transition metals such as titanium, zirconium, hafnium have many important current and future application, including protective coatings, sensors and dielectric layers in thin film electroluminescent (TFEL) devices. Recently, group IV transition metal oxide films have been intensively investigated as replacements for SiO2. Due to high permittivities (k~14-25) compared with SiO2 (k~3.9), large band-gaps, large band offsets and high thermodynamic stability on silicon. Herein, we report the synthesis of new group IV transition metal complexes as useful precursors to deposit their oxide thin films using chemical vapor deposition technique. The complexes were characterized by FT-IR, 1H NMR, 13C NMR and thermogravimetric analysis (TGA). Newly synthesised compounds show high volatility and thermal stability, so we are trying to deposit metal oxide thin films using the complexes by Atomic Layer Deposition (ALD).

  • PDF

Thin Film Micromachining Using Femtosecond Laser Photo Patterning of Organic Self-assembled Monolayers

  • Chang Won-Seok;Choi Moo-Jin;Kim Jae-Gu;Cho Sung-Hak;Whang Kyung-Hyun
    • International Journal of Precision Engineering and Manufacturing
    • /
    • v.7 no.1
    • /
    • pp.13-17
    • /
    • 2006
  • Self-Assembled Monolayers (SAMs) formed by alkanethiol adsorption to thin metal film are widely being investigated for applications as coating layer for anti-stiction or friction reduction and in fabrication of micro structure of molecules and bio molecules. Recently, there have been many researches on micro patterning using the advantages of very thin thickness and etching resistance of Self-Assembled Monolayers in selective etching of thin metal film. In this report, we present the several machining method to form the nanoscale structure by Mask-Less laser patterning using alknanethiolate Self-Assembled Monolayers such as thin metal film etching and heterogeneous SAM structure formation.