• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.2
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• pp.167-173
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• 2017

In this paper, the characterization of the vertical position of trapped charges in the charge-trap flash (CTF) memory is performed in the novel CTF memory cell with gate-all-around structure using technology computer-aided design (TCAD) simulation. In the CTF memories, injected charges are not stored in the conductive poly-crystalline silicon layer in the trapping layer such as silicon nitride. Thus, a reliable technique for exactly locating the trapped charges is required for making up an accurate macro-models for CTF memory cells. When a programming operation is performed initially, the injected charges are trapped near the interface between tunneling oxide and trapping nitride layers. However, as the program voltage gets higher and a larger threshold voltage shift is resulted, additional charges are trapped near the blocking oxide interface. Intrinsic properties of nitride including trap density and effective capture cross-sectional area substantially affect the position of charge centroid. By exactly locating the charge centroid from the charge distribution in programmed cells under various operation conditions, the relation between charge centroid and program operation condition is closely investigated.

• Geophysics and Geophysical Exploration
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• v.21 no.4
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• pp.213-219
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• 2018

In this study, we simulated 3D wave propagation modeling using a Xeon Phi x200 processor and compared the parallel computation performance with that using a Xeon CPU. Unlike the 1st generation Xeon Phi coprocessor codenamed Knights Corner, the 2nd generation x200 Xeon Phi processor requires no additional communication between the internal memory and the main memory since it can run an operating system directly. The Xeon Phi x200 processor can run large-scale computation independently, with the large main memory and the high-bandwidth memory. For comparison of parallel computation, we performed the modeling using the MPI (Message Passing Interface) and OpenMP (Open Multi-Processing) libraries. Numerical examples using the SEG/EAGE salt model demonstrated that we can achieve 2.69 to 3.24 times faster modeling performance using the Xeon Phi with a large number of computational cores and high-bandwidth memory compared to that using the 12-core CPU.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.53-53
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• 2009

Charge trap flash memory devices with modified tunneling barriers were fabricated using the tunneling barrier engineering technique. Variable oxide thickness (VARIOT) barrier and CRESTED barrier consisting of thin $SiO_2$ and $Si_3N_4$ dielectric layers were used as engineered tunneling barriers. The VARIOT type tunneling barrier composed of oxide-nitride-oxide (ONO) layers revealed reliable electrical characteristics; long retention time and superior endurance. On the other hand, the CRESTED tunneling barrier composed of nitride-oxide-nitride (NON) layers showed degraded retention and endurance characteristics. It is found that the degradation of NON barrier is associated with the increase of interface state density at tunneling barrier/silicon channel by programming and erasing (P/E) stress.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.40-43
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• 2000

The electrons and holes trapped in the tunneling oxide and interface-states generated in the Si/SiO$_2$ interface during program/erase (P/E) operations are known to cause reliability problems which can deteriorate the cell performance and cause the V$_{th}$ window close. This deterioration is caused by the accumulation of electrons and holes trapped in the oxide near the drain and source side after each P/E cycle. we propose three new erase schemes to improve the cell's endurance characteristics: (1)adding a Reverse soft program cycle after the source erase operation, (2)adding a detrapping cycle after the source erase operation, (3)adding a convergence cycle after the source erase operation. (3) is the most effective performance among the three erase schemes have been implemented and shown to significantly reduce the V$_{th}$ window close problem. And we are able to design the reliable periperal circuit of flash memory by using the (3).(3).

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.1
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• pp.210-215
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• 2009

In this study event-related optical signals were extracted from the prefrontal cortexes using functional near infrared spectroscopy while subjects were carrying out 2-back working memory tasks. Four events such as start, yes, no, and error were considered based on the onsets of the stimulus, positive true responses, positive false responses, and negative responses in the 2-back working memory task, respectively. The optical signals recorded were analyzed by peri-event histograms and power spectrum distributions. The results showed specific characteristics of the event-related optical neuronal signals and an opened possibility of an application to control a non-invasive brain-computer interface system or an object of a virtual reality.

• Journal of the Korean Vacuum Society
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• v.7 no.3
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• pp.195-200
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• 1998

We have investigated the crystal structure and electrical properties of Pt/SBT/$CeO_2$/Si(MFIS) and Pt/SBT/Si(MFS) structures for the gate oxide of ferroelectric memory. XRD spectra and SEM showed that the SBT film of SBT/$CeO_2$/Si structure had larger grain than that of SBT/Si structure. Furthermore HRTEM showed that SBT/$CeO_2$/Si had 5 nm thick $SiO_2$layer and very smooth interface but SBT/Si had 6nm thick $SiO_2$layer and 7nm thick amorphous intermediate interface. Therefore, $CeO_2$film between SBT film and Si substrate is confirmed as a good candidate for a diffusion barrier. The remanent polarization decreased and coercive voltage increased in Pt/SBT/$CeO_2/Pt/SiO_2$/Si structure. This effect may increase memory window of MFIS structure directly related to the coercive voltage. From the capacitance-voltage characteristics, the memory of Pt/SBT(140 nm)/$CeO_2$(25 nm)/Si structure were in the range of 1~2 V at the applied voltage of 4~6 V. The memory window increased with the thickness of SBT film. These results may be due to voltage applied at SBT films. The leakage currents of Pt/SBT/$CeO_2$/Si and Pt/SBT/Si were $ 10^8A/\textrm{cm}^2$ and $ 10^6 A/\textrm{cm}^2$, respectively.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.11C
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• pp.1171-1177
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• 2002

In this paper, we proposed a high speed IP(Internet Protocol) packet forwarding engine of ATM(Asynchronous Transfer Mode) based label edge routers for POS(Packet over SONET) interface. The forwarding engine uses TCAM(Ternary Content Addressable Memory) for high performance lookup processing of the packet received from POS interface. We have accomplished high speed IP packet forwarding in hardware by implementing the functions of high speed IP header Processing and lookup control into FPGA(Field Programmable Gate Array). The proposed forwarding engine has the functions of label edge routers as the lookup controller supports MPLS(Multiprotocol Label Switching) packet processing functionality.

• Korean Journal of Materials Research
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• v.22 no.8
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• pp.385-389
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• 2012

Significant improvements in the switching voltage distribution are required for the development of unipolar resistive memory devices using $MnO_x$ thin films. The $V_{set}$ of the as-grown $MnO_x$ film ranged from 1 to 6.2 V, whereas the $V_{set}$ of the oxygen-annealed film ranged from 2.3 to 3 V. An excess of oxygen in an $MnO_x$ film leads to an increase in $Mn^{4+}$ content at the $MnO_x$ film surface with a subsequent change in the $Mn^{4+}/Mn^{3+}$ ratio at the surface. This was attributed to the change in $Mn^{4+}/Mn^{3+}$ ratios at the $MnO_x$ surface and to grain growth. Oxygen annealing is a possible solution for improving the switching voltage distribution of $MnO_x$ thin films. In addition, crystalline $MnO_x$ can help stabilize the $V_{set}$ and $V_{reset}$ distribution in memory switching in a Ti/$MnO_x$/Pt structure. The improved uniformity was attributed not only to the change of the crystallinity but also to the redox reaction at the interface between Ti and $MnO_x$.

• Transactions on Electrical and Electronic Materials
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• v.17 no.1
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• pp.25-28
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• 2016

We investigate the effect of interface states on the endurance of a charge trap flash (CTF) NOR array using charge pumping methods. The endurance test was completed from one cell selected randomly from 128 bit cells, where the memory window value after 10² program/erase (P/E) cycles decreased slightly from 2.2 V to 1.7 V. However, the memory window closure abruptly accelerated after 10³ P/E cycles or more (i.e. 0.97 V or 0.7 V) due to a degraded programming speed. On the other hand, the interface trap density (Nit) gradually increased from 3.13×10¹¹ cm⁻² for the initial state to 4×10¹² cm⁻² for 10² P/E cycles. Over 10³ P/E cycles, the Nit increased dramatically from 5.51×10¹² cm⁻² for 10³ P/E cycles to 5.79×10¹² cm⁻² for 10⁴ P/E cycles due to tunnel oxide damages. These results show good correlation between the interface traps and endurance degradation of CTF devices in actual flash cell arrays.

• Journal of Internet Computing and Services
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• v.15 no.2
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• pp.143-147
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• 2014

In this paper, a novel MDI(Multiplex Distribution Interface) analyzer is designed in Ethernet-mode for DRM(Digital Radio Mondiale), and DRM+(Digital Radio Mondiale Plus) systems. The proposed MDI analyzer can reduce the overload of MDI packets by using memory sharing techniques into a common module block. In consequence, it verifies the received MDI packets by composition information of IP(Internet Protocol) and FAC(Fast Access Channel)/SDC(Service Description Channel) in DRM/DRM+ systems for the next generation digital radio broadcasting systems.